ATE483186T1 - Verfahren und vorrichtung zum prüfen von halbleitern - Google Patents

Verfahren und vorrichtung zum prüfen von halbleitern

Info

Publication number
ATE483186T1
ATE483186T1 AT02739395T AT02739395T ATE483186T1 AT E483186 T1 ATE483186 T1 AT E483186T1 AT 02739395 T AT02739395 T AT 02739395T AT 02739395 T AT02739395 T AT 02739395T AT E483186 T1 ATE483186 T1 AT E483186T1
Authority
AT
Austria
Prior art keywords
identification element
data
outlier identification
test
testing semiconductors
Prior art date
Application number
AT02739395T
Other languages
English (en)
Inventor
Eric Tabor
Original Assignee
Test Advantage Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=27501599&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE483186(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from US09/872,195 external-priority patent/US6782297B2/en
Application filed by Test Advantage Inc filed Critical Test Advantage Inc
Application granted granted Critical
Publication of ATE483186T1 publication Critical patent/ATE483186T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
AT02739395T 2001-05-24 2002-05-24 Verfahren und vorrichtung zum prüfen von halbleitern ATE483186T1 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US29357701P 2001-05-24 2001-05-24
US29518801P 2001-05-31 2001-05-31
US09/872,195 US6782297B2 (en) 2001-05-24 2001-05-31 Methods and apparatus for data smoothing
US37432802P 2002-04-21 2002-04-21
PCT/US2002/016494 WO2002095802A2 (en) 2001-05-24 2002-05-24 Methods and apparatus for semiconductor testing

Publications (1)

Publication Number Publication Date
ATE483186T1 true ATE483186T1 (de) 2010-10-15

Family

ID=27501599

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02739395T ATE483186T1 (de) 2001-05-24 2002-05-24 Verfahren und vorrichtung zum prüfen von halbleitern

Country Status (10)

Country Link
US (1) US6792373B2 (de)
EP (1) EP1479025B1 (de)
JP (2) JP2005507557A (de)
KR (1) KR20040067875A (de)
AT (1) ATE483186T1 (de)
AU (1) AU2002312045A1 (de)
CA (1) CA2448460A1 (de)
DE (1) DE60237849D1 (de)
IL (2) IL159009A0 (de)
WO (1) WO2002095802A2 (de)

