ATE483260T1 - Steckerkomponente mit vorbelasteten anisotropen leitfähigen elastomermaterialien - Google Patents

Steckerkomponente mit vorbelasteten anisotropen leitfähigen elastomermaterialien

Info

Publication number
ATE483260T1
ATE483260T1 AT02753337T AT02753337T ATE483260T1 AT E483260 T1 ATE483260 T1 AT E483260T1 AT 02753337 T AT02753337 T AT 02753337T AT 02753337 T AT02753337 T AT 02753337T AT E483260 T1 ATE483260 T1 AT E483260T1
Authority
AT
Austria
Prior art keywords
anisotropic conductive
connector frame
conductive elastomer
preloaded
connector component
Prior art date
Application number
AT02753337T
Other languages
English (en)
Inventor
Roger Weiss
Christopher Cornell
Matthew Mccarthy
Everett Simons
Original Assignee
Paricon Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/970,072 external-priority patent/US6497583B1/en
Application filed by Paricon Technologies Corp filed Critical Paricon Technologies Corp
Application granted granted Critical
Publication of ATE483260T1 publication Critical patent/ATE483260T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for unleaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Conductive Materials (AREA)
  • Measuring Leads Or Probes (AREA)
  • Connecting Device With Holders (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
AT02753337T 2001-06-14 2002-06-06 Steckerkomponente mit vorbelasteten anisotropen leitfähigen elastomermaterialien ATE483260T1 (de)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US29816301P 2001-06-14 2001-06-14
US31117801P 2001-08-08 2001-08-08
US09/970,072 US6497583B1 (en) 2001-10-03 2001-10-03 Interconnection components with integral conductive elastomeric sheet material, and method of manufacturing same
US34682002P 2002-01-08 2002-01-08
US34711402P 2002-01-09 2002-01-09
PCT/US2002/018059 WO2002103848A2 (en) 2001-06-14 2002-06-06 Apparatus and methods to pre-stress anisotropic conductive elastomer meterials

Publications (1)

Publication Number Publication Date
ATE483260T1 true ATE483260T1 (de) 2010-10-15

Family

ID=27540834

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02753337T ATE483260T1 (de) 2001-06-14 2002-06-06 Steckerkomponente mit vorbelasteten anisotropen leitfähigen elastomermaterialien

Country Status (8)

Country Link
EP (1) EP1396050B1 (de)
JP (1) JP4074245B2 (de)
KR (1) KR100864332B1 (de)
CN (1) CN1278451C (de)
AT (1) ATE483260T1 (de)
AU (1) AU2002313634A1 (de)
DE (1) DE60237814D1 (de)
WO (1) WO2002103848A2 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6497583B1 (en) * 2001-10-03 2002-12-24 Paricon Technologies Corporation Interconnection components with integral conductive elastomeric sheet material, and method of manufacturing same
KR101037361B1 (ko) * 2009-03-10 2011-05-26 (주)연우 이종내용물을 혼합하여 사용하는 화장품용기
US9078352B2 (en) * 2012-10-29 2015-07-07 Avago Technologies General Ip (Singapore) Pte. Ltd. Low inductance flex bond with low thermal resistance
JP2021086676A (ja) * 2019-11-26 2021-06-03 デクセリアルズ株式会社 プローブシート及びプロープシートの製造方法
US11723154B1 (en) * 2020-02-17 2023-08-08 Nicholas J. Chiolino Multiwire plate-enclosed ball-isolated single-substrate silicon-carbide-die package

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4209481A (en) * 1976-04-19 1980-06-24 Toray Industries, Inc. Process for producing an anisotropically electroconductive sheet
US4292261A (en) * 1976-06-30 1981-09-29 Japan Synthetic Rubber Company Limited Pressure sensitive conductor and method of manufacturing the same
US4778635A (en) * 1987-09-18 1988-10-18 American Telephone And Telegraph Company Method and apparatus for fabricating anisotropically conductive material
US4820376A (en) * 1987-11-05 1989-04-11 American Telephone And Telegraph Company At&T Bell Laboratories Fabrication of CPI layers
JP3038859B2 (ja) * 1989-09-29 2000-05-08 ジェイエスアール株式会社 異方導電性シート
JP2899543B2 (ja) * 1995-06-08 1999-06-02 信越ポリマー株式会社 半導体パッケージ接続用ソケット
JPH1140224A (ja) 1997-07-11 1999-02-12 Jsr Corp 異方導電性シート

Also Published As

Publication number Publication date
JP2004531864A (ja) 2004-10-14
EP1396050A4 (de) 2007-11-14
KR100864332B1 (ko) 2008-10-17
EP1396050B1 (de) 2010-09-29
AU2002313634A1 (en) 2003-01-02
WO2002103848A2 (en) 2002-12-27
CN1278451C (zh) 2006-10-04
JP4074245B2 (ja) 2008-04-09
CN1526183A (zh) 2004-09-01
EP1396050A2 (de) 2004-03-10
WO2002103848A3 (en) 2003-03-06
KR20040012918A (ko) 2004-02-11
DE60237814D1 (de) 2010-11-11

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Legal Events

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