ATE476862T1 - Hf-schaltung mit gestapelten leiterplatten - Google Patents

Hf-schaltung mit gestapelten leiterplatten

Info

Publication number: ATE476862T1
Authority: AT; Austria
Prior art keywords: circuit; stacked; boards; tuner; mixer
Prior art date: 2004-01-14

Application number

AT04797607T

Other languages

English (en)

Inventor

Tiam Tey

Lye Lum

Feng Lin

Original Assignee

Thomson Licensing

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2004-01-14

Filing date

2004-11-04

Publication date

2010-08-15

2004-11-04 Application filed by Thomson Licensing filed Critical Thomson Licensing

2010-08-15 Application granted granted Critical

2010-08-15 Publication of ATE476862T1 publication Critical patent/ATE476862T1/de

Links

239000000758 substrate Substances 0.000 abstract 4

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Structure Of Receivers (AREA)
Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Filters And Equalizers (AREA)

AT04797607T 2004-01-14 2004-11-04 Hf-schaltung mit gestapelten leiterplatten ATE476862T1 (de)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
EP04300020A EP1555864A1 (de)	2004-01-14	2004-01-14	HF-Baugruppe mit gestapelten Leiterplatten
PCT/EP2004/012481 WO2005069709A1 (en)	2004-01-14	2004-11-04	Rf circuit with stacked printed circuit boards

Publications (1)

Publication Number	Publication Date
ATE476862T1 true ATE476862T1 (de)	2010-08-15

Family

ID=34610243

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
AT04797607T ATE476862T1 (de)	2004-01-14	2004-11-04	Hf-schaltung mit gestapelten leiterplatten

Country Status (6)

Country	Link
US (1)	US7725095B2 (de)
EP (2)	EP1555864A1 (de)
CN (2)	CN2768314Y (de)
AT (1)	ATE476862T1 (de)
DE (1)	DE602004028516D1 (de)
WO (1)	WO2005069709A1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN1945970B (zh) *	2005-10-08	2010-08-11	Thomson宽带研发（北京）有限公司	调谐器组件
KR101090066B1 (ko) *	2007-05-14	2011-12-07	삼성전자주식회사	방송신호 수신장치
US20100203922A1 (en) *	2009-02-10	2010-08-12	Knecht Thomas A	Time Division Duplex Front End Module
CN102056448B (zh) *	2009-11-04	2013-02-27	环旭电子股份有限公司	电子模组
US8254862B2 (en) *	2009-12-29	2012-08-28	Silicon Laboratories Inc.	Configurable radio front end
JP4858733B1 (ja) *	2010-10-06	2012-01-18	横浜ゴム株式会社	送信装置
WO2012094274A1 (en) *	2011-01-04	2012-07-12	Technicolor Usa, Inc.	Set back box
US8818309B2 (en)	2011-03-28	2014-08-26	Silicon Laboratories Inc.	Providing multiple inductors for a radio tuner
JP5803961B2 (ja) *	2013-03-21	2015-11-04	株式会社豊田自動織機	基板間隔保持部材及びインバータ装置
GB2518476B (en)	2013-09-20	2015-11-04	Silicon Lab Inc	Multi-chip modules having stacked television demodulators
BR112016010823B1 (pt) *	2013-11-12	2023-04-11	Interdigital Ce Patent Holdings	Dispositivo e decodificador de sinais
US10390423B1 (en)	2018-05-08	2019-08-20	International Business Machines Corporation	Crosstalk mitigation for PCB to die transition in superconducting devices

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5007841A (en) *	1983-05-31	1991-04-16	Trw Inc.	Integrated-circuit chip interconnection system
JPS6192039A (ja) *	1984-10-11	1986-05-10	Matsushita Electric Ind Co Ltd	Ｒｆ復調装置とその製造方法
JPH0346827A (ja) *	1989-07-14	1991-02-28	Matsushita Electric Ind Co Ltd	テレビジョンチューナ
US5049084A (en) *	1989-12-05	1991-09-17	Rogers Corporation	Electrical circuit board interconnect
GB9017078D0 (en) *	1990-08-03	1990-09-19	Marconi Space Systems Limited	Hybrid frame
JP2663823B2 (ja) *	1993-01-29	1997-10-15	松下電器産業株式会社	高周波装置
JPH0997993A (ja) *	1995-09-29	1997-04-08	Matsushita Electric Ind Co Ltd	高周波装置
EP0812066A4 (de) *	1995-12-25	1999-03-24	Matsushita Electric Industrial Co Ltd	Hochfrequenz gerät
CN1306349A (zh) *	2000-04-11	2001-08-01	深圳市中兴通讯股份有限公司	一种通用卫星数据广播接收系统
JP3582460B2 (ja) *	2000-06-20	2004-10-27	株式会社村田製作所	高周波モジュール
JP2002152063A (ja) *	2000-11-15	2002-05-24	Murata Mfg Co Ltd	デジタル放送受信部
US6653885B2 (en) *	2001-05-03	2003-11-25	Peregrine Semiconductor Corporation	On-chip integrated mixer with balun circuit and method of making the same
JP2003140773A (ja) *	2001-10-31	2003-05-16	Toshiba Corp	無線通信デバイスおよび情報処理装置
US7050765B2 (en) *	2003-01-08	2006-05-23	Xytrans, Inc.	Highly integrated microwave outdoor unit (ODU)
US20050124307A1 (en) *	2003-12-08	2005-06-09	Xytrans, Inc.	Low cost broadband wireless communication system
JP2006024087A (ja) *	2004-07-09	2006-01-26	Nec Corp	無線デバイス、その製造方法、その検査方法及び検査装置並びに無線装置及びその製造方法
JP4521602B2 (ja) *	2005-06-06	2010-08-11	ルネサスエレクトロニクス株式会社	マルチモード高周波回路
US20070207734A1 (en) *	2006-02-17	2007-09-06	International Rectifier Corporation	Wireless communication between control devices and controlled devices within a common board and rf high side coupler with plane polarized antenna
US20080136559A1 (en) *	2006-12-08	2008-06-12	Wataru Takahashi	Electronic device and rf module

