ATE476685T1 - Nanoimprintlithographiemethode unter benutzung einer form mit einer wärmeerzeugenden region - Google Patents
Nanoimprintlithographiemethode unter benutzung einer form mit einer wärmeerzeugenden regionInfo
- Publication number
- ATE476685T1 ATE476685T1 AT04743806T AT04743806T ATE476685T1 AT E476685 T1 ATE476685 T1 AT E476685T1 AT 04743806 T AT04743806 T AT 04743806T AT 04743806 T AT04743806 T AT 04743806T AT E476685 T1 ATE476685 T1 AT E476685T1
- Authority
- AT
- Austria
- Prior art keywords
- die
- mass
- polymeric material
- mold
- heat generating
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 2
- 238000001127 nanoimprint lithography Methods 0.000 title 1
- 238000010438 heat treatment Methods 0.000 abstract 2
- 230000002123 temporal effect Effects 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/02—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C99/00—Subject matter not provided for in other groups of this subclass
- B81C99/0075—Manufacture of substrate-free structures
- B81C99/0085—Manufacture of substrate-free structures using moulds and master templates, e.g. for hot-embossing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
- B81C2201/0147—Film patterning
- B81C2201/015—Imprinting
- B81C2201/0153—Imprinting techniques not provided for in B81C2201/0152
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/03—Processes for manufacturing substrate-free structures
- B81C2201/036—Hot embossing
Landscapes
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Engineering (AREA)
- Theoretical Computer Science (AREA)
- Mathematical Physics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
- Printing Plates And Materials Therefor (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT000473A ITTO20030473A1 (it) | 2003-06-23 | 2003-06-23 | Procedimento litografico di nanoimpressione che prevede l'utilizzo di uno stampo presentante una regione atta a |
| PCT/IB2004/002120 WO2004114017A1 (en) | 2003-06-23 | 2004-06-22 | A nano impression lithographic process which involves the use of a die having a region able to generate heat |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE476685T1 true ATE476685T1 (de) | 2010-08-15 |
Family
ID=33524062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT04743806T ATE476685T1 (de) | 2003-06-23 | 2004-06-22 | Nanoimprintlithographiemethode unter benutzung einer form mit einer wärmeerzeugenden region |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8409488B2 (de) |
| EP (1) | EP1639411B1 (de) |
| AT (1) | ATE476685T1 (de) |
| DE (1) | DE602004028475D1 (de) |
| DK (1) | DK1639411T3 (de) |
| IT (1) | ITTO20030473A1 (de) |
| WO (1) | WO2004114017A1 (de) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI243796B (en) * | 2004-06-08 | 2005-11-21 | Ind Tech Res Inst | Device of nano-structure imprint for pattern transfer and method of the same |
| FR2876193B1 (fr) * | 2004-10-04 | 2007-01-26 | Commissariat Energie Atomique | Dispositif nanoimprime comportant des motifs metalliques et procede de nanoimpression de motifs metalliques |
| JP4554330B2 (ja) * | 2004-10-21 | 2010-09-29 | 株式会社リコー | 高耐久性を有する断熱スタンパ構造 |
| FR2950043B1 (fr) | 2009-09-17 | 2011-10-14 | Commissariat Energie Atomique | Moule pour la lithographie par nanoimpression thermique, son procede de preparation, et procede de nanoimpression thermique le mettant en ?uvre. |
| CN101829772B (zh) * | 2010-05-26 | 2011-11-02 | 浙江大学 | 金属玻璃微构件的热塑性成型加工方法 |
| FR2964338B1 (fr) * | 2010-09-07 | 2012-10-05 | Commissariat Energie Atomique | Moule pour la lithographie par nano-impression thermique, son procede de preparation, et procede de nano-impression thermique le mettant en ?uvre. |
| US9498918B2 (en) | 2012-09-18 | 2016-11-22 | Ev Group E. Thallner Gmbh | Method and device for embossing |
| WO2015023683A1 (en) * | 2013-08-12 | 2015-02-19 | Tufts University | Micro forming devices and systems and uses thereof |
| DE102015009982A1 (de) | 2015-07-31 | 2017-02-02 | Giesecke & Devrient Gmbh | Prägestempel für die Nanoprägelithographie |
| TWI628062B (zh) * | 2016-03-17 | 2018-07-01 | 欣興電子股份有限公司 | 線路板的製作方法與感壓印模 |
| CN116722368A (zh) * | 2023-06-25 | 2023-09-08 | 北京信息科技大学 | 一种超表面结构及其制备方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1864666A (en) | 1930-04-04 | 1932-06-28 | John F Osborne | Electric mold |
| US2210583A (en) | 1939-03-04 | 1940-08-06 | Owens Illinois Glass Co | Mold |
| US3387333A (en) | 1965-01-27 | 1968-06-11 | Lockheed Aircraft Corp | Electrically heated mold |
| EP0244496B1 (de) * | 1986-05-06 | 1991-01-16 | Ibm Deutschland Gmbh | Maske für die Ionen-, Elektronen- oder Röntgenstrahllithographie und Verfahren zur ihrer Herstellung |
| US5064597A (en) * | 1988-03-30 | 1991-11-12 | General Electric Company | Method of compression molding on hot surfaces |
| JPH0580530A (ja) * | 1991-09-24 | 1993-04-02 | Hitachi Ltd | 薄膜パターン製造方法 |
| US5261806A (en) | 1992-02-26 | 1993-11-16 | Pleasant Ronald E | Electrically heated mold insert |
| US5772905A (en) | 1995-11-15 | 1998-06-30 | Regents Of The University Of Minnesota | Nanoimprint lithography |
| US6517995B1 (en) | 1999-09-14 | 2003-02-11 | Massachusetts Institute Of Technology | Fabrication of finely featured devices by liquid embossing |
| US6755984B2 (en) * | 2002-10-24 | 2004-06-29 | Hewlett-Packard Development Company, L.P. | Micro-casted silicon carbide nano-imprinting stamp |
| WO2004058479A1 (en) | 2002-12-31 | 2004-07-15 | Shinill Kang | Molding system for molding micro pattern structure having micro heating element and method for fabricating mold insert for molding micro pattern structure used therein |
-
2003
- 2003-06-23 IT IT000473A patent/ITTO20030473A1/it unknown
-
2004
- 2004-06-22 DK DK04743806.4T patent/DK1639411T3/da active
- 2004-06-22 DE DE602004028475T patent/DE602004028475D1/de not_active Expired - Lifetime
- 2004-06-22 US US10/562,014 patent/US8409488B2/en not_active Expired - Fee Related
- 2004-06-22 WO PCT/IB2004/002120 patent/WO2004114017A1/en not_active Ceased
- 2004-06-22 AT AT04743806T patent/ATE476685T1/de active
- 2004-06-22 EP EP04743806A patent/EP1639411B1/de not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US8409488B2 (en) | 2013-04-02 |
| WO2004114017A1 (en) | 2004-12-29 |
| EP1639411B1 (de) | 2010-08-04 |
| DE602004028475D1 (de) | 2010-09-16 |
| ITTO20030473A1 (it) | 2004-12-24 |
| DK1639411T3 (da) | 2010-11-22 |
| US20070063390A1 (en) | 2007-03-22 |
| EP1639411A1 (de) | 2006-03-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| UEP | Publication of translation of european patent specification |
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