ATE478104T1 - Festpulverformulierungen für die zubereitung von harzbeschichteten folien und ihre verwendung bei der herstellung von leiterplatten - Google Patents

Festpulverformulierungen für die zubereitung von harzbeschichteten folien und ihre verwendung bei der herstellung von leiterplatten

Info

Publication number
ATE478104T1
ATE478104T1 AT07024111T AT07024111T ATE478104T1 AT E478104 T1 ATE478104 T1 AT E478104T1 AT 07024111 T AT07024111 T AT 07024111T AT 07024111 T AT07024111 T AT 07024111T AT E478104 T1 ATE478104 T1 AT E478104T1
Authority
AT
Austria
Prior art keywords
circuit boards
preparation
production
solid powder
resin coated
Prior art date
Application number
AT07024111T
Other languages
English (en)
Inventor
Juergen Kress
Stephan Tusl
Sandro Cicchetti
Thierry Becret
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Application granted granted Critical
Publication of ATE478104T1 publication Critical patent/ATE478104T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K21/00—Fireproofing materials
    • C09K21/14—Macromolecular materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/304—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/03—Powdery paints
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
AT07024111T 2007-12-12 2007-12-12 Festpulverformulierungen für die zubereitung von harzbeschichteten folien und ihre verwendung bei der herstellung von leiterplatten ATE478104T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP20070024111 EP2070962B1 (de) 2007-12-12 2007-12-12 Festpulverformulierungen für die Zubereitung von harzbeschichteten Folien und ihre Verwendung bei der Herstellung von Leiterplatten

Publications (1)

Publication Number Publication Date
ATE478104T1 true ATE478104T1 (de) 2010-09-15

Family

ID=39166415

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07024111T ATE478104T1 (de) 2007-12-12 2007-12-12 Festpulverformulierungen für die zubereitung von harzbeschichteten folien und ihre verwendung bei der herstellung von leiterplatten

Country Status (9)

Country Link
US (1) US20100310849A1 (de)
EP (1) EP2070962B1 (de)
JP (1) JP5459868B2 (de)
KR (1) KR101562228B1 (de)
CN (1) CN101896529B (de)
AT (1) ATE478104T1 (de)
DE (1) DE602007008593D1 (de)
TW (1) TWI449474B (de)
WO (1) WO2009074303A1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011068644A1 (en) 2009-12-02 2011-06-09 Dow Global Technologies Inc. Epoxy resin compositions
SG181486A1 (en) 2009-12-02 2012-07-30 Dow Global Technologies Llc Coating compositions
EP2507285A2 (de) 2009-12-02 2012-10-10 Dow Global Technologies LLC Verbundstoffzusammensetzungen
JP5413382B2 (ja) * 2011-02-15 2014-02-12 Ｔｄｋ株式会社 電子部品内蔵モジュールの製造方法
EP3048132A1 (de) * 2011-02-16 2016-07-27 Mitsubishi Rayon Co., Ltd. Prepreg und faserverstärktes verbundmaterial
CN104962040B (zh) * 2015-07-13 2018-01-19 江苏中鹏新材料股份有限公司 一种提高环氧树脂组合物玻璃化转变温度的方法
GB201910407D0 (en) * 2019-07-19 2019-09-04 Hexcel Composites Ltd Prepreg or semipreg precursor and method of manufacturing same

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1288189C (en) * 1986-01-20 1991-08-27 Glenda C. Young Epoxy resin composition
WO1998044017A1 (fr) * 1997-03-27 1998-10-08 Mitsubishi Rayon Co., Ltd. Composition de resine epoxyde pour plastique renforce de fibre de verre, preimpregne et moulage tubulaire produit au moyen de cette composition
JP2000080251A (ja) * 1998-09-03 2000-03-21 Matsushita Electric Works Ltd リン変性難燃性エポキシ樹脂組成物およびその製造方法およびそのリン変性難燃性エポキシ樹脂組成物を用いた成形品および積層体
US20010003771A1 (en) * 1999-03-03 2001-06-14 Chun-Shan Wang Phosphorus-containing flame-retardant cured epoxy resins
JP2000344916A (ja) * 1999-06-04 2000-12-12 Sumitomo Bakelite Co Ltd 難燃性プリプレグ及び積層板
JP2001002960A (ja) * 1999-06-16 2001-01-09 Sumitomo Durez Co Ltd 難燃性エポキシ樹脂粉体塗料
JP3620426B2 (ja) 2000-08-23 2005-02-16 新神戸電機株式会社 難燃性エポキシ樹脂組成物を用いたプリプレグ、積層板及びプリント配線板
JP2002080565A (ja) * 2000-09-08 2002-03-19 Mitsui Chemicals Inc 高耐熱難燃性樹脂組成物及びその加工部品
JP2002171074A (ja) * 2000-12-04 2002-06-14 Toshiba Chem Corp ビルドアップ型多層プリント配線板とそれに用いる樹脂組成物および樹脂フィルム
JP4036011B2 (ja) * 2002-02-26 2008-01-23 日立化成工業株式会社 難燃性熱硬化樹脂組成物，それを用いたプリプレグ及び電気配線板用積層板
JP2004256648A (ja) * 2003-02-26 2004-09-16 Kyocera Chemical Corp エポキシ樹脂組成物および半導体封止装置
TWI392713B (zh) 2003-03-26 2013-04-11 Atotech Deutschland Gmbh 粉體塗料及在製造印刷電路板中製備薄層的方法
JP4411876B2 (ja) * 2003-06-23 2010-02-10 東レ株式会社 半導体装置用接着剤組成物およびそれを用いた接着剤シート及びカバーレイフィルム並びに銅張りポリイミドフィルム
TW200516126A (en) * 2003-06-23 2005-05-16 Toray Industries Adhesive composition for semiconductor devices, coverlay films, adhesive sheets and copper-clad polyimide films using the composition
US20080160860A1 (en) * 2004-03-02 2008-07-03 Toray Industries, Inc. Epoxy Resin Composition for Fiber-Reinforced Composite Material, Prepreg, and Fiber-Reinforced Composite Material
DE102005015605B4 (de) * 2005-04-05 2008-04-17 Schill + Seilacher "Struktol" Aktiengesellschaft Phosphororganische Verbindungen enthaltende Prepolymere und Verwendungen dafür
TWI274067B (en) * 2005-10-13 2007-02-21 Chang Chun Plastics Co Ltd Flame-retarding epoxy resin composition containing no halogen

Also Published As

Publication number Publication date
DE602007008593D1 (de) 2010-09-30
WO2009074303A8 (en) 2009-08-20
US20100310849A1 (en) 2010-12-09
JP2011507985A (ja) 2011-03-10
CN101896529A (zh) 2010-11-24
EP2070962A1 (de) 2009-06-17
EP2070962B1 (de) 2010-08-18
JP5459868B2 (ja) 2014-04-02
KR101562228B1 (ko) 2015-10-21
TW200942093A (en) 2009-10-01
WO2009074303A1 (en) 2009-06-18
CN101896529B (zh) 2013-01-02
TWI449474B (zh) 2014-08-11
KR20100121465A (ko) 2010-11-17

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