ATE478169T1 - Vorrichtung und verfahren zur chemischen und elektrolytischen behandlung von werkstücken - Google Patents

Vorrichtung und verfahren zur chemischen und elektrolytischen behandlung von werkstücken

Info

Publication number
ATE478169T1
ATE478169T1 AT05772234T AT05772234T ATE478169T1 AT E478169 T1 ATE478169 T1 AT E478169T1 AT 05772234 T AT05772234 T AT 05772234T AT 05772234 T AT05772234 T AT 05772234T AT E478169 T1 ATE478169 T1 AT E478169T1
Authority
AT
Austria
Prior art keywords
conveyor system
work pieces
workpieces
chemical
holding element
Prior art date
Application number
AT05772234T
Other languages
English (en)
Inventor
Reinhard Schneider
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Application granted granted Critical
Publication of ATE478169T1 publication Critical patent/ATE478169T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C23C18/1632—Features specific for the apparatus, e.g. layout of cells and of its equipment, multiple cells
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C23C18/1628—Specific elements or parts of the apparatus
    • C23C18/163—Supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Intermediate Stations On Conveyors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • ing And Chemical Polishing (AREA)
AT05772234T 2004-07-01 2005-06-30 Vorrichtung und verfahren zur chemischen und elektrolytischen behandlung von werkstücken ATE478169T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102004032659A DE102004032659B4 (de) 2004-07-01 2004-07-01 Vorrichtung und Verfahren zum chemischen oder elektrolytischen Behandeln von Behandlungsgut sowie die Verwendung der Vorrichtung
PCT/EP2005/007196 WO2006002969A2 (en) 2004-07-01 2005-06-30 Device and method for chemically and electrolytically treating work pieces

Publications (1)

Publication Number Publication Date
ATE478169T1 true ATE478169T1 (de) 2010-09-15

Family

ID=34973241

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05772234T ATE478169T1 (de) 2004-07-01 2005-06-30 Vorrichtung und verfahren zur chemischen und elektrolytischen behandlung von werkstücken

Country Status (12)

Country Link
US (1) US8656858B2 (de)
EP (1) EP1761658B1 (de)
JP (1) JP4898669B2 (de)
KR (1) KR101214417B1 (de)
CN (1) CN101061259B (de)
AT (1) ATE478169T1 (de)
BR (1) BRPI0512883A (de)
DE (2) DE102004032659B4 (de)
MY (1) MY146222A (de)
PL (1) PL1761658T3 (de)
TW (1) TWI395839B (de)
WO (1) WO2006002969A2 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITTV20010131A1 (it) * 2001-09-27 2003-03-27 For El Base Di Vianello Fortun Macchina automatica per l'estruzione e l'applicazione di sigillante sulle pareti laterali di un telaio distanziatore per vetrocamera e proce
DE102007026634B4 (de) 2007-06-06 2009-04-16 Atotech Deutschland Gmbh Vertikalanlage zur galvanotechnischen Behandlung eines Werkstückes und Verfahren zum Befördern des Werkstückes
CN101861727A (zh) * 2007-09-17 2010-10-13 奎德努斯股份有限公司 检测书的内容的装置
DE102008036321A1 (de) * 2008-07-29 2010-02-04 Dürr Systems GmbH Lackieranlage zum Lackieren von zu lackierenden Gegenständen
DE102010048043A1 (de) 2010-10-15 2012-04-19 Ev Group Gmbh Vorrichtung und Verfahren zur Prozessierung von Wafern
US8677929B2 (en) * 2010-12-29 2014-03-25 Intevac, Inc. Method and apparatus for masking solar cell substrates for deposition
EP2518187A1 (de) 2011-04-26 2012-10-31 Atotech Deutschland GmbH Wässriges Säurebad zur elektrolytischen Ablagerung von Kupfer
JP5450562B2 (ja) * 2011-10-20 2014-03-26 株式会社日本製鋼所 薄膜を有する成形品の製造方法および製造装置
JP6011311B2 (ja) * 2012-12-18 2016-10-19 日本電気硝子株式会社 ワーク搬送装置およびワーク搬送方法
US9321087B2 (en) 2013-09-10 2016-04-26 TFL FSI, Inc. Apparatus and method for scanning an object through a fluid spray
DE102013220810A1 (de) * 2013-10-15 2015-04-16 Robert Bosch Gmbh Vorrichtung zur homogenen nasschemischen Behandlung von Substraten
CN104213181B (zh) * 2014-09-18 2016-05-18 丹阳市新光电子有限公司 一种防触电的升降电镀装置
DE102019119053A1 (de) * 2019-07-15 2021-01-21 Eisenmann Se Behandlungsanlage zum Behandeln von Gegenständen und Verfahren zum Behandeln von Gegenständen mit einer solchen Behandlungsanlage
CN111304730B (zh) * 2020-03-04 2022-05-13 苏州科盟激光科技有限公司 一种对smt激光模板的孔壁进行处理的装置及方法
CN112342597A (zh) * 2020-10-15 2021-02-09 湖州昱日汽车配件有限公司 一种用于汽车配件生产用的电镀装置
CN112899762A (zh) * 2021-01-15 2021-06-04 沛县科鲁新能源技术服务中心 一种集成电路电镀方法
CN112899761B (zh) * 2021-01-15 2022-05-03 深圳市众鸣电子有限公司 一种集成电路电镀设备
CN114516539B (zh) * 2022-03-25 2024-04-30 江苏徐工工程机械研究院有限公司 工件夹持装置及工件清洗设备
CN119465112B (zh) * 2025-01-15 2025-04-08 湖南洁滤环保科技有限公司 一种禁铜锌收集器表面镀覆装置及制作方法

Family Cites Families (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1427877A (en) * 1921-04-25 1922-09-05 Weeks Photoengraving Company I Process and apparatus for electrical etching
DE2028862A1 (de) * 1970-06-11 1971-12-16 Steigerwald K Druckschleusensystem fur eine Kammer, in der ein vom Umgebungsdruck abweichender Druck herrscht
US3968020A (en) * 1973-09-29 1976-07-06 Riken Keikinzoku Kogyo Kabushiki Kaisha Apparatus for surface treating metal members
US4184927A (en) * 1976-12-30 1980-01-22 Riken Keikinzoku Kogyo Kabushiki Kaisha Process and apparatus for effecting surface treatment of workpieces
DE3044975C2 (de) 1980-11-28 1985-10-31 Siemens AG, 1000 Berlin und 8000 München Vorrichtung zum galvanischen Abscheiden von Aluminium
DE3133232A1 (de) 1981-08-21 1983-03-10 Siemens AG, 1000 Berlin und 8000 München Vorrichtung zum galvanischen abscheiden von aluminium
DE3133162C2 (de) * 1981-08-21 1984-08-02 Siemens AG, 1000 Berlin und 8000 München Vorrichtung zum galvanischen Abscheiden von Aluminium
US4423211A (en) * 1981-12-21 1983-12-27 Merck & Co., Inc. Process for the whole broth extraction of avermectin
DE8328191U1 (de) * 1983-09-30 1984-01-05 Dr.-Ing. Max Schlötter GmbH & Co KG, 7340 Geislingen Oberflaechenbehandlungsanlage
US4755273A (en) * 1986-01-02 1988-07-05 Bassett I Jay Cover for coating tanks
US4759831A (en) * 1986-07-04 1988-07-26 Siemens Aktiengesellschaft Electroplating apparatus particularly for electro-deposition of aluminum
WO1989004277A1 (fr) * 1987-10-30 1989-05-18 Olivier Desjonqueres Dispositif de traitement de produits sous atmosphere et temperature controlees, notamment de produits alimentaires
DE3929728A1 (de) * 1989-09-07 1991-03-14 Werner M Kraemer Anlage zur herstellung von leiterplatten und verfahren zum betreiben der anlage
JP2545142B2 (ja) * 1989-10-28 1996-10-16 住友金属鉱山株式会社 部分メッキ装置
JP2525284B2 (ja) * 1990-10-22 1996-08-14 ティーディーケイ株式会社 クリ―ン搬送方法及び装置
JPH081923B2 (ja) 1991-06-24 1996-01-10 ティーディーケイ株式会社 クリーン搬送方法及び装置
US5468111A (en) * 1992-01-22 1995-11-21 Seagate Technology, Inc. Disc loading and unloading assembly
US5746008A (en) * 1992-07-29 1998-05-05 Shinko Electric Co., Ltd. Electronic substrate processing system using portable closed containers
US5334246A (en) * 1992-12-23 1994-08-02 Xerox Corporation Dip coat process material handling system
GB2281309B (en) * 1993-08-27 1997-04-23 Boc Group Plc A method of galvanising
US6712577B2 (en) * 1994-04-28 2004-03-30 Semitool, Inc. Automated semiconductor processing system
US6799932B2 (en) * 1994-04-28 2004-10-05 Semitool, Inc. Semiconductor wafer processing apparatus
ES2118640T3 (es) * 1994-11-15 1998-09-16 Siemens Sa Dispositivo para el tratamiento electrolitico de piezas en forma de placas, en especial placas para circuitos impresos.
DE19539868C1 (de) * 1995-10-26 1997-02-20 Lea Ronal Gmbh Transportvorrichtung und Transportsystem zur vertikalen Führung von plattenähnlichen Gegenständen zur chemischen oder elektrolytischen Oberflächenbehandlung
ATE288622T1 (de) * 1996-06-24 2005-02-15 Imec Inter Uni Micro Electr Vorrichtung und verfahren zur nassreinigung oder zum ätzen eines flachen substrats
KR100563456B1 (ko) * 1997-04-14 2006-05-25 아시스트 신꼬, 인코포레이티드 무인반송대차 및 그 장치
EP0876911A1 (de) * 1997-05-07 1998-11-11 MZE Engineering für Verfahrenstechnik GmbH Vorrichtung zum Aufbringen eines Dekors auf zumindest einen Gegenstand
US6251551B1 (en) * 1997-07-17 2001-06-26 Horst Kunze-Concewitz Method and device for treating two-dimensional substrates, especially silicon slices (wafers), for producing microelectronic components
JP3830272B2 (ja) * 1998-03-05 2006-10-04 株式会社荏原製作所 基板のめっき装置
US6153064A (en) * 1998-11-25 2000-11-28 Oliver Sales Company Apparatus for in line plating
TW463207B (en) * 1999-03-17 2001-11-11 Fujitsu Ltd Double-sealed work conveying and transferring apparatus and container inspecting method
JP4010536B2 (ja) * 2001-03-02 2007-11-21 株式会社リコー 塗工方法、塗工装置及び該塗工方法によって作成された電子写真感光体、画像形成方法並びに画像形成装置
JP2003034876A (ja) * 2001-05-11 2003-02-07 Ebara Corp 触媒処理液及び無電解めっき方法
JP2003013293A (ja) * 2001-06-29 2003-01-15 Almex Inc 表面処理装置
ATE391559T1 (de) * 2002-01-23 2008-04-15 Eisenmann Anlagenbau Gmbh & Co Vorrichtung zur behandlung von werkstücken
JP4195227B2 (ja) * 2002-02-22 2008-12-10 東京エレクトロン株式会社 被処理体の導入ポート構造
DE10228998B4 (de) * 2002-06-28 2004-05-13 Advanced Micro Devices, Inc., Sunnyvale Vorrichtung und Verfahren zum elektrochemischen Behandeln eines Substrats bei reduzierter Metallkorrosion
DE10229000A1 (de) * 2002-06-28 2004-01-29 Advanced Micro Devices, Inc., Sunnyvale Vorrichtung und Verfahren zum Reduzieren der Oxidation von polierten Metalloberflächen in einem chemisch-mechanischen Poliervorgang
DE10241619B4 (de) 2002-09-04 2004-07-22 Atotech Deutschland Gmbh Vorrichtung und Verfahren zum elektrolytischen Behandeln von zumindest oberflächlich elektrisch leitfähigem Behandlungsgut
WO2004034438A2 (en) * 2002-10-11 2004-04-22 Brooks Automation, Inc. Access to one or more levels of material storage shelves by an overhead hoist transport vehicle from a single track position
DE10255231B4 (de) * 2002-11-26 2006-02-02 Uhde High Pressure Technologies Gmbh Hochdruckvorrichtung zum Verschließen eines Druckbehälters im Reinraum
US6679672B1 (en) * 2003-03-10 2004-01-20 Syracuse University Transfer port for movement of materials between clean rooms
EP1510600A1 (de) 2003-08-26 2005-03-02 Aluminal Oberflächtentechnik GmbH & Co. KG Verfahren und Vorrichtung zum Abscheiden von Metallen und Metalllegierungen aus Metallorganischen Elektrolyten
DE10362259B4 (de) * 2003-11-04 2011-03-17 Von Ardenne Anlagentechnik Gmbh Längserstreckte Vakuumanlage zur ein- oder beidseitigen Beschichtung flacher Substrate
US7101138B2 (en) * 2003-12-03 2006-09-05 Brooks Automation, Inc. Extractor/buffer
JP4045451B2 (ja) * 2003-12-26 2008-02-13 村田機械株式会社 天井走行車システム
US7829152B2 (en) * 2006-10-05 2010-11-09 Lam Research Corporation Electroless plating method and apparatus
US7771150B2 (en) * 2005-08-26 2010-08-10 Jusung Engineering Co., Ltd. Gate valve and substrate-treating apparatus including the same
US8066267B2 (en) * 2008-03-11 2011-11-29 Schaerer Jake B Prepping, spraying and drying rack system for doors
US8225741B2 (en) * 2009-01-28 2012-07-24 Mcwane Cast Iron Pipe Company Automated processing line for applying fluid to lengths of pipe
TWI460305B (zh) * 2010-11-30 2014-11-11 Ind Tech Res Inst 化學水浴法鍍膜設備
TW201251094A (en) * 2011-06-07 2012-12-16 Hon Hai Prec Ind Co Ltd Electrode of dye-sensitized solar cells manufacturing equipment

Also Published As

Publication number Publication date
BRPI0512883A (pt) 2008-04-15
CN101061259A (zh) 2007-10-24
KR101214417B1 (ko) 2012-12-21
MY146222A (en) 2012-07-31
CN101061259B (zh) 2012-01-25
US20070256923A1 (en) 2007-11-08
JP4898669B2 (ja) 2012-03-21
WO2006002969A2 (en) 2006-01-12
EP1761658B1 (de) 2010-08-18
HK1109649A1 (en) 2008-06-13
JP2008504441A (ja) 2008-02-14
WO2006002969A3 (en) 2007-03-22
DE102004032659A1 (de) 2006-01-26
DE102004032659B4 (de) 2008-10-30
KR20070026698A (ko) 2007-03-08
US8656858B2 (en) 2014-02-25
TW200617215A (en) 2006-06-01
DE602005023017D1 (de) 2010-09-30
PL1761658T3 (pl) 2011-02-28
TWI395839B (zh) 2013-05-11
EP1761658A2 (de) 2007-03-14

Similar Documents

Publication Publication Date Title
ATE478169T1 (de) Vorrichtung und verfahren zur chemischen und elektrolytischen behandlung von werkstücken
DE60333327D1 (de) Verfahren, System und Vorrichtung zum Authentifizieren eines elektronischen Wertes
DE69908853D1 (de) Verfahren sowie Vorrichtung zum Vergleichen von Mustern durch aktive, visuelle Rückkopplung
ATE258328T1 (de) Verfahren und vorrichtung zum durchführen von elektronischen transaktionen
DE502008003460D1 (de) Verfahren und vorrichtung zur behandlung von silizium-wafern
DE60329738D1 (de) Verfahren und System zum Drucken von integrierten Schaltungsplänen
DE602006008553D1 (de) Vorrichtung und Verfahren zum Fördern von Werkstücken
DE60217289D1 (de) Vorrichtung und Verfahren zum Verarbeiten von bewegten Bildern
DE60236615D1 (de) Vorrichtung und verfahren zum schneiden von fischfilet
ATE512397T1 (de) Verfahren und system zum montieren von leiterplatten auf eine basisplatte
DE102004008900A8 (de) Vorrichtung und Verfahren zum Verarbeiten von Wafern
DE502005010393D1 (de) Verfahren und vorrichtung zum fördern von zu bearbeitenden gegenständen
DE59902875D1 (de) Verfahren und vorrichtung zum bearbeiten von an den absender zurückzuschickenden sendungen
ATE211602T1 (de) Vorrichtung zum elektrolytischen behandeln von plattenförmigem behandlungsgut und verfahren zum elektrischen abschirmen von randbereichen des behandlungsgutes bei der electrolytischen behandlung
DE602006020007D1 (de) Verfahren und Vorrichtung zum Bearbeiten von zurückgeschicktem Postgut
DE59908997D1 (de) Verfahren und Vorrichtung zum Behandeln von scheibenförmigen Gegenständen wie Blechen, Glasplatten, Leiterplatten, Keramiksubstraten
DE59602307D1 (de) Verfahren und Vorrichtung zum Behandeln von plattenförmigen Gegenständen, insbesondere Leiterplatten
ATE269185T1 (de) Vorrichtung zum laserbearbeiten von werkstücken
EP4342269A4 (de) Einstufiges elektrolytisches verfahren zum füllen von durchgangslöchern in leiterplatten und anderen substraten
DE59500120D1 (de) Einrichtung zur Behandlung von Gegenständen, insbesondere Galvanisiereinrichtun g für Leiterplatten
DE602004017042D1 (de) Verfahren und vorrichtung zum zuführen von weitgehend rechteckigen wäschestücken zu einem förderer
DE602005013202D1 (de) Vorrichtung und verfahren zum stapeln von objekten
DE60218447D1 (de) Verfahren zur Bearbeitung von Testmustern für einen integrierten Schaltkreis
ATE409672T1 (de) Verfahren und vorrichtung zum bearbeiten von druckereiprodukten
DE50213517D1 (de) Vorrichtung und Verfahren zum Herstellen und Testen von Elektronik-Baugruppen

Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification

Ref document number: 1761658

Country of ref document: EP