2004
- 2004-01-14 EP EP04300020A patent/EP1555864A1/de not_active Withdrawn
- 2004-07-19 CN CNU2004200659735U patent/CN2768314Y/zh not_active Expired - Fee Related
- 2004-11-04 AT AT04797607T patent/ATE476862T1/de not_active IP Right Cessation
- 2004-11-04 EP EP04797607A patent/EP1719395B1/de not_active Expired - Lifetime
- 2004-11-04 WO PCT/EP2004/012481 patent/WO2005069709A1/en not_active Ceased
- 2004-11-04 CN CN2004800403793A patent/CN1918955B/zh not_active Expired - Fee Related
- 2004-11-04 DE DE602004028516T patent/DE602004028516D1/de not_active Expired - Lifetime
- 2004-11-04 US US10/586,292 patent/US7725095B2/en not_active Expired - Fee Related

Also Published As

Publication number	Publication date
CN1918955A (zh)	2007-02-21
EP1719395A1 (de)	2006-11-08
CN2768314Y (zh)	2006-03-29
US7725095B2 (en)	2010-05-25
US20070115359A1 (en)	2007-05-24
EP1719395B1 (de)	2010-08-04
DE602004028516D1 (de)	2010-09-16
EP1555864A1 (de)	2005-07-20
CN1918955B (zh)	2010-05-12
WO2005069709A1 (en)	2005-07-28

Legal Events

Date	Code	Title	Description
2011-02-15	RER	Ceased as to paragraph 5 lit. 3 law introducing patent treaties

Publication	Publication Date	Title
EP1478023A4 (de)	2008-12-31	Modulteil
ATE476862T1 (de)	2010-08-15	Hf-schaltung mit gestapelten leiterplatten
BR0100051A (pt)	2002-09-24	Dispositivo eletrônico
WO2007027242A3 (en)	2007-04-19	Electroluminescent panel with inkjet-printed electrode regions
EP1921675A4 (de)	2010-09-22	Leiterplatte und diese verwendendes halbleitermodul, herstellungsverfahren für eine leiterplatte
TW200728792A (en)	2007-08-01	Image pickup device mounting structure
TW200629618A (en)	2006-08-16	Electronic devices and processes for forming electronic devices
WO2006055478A3 (en)	2006-08-10	Rfid tag in a printed circuit board
TW200740330A (en)	2007-10-16	Printed circuit board and manufacturing method thereof
US7375952B2 (en)	2008-05-20	Electronic device with a sliding element
US7701727B2 (en)	2010-04-20	Portable electronic device
WO2009069987A3 (en)	2009-08-20	Printed circuit board and method for manufacturing the same, and panel for manufacturing the printed circuit board
EP1986073A3 (de)	2013-01-23	Elektronisches Gerät
TW200708239A (en)	2007-02-16	Electronic system
ATE513452T1 (de)	2011-07-15	Elektronisches gerät mit flipmodul mit geringer höhe
FR2877537B1 (fr)	2007-05-18	Boitier microelectronique multiplans
WO2007078924A3 (en)	2007-08-30	Printed circuit board waveguide
US20120018209A1 (en)	2012-01-26	Printed circuit board
TW200706098A (en)	2007-02-01	An electronic device with sliding type heatsink
TW200709357A (en)	2007-03-01	Electronic board and manufacturing method thereof, electro-optical device, and electronic apparatus
EP1747704A4 (de)	2011-10-12	Leiterplatte, herstellungsverfahren und elektronische einrichtung
US20090255718A1 (en)	2009-10-15	Printed circuit board
US20070074898A1 (en)	2007-04-05	Pads for printed circuit board
TW200623973A (en)	2006-07-01	Printed circuit board for preventing electro-static discharge
US20090268421A1 (en)	2009-10-29	Shielding assembly