Families Citing this family (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040006447A1 (en) * 2000-06-22 2004-01-08 Jacky Gorin Methods and apparatus for test process enhancement
US7167811B2 (en) * 2001-05-24 2007-01-23 Test Advantage, Inc. Methods and apparatus for data analysis
US7225107B2 (en) * 2001-05-24 2007-05-29 Test Advantage, Inc. Methods and apparatus for data analysis
US7395170B2 (en) * 2001-05-24 2008-07-01 Test Advantage, Inc. Methods and apparatus for data analysis
EP1373861A2 (de) * 2001-03-29 2004-01-02 Koninklijke Philips Electronics N.V. Verfahren zur messung einer durchlässigkeitsrate sowie mess- und testverfahren und -gerät
US8417477B2 (en) * 2001-05-24 2013-04-09 Test Acuity Solutions, Inc. Methods and apparatus for local outlier detection
US6816811B2 (en) * 2001-06-21 2004-11-09 Johnson Controls Technology Company Method of intelligent data analysis to detect abnormal use of utilities in buildings
US20070219741A1 (en) * 2005-05-20 2007-09-20 Emilio Miguelanez Methods and apparatus for hybrid outlier detection
US7944971B1 (en) * 2002-07-14 2011-05-17 Apple Inc. Encoding video
US7738693B2 (en) * 2002-12-24 2010-06-15 Lam Research Corporation User interface for wafer data analysis and visualization
US6907378B2 (en) * 2002-09-26 2005-06-14 Agilent Technologies, Inc. Empirical data based test optimization method
US7079960B2 (en) * 2002-11-02 2006-07-18 Taiwan Semiconductor Manufacturing Company, Ltd. Auto classification shipping system
US7319935B2 (en) * 2003-02-12 2008-01-15 Micron Technology, Inc. System and method for analyzing electrical failure data
US6862540B1 (en) 2003-03-25 2005-03-01 Johnson Controls Technology Company System and method for filling gaps of missing data using source specified data
US7281165B2 (en) * 2003-06-12 2007-10-09 Inventec Corporation System and method for performing product tests utilizing a single storage device
US7904279B2 (en) * 2004-04-02 2011-03-08 Test Advantage, Inc. Methods and apparatus for data analysis
US7129735B2 (en) * 2004-07-21 2006-10-31 Texas Instruments Incorporated Method for test data-driven statistical detection of outlier semiconductor devices
US8725748B1 (en) * 2004-08-27 2014-05-13 Advanced Micro Devices, Inc. Method and system for storing and retrieving semiconductor tester information
US7957821B2 (en) * 2004-11-17 2011-06-07 Taiwan Semiconductor Manufacturing Co., Ltd. Systems and methods for statistical process control
EP1696295A1 (de) * 2005-02-25 2006-08-30 Siemens Aktiengesellschaft Verfahren und Vorrichtung zur Datenauswertung, Computerprogrammprodukt und computerlesbares Medium
JP4734002B2 (ja) * 2005-03-16 2011-07-27 株式会社東芝 検査システム及び半導体装置の製造方法
US9037280B2 (en) * 2005-06-06 2015-05-19 Kla-Tencor Technologies Corp. Computer-implemented methods for performing one or more defect-related functions
US7528622B2 (en) * 2005-07-06 2009-05-05 Optimal Test Ltd. Methods for slow test time detection of an integrated circuit during parallel testing
US7767945B2 (en) * 2005-11-23 2010-08-03 Raytheon Company Absolute time encoded semi-active laser designation
US7617427B2 (en) * 2005-12-29 2009-11-10 Lsi Corporation Method and apparatus for detecting defects in integrated circuit die from stimulation of statistical outlier signatures
JP2009527903A (ja) * 2006-02-17 2009-07-30 テスト アドバンテージ， インコーポレイテッド データ解析のための方法および装置
US7533313B1 (en) * 2006-03-09 2009-05-12 Advanced Micro Devices, Inc. Method and apparatus for identifying outlier data
US7567947B2 (en) * 2006-04-04 2009-07-28 Optimaltest Ltd. Methods and systems for semiconductor testing using a testing scenario language
JP4931710B2 (ja) 2007-06-29 2012-05-16 株式会社リコー ウエハにおける良品チップ分類方法、それを用いたチップ品質判定方法、ならびにチップ分類プログラム、チップ品質判定プログラム、マーキング機構及び半導体装置の製造方法
US20090013218A1 (en) * 2007-07-02 2009-01-08 Optimal Test Ltd. Datalog management in semiconductor testing
US9453691B2 (en) 2007-08-09 2016-09-27 Coolit Systems, Inc. Fluid heat exchange systems
US9943014B2 (en) 2013-03-15 2018-04-10 Coolit Systems, Inc. Manifolded heat exchangers and related systems
US8746330B2 (en) 2007-08-09 2014-06-10 Coolit Systems Inc. Fluid heat exchanger configured to provide a split flow
US9496200B2 (en) 2011-07-27 2016-11-15 Coolit Systems, Inc. Modular heat-transfer systems
JP4820389B2 (ja) * 2008-07-22 2011-11-24 株式会社リコー チップ品質判定方法、チップ品質判定プログラム及びそれを用いたマーキング機構
US20100070211A1 (en) * 2008-09-12 2010-03-18 Analog Devices, Inc. Rolling average test
US10118200B2 (en) 2009-07-06 2018-11-06 Optimal Plus Ltd System and method for binning at final test
US20110288808A1 (en) 2010-05-20 2011-11-24 International Business Machines Corporation Optimal test flow scheduling within automated test equipment for minimized mean time to detect failure
US8855959B2 (en) 2010-08-30 2014-10-07 International Business Machines Corporation Integrated cross-tester analysis and real-time adaptive test
US8656323B2 (en) * 2011-02-22 2014-02-18 Kla-Tencor Corporation Based device risk assessment
WO2014141162A1 (en) 2013-03-15 2014-09-18 Coolit Systems, Inc. Sensors, multiplexed communication techniques, and related systems
US10365667B2 (en) 2011-08-11 2019-07-30 Coolit Systems, Inc. Flow-path controllers and related systems
US20130275357A1 (en) * 2012-04-11 2013-10-17 Henry Arnold Algorithm and structure for creation, definition, and execution of an spc rule decision tree
US10371744B2 (en) 2012-04-11 2019-08-06 Advantest Corporation Method and apparatus for an efficient framework for testcell development
US8948494B2 (en) 2012-11-12 2015-02-03 Kla-Tencor Corp. Unbiased wafer defect samples
US12366870B2 (en) 2013-03-15 2025-07-22 Coolit Systems, Inc. Flow-path controllers and related systems
US9052252B2 (en) 2013-03-15 2015-06-09 Coolit Systems, Inc. Sensors, communication techniques, and related systems
US10852357B2 (en) 2013-05-03 2020-12-01 Vertiv Corporation System and method for UPS battery monitoring and data analysis
CN107369635B (zh) * 2017-06-06 2020-06-09 上海集成电路研发中心有限公司 一种基于深度学习的智能半导体装备系统
US11452243B2 (en) 2017-10-12 2022-09-20 Coolit Systems, Inc. Cooling system, controllers and methods
US11662037B2 (en) 2019-01-18 2023-05-30 Coolit Systems, Inc. Fluid flow control valve for fluid flow systems, and methods
US11473860B2 (en) 2019-04-25 2022-10-18 Coolit Systems, Inc. Cooling module with leak detector and related systems
EP4150216A4 (de) 2020-05-11 2023-11-01 Coolit Systems, Inc. Flüssigkeitspumpeinheiten sowie zugehörige systeme und verfahren
US11725886B2 (en) 2021-05-20 2023-08-15 Coolit Systems, Inc. Modular fluid heat exchange systems
US12200914B2 (en) 2022-01-24 2025-01-14 Coolit Systems, Inc. Smart components, systems and methods for transferring heat
US20250292390A1 (en) * 2024-03-17 2025-09-18 Nanya Technology Corporation Test system and test method
CN118412295B (zh) * 2024-07-01 2025-03-25 深圳佰维存储科技股份有限公司 目标晶粒确定方法、装置、电子设备及介质

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5668745A (en) * 1995-10-20 1997-09-16 Lsi Logic Corporation Method and apparatus for testing of semiconductor devices
US5835891A (en) * 1997-02-06 1998-11-10 Hewlett-Packard Company Device modeling using non-parametric statistical determination of boundary data vectors
US6366851B1 (en) * 1999-10-25 2002-04-02 Navigation Technologies Corp. Method and system for automatic centerline adjustment of shape point data for a geographic database
US6184048B1 (en) * 1999-11-03 2001-02-06 Texas Instruments Incorporated Testing method and apparatus assuring semiconductor device quality and reliability

Also Published As

Publication number Publication date
US6792373B2 (en) 2004-09-14
DE60237849D1 (de) 2010-11-11
US20030014205A1 (en) 2003-01-16
JP2005507557A (ja) 2005-03-17
JP2010226125A (ja) 2010-10-07
IL159009A0 (en) 2004-05-12
EP1479025B1 (de) 2010-09-29
IL159009A (en) 2011-01-31
WO2002095802A3 (en) 2004-09-23
EP1479025A2 (de) 2004-11-24
EP1479025A4 (de) 2006-04-12
AU2002312045A1 (en) 2002-12-03
KR20040067875A (ko) 2004-07-30
WO2002095802A2 (en) 2002-11-28
CA2448460A1 (en) 2002-11-28

Similar Documents

Publication Publication Date Title
ATE483186T1 (de) Verfahren und vorrichtung zum prüfen von halbleitern
DE60213339D1 (de) Vorrichtung und Verfahren zum Messen der Konzentrationen von Fluid-Komponenten
DE10291293T1 (de) Vorrichtung und Verfahren zum Messen und Schätzen der Wahrscheinlichkeit von Taktschrägen
DE69636701D1 (de) Verfahren und Vorrichtung zur Prüfung von Halbleiterchips
ATE258328T1 (de) Verfahren und vorrichtung zum durchführen von elektronischen transaktionen
DE59912692D1 (de) Verfahren und Vorrichtung zum optischen Prüfen von Packungen
ATE454605T1 (de) Vorrichtung und verfahren für ein höhenmesssystem
DE602004009329D1 (de) Verfahren und system zum selektiven maskieren von testantworten
DE69428963D1 (de) Verfahren und vorrichtung zur verarbeitung von signalen für einen ultraschallinspektionsapparat
DE59102949D1 (de) Verfahren und vorrichtung zur funktionsüberwachung eines elektrischen verbrauchers.
ATE381706T1 (de) Vorrichtung und verfahren zur vermessung von bauteilen
DE50212702D1 (de) Verfahren, computerprogramm und vorrichtung zum messen der einspritzmenge von einspritzsystemen
ATA1242002A (de) Verfahren und einrichtung zum optischen testen von halbleiterbauelementen
DE69841981D1 (de) Verfahren und Vorrichtung zur Erzeugung und Prüfung vom Datenprüffeld
DE60228194D1 (de) Verfahren und vorrichtung zum schnellen aufheizen von nmr-proben
DE602004016422D1 (de) Verfahren und Vorrichtung zur Prüfung von Halbleiterelementen
ATE475074T1 (de) Verfahren und vorrichtung zur gleichzeitigen prüfung einer vielzahl von differenziellen druckmesssensoren
DE59407506D1 (de) Verfahren und Vorrichtung zum Überprüfen der Funktionsfähigkeit von Inspektionseinrichtungen an Flascheninspektionsmaschinen
DE19980796D2 (de) Verfahren und Vorrichtung zum Herstellen und Prüfen von Schraubverbindungen
DE60205450D1 (de) Verfahren und Vorrichtung für die Bereitstellung von Konfigurationsdaten
DE19980807D2 (de) Verfahren und Vorrichtung zum Prüfen von Schraubverbindungen
DE60106831D1 (de) Verfahren und Vorrichtung zum Messen von Wellenformen
DE69605122D1 (de) Verfahren und vorrichtung zur prüfung von gewindeverbindungen und gewindeteilen
DE59704620D1 (de) Verfahren und vorrichtung zum messen und prüfen von werkstücken
DE60237494D1 (de) Vorrichtung, Verfahren und Rechnerprogramm zum Anzeigen von Signalverarbeitungsdaten

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties