ATE480579T1 - Amidsubstituierte silikone und verfahren zu ihrer herstellung und verwendung - Google Patents

Amidsubstituierte silikone und verfahren zu ihrer herstellung und verwendung

Info

Publication number
ATE480579T1
ATE480579T1 AT05771265T AT05771265T ATE480579T1 AT E480579 T1 ATE480579 T1 AT E480579T1 AT 05771265 T AT05771265 T AT 05771265T AT 05771265 T AT05771265 T AT 05771265T AT E480579 T1 ATE480579 T1 AT E480579T1
Authority
AT
Austria
Prior art keywords
production
amide substituted
substituted silicones
amide
composition
Prior art date
Application number
AT05771265T
Other languages
English (en)
Inventor
Zuchen Lin
Bianxiao Zhong
Original Assignee
Dow Corning
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning filed Critical Dow Corning
Application granted granted Critical
Publication of ATE480579T1 publication Critical patent/ATE480579T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/26—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen nitrogen-containing groups
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/38—Polysiloxanes modified by chemical after-treatment
    • C08G77/382—Polysiloxanes modified by chemical after-treatment containing atoms other than carbon, hydrogen, oxygen or silicon
    • C08G77/388—Polysiloxanes modified by chemical after-treatment containing atoms other than carbon, hydrogen, oxygen or silicon containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/02—Materials undergoing a change of physical state when used
    • C09K5/06—Materials undergoing a change of physical state when used the change of state being from liquid to solid or vice versa
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/02—Materials undergoing a change of physical state when used
    • C09K5/06—Materials undergoing a change of physical state when used the change of state being from liquid to solid or vice versa
    • C09K5/063—Materials absorbing or liberating heat during crystallisation; Heat storage materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
AT05771265T 2004-12-16 2005-06-30 Amidsubstituierte silikone und verfahren zu ihrer herstellung und verwendung ATE480579T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US63683704P 2004-12-16 2004-12-16
US67914205P 2005-05-09 2005-05-09
PCT/US2005/023482 WO2006065282A1 (en) 2004-12-16 2005-06-30 Amide-substituted silicones and methods for their preparation and use

Publications (1)

Publication Number Publication Date
ATE480579T1 true ATE480579T1 (de) 2010-09-15

Family

ID=35005780

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05771265T ATE480579T1 (de) 2004-12-16 2005-06-30 Amidsubstituierte silikone und verfahren zu ihrer herstellung und verwendung

Country Status (10)

Country Link
US (1) US7956150B2 (de)
EP (1) EP1844089B1 (de)
JP (1) JP5090177B2 (de)
KR (1) KR101164438B1 (de)
CN (1) CN101048444B (de)
AT (1) ATE480579T1 (de)
DE (1) DE602005023531D1 (de)
MY (1) MY151325A (de)
TW (1) TWI378952B (de)
WO (1) WO2006065282A1 (de)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1833918B1 (de) 2004-12-23 2011-09-28 Dow Corning Corporation Vernetzbare saccharid-siloxan-zusammensetzungen und daraus gebildete netzwerke, überzüge und artikel
JP4534062B2 (ja) 2005-04-19 2010-09-01 ルネサスエレクトロニクス株式会社 半導体装置
JP5122444B2 (ja) 2005-05-23 2013-01-16 ダウ・コーニング・コーポレイション サッカリド−シロキサンコポリマーを含むパーソナルケア組成物
EP2019678A4 (de) 2006-05-23 2012-05-02 Dow Corning Neuartige silikonfilmformer zur verabreichung von wirkstoffen
JP5197631B2 (ja) * 2007-02-20 2013-05-15 ダウ コーニング コーポレーション 水素結合性ポリオルガノシロキサンベースの充填材処理剤
JP2010539706A (ja) * 2007-09-11 2010-12-16 ダウ コーニング コーポレーション 放熱材料、該放熱材料を含む電子デバイス、ならびにそれらの調製方法および使用方法
CN101803009B (zh) * 2007-09-11 2012-07-04 陶氏康宁公司 组合物，包括这种组合物的热界面材料,及其制备方法和用途
EP2238617A2 (de) * 2008-01-31 2010-10-13 Raytheon Company Verfahren und vorrichtung zur wärmeübertragung an eine komponente
EP2408860B1 (de) 2009-03-16 2020-03-18 Dow Silicones Corporation Wärmeleitfähiges schmierfett sowie dieses fett verwendende verfahren und vorrichtungen
CN102804367A (zh) * 2009-06-19 2012-11-28 道康宁公司 离聚硅酮热塑性弹性体在电子器件中的用途
US8853372B2 (en) 2010-08-23 2014-10-07 Dow Corning Corporation Saccharide siloxanes stable in aqueous environments and methods for the preparation and use of such saccharide siloxanes
JP2014505119A (ja) 2010-11-24 2014-02-27 ダウ コーニング コーポレーション ブロックコポリマーの形態の制御
KR20140083001A (ko) * 2011-10-07 2014-07-03 쓰리엠 이노베이티브 프로퍼티즈 컴파니 열 저항이 낮은 열 그리스
US10373891B2 (en) 2013-06-14 2019-08-06 Laird Technologies, Inc. Methods for establishing thermal joints between heat spreaders or lids and heat sources
US11141011B2 (en) * 2014-10-28 2021-10-12 Tempra Technology, Inc. Heat retaining dish assembly and method of heating same
US20180030328A1 (en) * 2016-07-26 2018-02-01 Honeywell International Inc. Gel-type thermal interface material
SG10201607550RA (en) * 2016-09-09 2018-04-27 3M Innovative Properties Co Thermal Interface Material
CN106817881A (zh) * 2017-01-22 2017-06-09 嘉兴斯达半导体股份有限公司 一种功率半导体模块及其制备方法
US11041103B2 (en) 2017-09-08 2021-06-22 Honeywell International Inc. Silicone-free thermal gel
US11316932B2 (en) 2017-09-22 2022-04-26 Intel Corporation Device management services based on restful messaging
CN108384015B (zh) * 2018-02-01 2019-06-11 广州硅碳新材料有限公司 一种有机硅酰胺蜡及其制备方法
US11072706B2 (en) 2018-02-15 2021-07-27 Honeywell International Inc. Gel-type thermal interface material
EP3853292A4 (de) * 2018-09-17 2022-06-08 Elevance Renewable Sciences, Inc. Funktionalisierte silikonpolymere sowie verfahren zur herstellung und verwendung davon
EP3853294A4 (de) 2018-09-17 2022-06-08 Elevance Renewable Sciences, Inc. Segmentierte silikonpolymere sowie verfahren zur herstellung und verwendung davon
US11373921B2 (en) 2019-04-23 2022-06-28 Honeywell International Inc. Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing
KR102248446B1 (ko) * 2019-12-04 2021-05-04 포항공과대학교 산학협력단 지방산 아마이드를 함유한 중합체 및 이를 포함하는 조성물
WO2022015958A1 (en) * 2020-07-16 2022-01-20 Rogers Corporation Thermally conductive phase-change composition, methods of manufacture thereof, and articles including the composition

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB788984A (en) 1955-05-31 1958-01-08 Midland Silicones Ltd Improvements in or relating to organopolysiloxanes
GB882061A (en) 1956-10-12 1961-11-08 Union Carbide Corp Organosilicon acylamino compounds and process for producing the same
GB882059A (en) 1956-10-12 1961-11-08 Union Carbide Corp Organosilicon carbamyl compounds and process for producing the same
US3159601A (en) * 1962-07-02 1964-12-01 Gen Electric Platinum-olefin complex catalyzed addition of hydrogen- and alkenyl-substituted siloxanes
US3220972A (en) * 1962-07-02 1965-11-30 Gen Electric Organosilicon process using a chloroplatinic acid reaction product as the catalyst
US3296291A (en) * 1962-07-02 1967-01-03 Gen Electric Reaction of silanes with unsaturated olefinic compounds
FR1467679A (fr) 1965-03-18 1967-01-27 Dow Corning Silicones contenant un groupe amide et leur procédé de préparation
NL131800C (de) * 1965-05-17
GB1188212A (en) * 1967-03-15 1970-04-15 Ici Ltd Fluorine-Containing Silanes and Siloxanes
US3516946A (en) * 1967-09-29 1970-06-23 Gen Electric Platinum catalyst composition for hydrosilation reactions
US3814730A (en) * 1970-08-06 1974-06-04 Gen Electric Platinum complexes of unsaturated siloxanes and platinum containing organopolysiloxanes
US3989668A (en) * 1975-07-14 1976-11-02 Dow Corning Corporation Method of making a silicone elastomer and the elastomer prepared thereby
US4299715A (en) * 1978-04-14 1981-11-10 Whitfield Fred J Methods and materials for conducting heat from electronic components and the like
GB8414113D0 (en) 1984-06-02 1984-07-04 Dow Corning Ltd Treating textiles
US4784879A (en) * 1987-07-20 1988-11-15 Dow Corning Corporation Method for preparing a microencapsulated compound of a platinum group metal
US4766176A (en) * 1987-07-20 1988-08-23 Dow Corning Corporation Storage stable heat curable organosiloxane compositions containing microencapsulated platinum-containing catalysts
JP2630993B2 (ja) 1988-06-23 1997-07-16 東レ・ダウコーニング・シリコーン株式会社 ヒドロシリル化反応用白金系触媒含有粒状物およびその製造方法
JPH0214244A (ja) * 1988-06-30 1990-01-18 Toray Dow Corning Silicone Co Ltd 加熱硬化性オルガノポリシロキサン組成物
US4861906A (en) * 1989-04-10 1989-08-29 Dow Corning Corporation Process for the synthesis of acylamino organosilicon compounds
US5036117A (en) * 1989-11-03 1991-07-30 Dow Corning Corporation Heat-curable silicone compositions having improved bath life
US5082735A (en) * 1990-05-04 1992-01-21 Dow Corning Corporation Process of curing methylhydrosiloxanes
GB9103191D0 (en) * 1991-02-14 1991-04-03 Dow Corning Platinum complexes and use thereof
JP2645533B2 (ja) * 1992-01-30 1997-08-25 信越化学工業株式会社 摺動性樹脂組成物
JPH07196671A (ja) * 1993-12-28 1995-08-01 Shin Etsu Chem Co Ltd アミド基変性含フッ素オルガノポリシロキサン
US6054198A (en) * 1996-04-29 2000-04-25 Parker-Hannifin Corporation Conformal thermal interface material for electronic components
US5930893A (en) * 1996-05-29 1999-08-03 Eaton; Manford L. Thermally conductive material and method of using the same
US6286212B1 (en) * 1996-05-29 2001-09-11 Manford L. Eaton Thermally conductive material and method of using the same
US5950066A (en) * 1996-06-14 1999-09-07 The Bergquist Company Semisolid thermal interface with low flow resistance
JPH10130392A (ja) 1996-10-31 1998-05-19 Toray Dow Corning Silicone Co Ltd アミド基含有オルガノポリシロキサンの製造方法
US5904796A (en) * 1996-12-05 1999-05-18 Power Devices, Inc. Adhesive thermal interface and method of making the same
US5929164A (en) * 1997-11-05 1999-07-27 Dow Corning Corporation Quenching post cure
JPH11246666A (ja) 1998-02-26 1999-09-14 Dow Corning Toray Silicone Co Ltd 室温硬化性シリコーンゴム組成物
JP3444199B2 (ja) * 1998-06-17 2003-09-08 信越化学工業株式会社 熱伝導性シリコーンゴム組成物及びその製造方法
US5981680A (en) * 1998-07-13 1999-11-09 Dow Corning Corporation Method of making siloxane-based polyamides
US6136758A (en) * 1998-08-17 2000-10-24 Shin-Etsu Chemical Co., Ltd. Aluminum nitride powder and thermally conductive grease composition using the same
JP2000109373A (ja) * 1998-10-02 2000-04-18 Shin Etsu Chem Co Ltd 放熱用シリコーングリース組成物及びそれを使用した半導体装置
US5912805A (en) * 1998-11-04 1999-06-15 Freuler; Raymond G. Thermal interface with adhesive
JP2002338689A (ja) * 2001-03-15 2002-11-27 Nippon Unicar Co Ltd ワックス状オルガノポリシロキサン及びそれを含有するトナー組成物
US6815486B2 (en) 2002-04-12 2004-11-09 Dow Corning Corporation Thermally conductive phase change materials and methods for their preparation and use
US6783692B2 (en) * 2002-10-17 2004-08-31 Dow Corning Corporation Heat softening thermally conductive compositions and methods for their preparation
US6838541B2 (en) * 2003-02-12 2005-01-04 Dow Corning Corporation Method of making siloxane-based polyamide elastomers

Also Published As

Publication number Publication date
JP5090177B2 (ja) 2012-12-05
WO2006065282A1 (en) 2006-06-22
TW200621856A (en) 2006-07-01
CN101048444B (zh) 2012-01-11
KR101164438B1 (ko) 2012-07-13
MY151325A (en) 2014-05-15
US7956150B2 (en) 2011-06-07
EP1844089B1 (de) 2010-09-08
EP1844089A1 (de) 2007-10-17
CN101048444A (zh) 2007-10-03
JP2008524373A (ja) 2008-07-10
KR20070089169A (ko) 2007-08-30
US20080063879A1 (en) 2008-03-13
DE602005023531D1 (de) 2010-10-21
TWI378952B (en) 2012-12-11

Similar Documents

Publication Publication Date Title
ATE480579T1 (de) Amidsubstituierte silikone und verfahren zu ihrer herstellung und verwendung
TW200517484A (en) Thermally conductive grease and methods and devices in which said grease is used
DE60317232D1 (de) Wärmeerweichung von thermisch leitfähigen zusammensetzungen und verfahren zu ihrer herstellung
DE60314789D1 (de) Wärmeleitende Silikonkautschukzusammensetzung
DE602004020569D1 (de) Halter und Wärmeleiter für Elektroniktbauteil
DE60326072D1 (de) Isolationselement mit hoher thermischer leitfähigkeit, verfahren zu dessen herstellung, elektromagnetische spule und elektromagnetische vorrichtung
TW200833788A (en) Heat stable aryl polysiloxane compositions
DE60311733D1 (de) Silikonharz Zusammensetzung für LED Bauteile
GB0413079D0 (en) Electronic thermal management utilising device with deflectable, two leg conductive member; and with elastic, thermally-conductive material therebetween
AU2003225733A1 (en) Addition curable silicone gum having improved thermal conductivity
WO2006135556A3 (en) B-stageable film, electronic device, and associated process
TW530935U (en) Heat dissipation apparatus for lower-connect type integrated circuit
DE602007010741D1 (de) Emi-abschirmungs- und wärmemanagementbaugruppen mielung
EP1691286A4 (de) Task-verwaltungsverfahren, task-verwaltungseinrichtung, integrierte halbleiterschaltung, elektronische einrichtung und task-verwaltungssystem
MY139827A (en) Refractory metal substrate with improved thermal conductivity
EP1644709A4 (de) Verfahren und vorrichtung zur verwaltung der temperatur thermischer komponenten
DE50212344D1 (de) Kühlvorrichtung für elektronische/elektrische Komponenten
TW200615501A (en) Thermal interface incorporating nanotubes
TW527068U (en) Clip for heat dissipation device
ITTO20020416A0 (it) Struttura di contenimento e dissipazione termica per apparecchiature elettroniche.
DE60237239D1 (de) Einrichtung mit siliziumsubstrat und verfahren zu ihrer herstellung
AU2003301780A1 (en) X-ray generator with improved thermal dissipation and method for making same
FI20021400L (fi) Menetelmä lämpö- ja sähköenergian tuottamiseksi
DE60313118D1 (de) Halbleiterschaltkreis zur Entschlüsselung
DE602004020411D1 (de) Integrierter Schaltkreis und elektrische Vorrichtung, die diesen verwendet

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties