ATE485536T1 - THERMAL CONTROL OF DEPOSITION IN DPN (DIP-PEN NANOLITHOGRAPHY) - Google Patents

THERMAL CONTROL OF DEPOSITION IN DPN (DIP-PEN NANOLITHOGRAPHY)

Info

Publication number
ATE485536T1
ATE485536T1 AT05771292T AT05771292T ATE485536T1 AT E485536 T1 ATE485536 T1 AT E485536T1 AT 05771292 T AT05771292 T AT 05771292T AT 05771292 T AT05771292 T AT 05771292T AT E485536 T1 ATE485536 T1 AT E485536T1
Authority
AT
Austria
Prior art keywords
chip
ink
deposition
dpn
dip
Prior art date
Application number
AT05771292T
Other languages
German (de)
Inventor
Paul E Sheehan
Lloyd J Whitman
William P King
Original Assignee
Us Gov Sec Navy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/956,596 external-priority patent/US7541062B2/en
Application filed by Us Gov Sec Navy filed Critical Us Gov Sec Navy
Application granted granted Critical
Publication of ATE485536T1 publication Critical patent/ATE485536T1/en

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  • Micromachines (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a device capable of depositing ink in a vacuum without the risk of contamination using a fine chip, capable of changing a deposition rate without cutting-off the chip with a substrate, further capable of making the deposition of ink on-off, and capable of obtaining high spatial resolution.SOLUTION: Ink 20 coated on the surface of a chip 10 formed on a cantilever 40 is contacted with a substrate 30. The chip 10 is actually very small to the cantilever 40. Since the chip 10 is heated with a resistivity element 60, a heating element 50 is fitted to the cantilever 40. The deposition of the ink 20 to the substrate 30 is made on-off by increasing the temperature of the tip of the chip 10 to the melting temperature of the ink 20 or higher by heating or stopping the heating and decreasing the temperature to the melting temperature of the ink 20 or lower.
AT05771292T 2004-08-18 2005-05-10 THERMAL CONTROL OF DEPOSITION IN DPN (DIP-PEN NANOLITHOGRAPHY) ATE485536T1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US60351804P 2004-08-18 2004-08-18
US10/956,596 US7541062B2 (en) 2004-08-18 2004-09-29 Thermal control of deposition in dip pen nanolithography
PCT/US2005/015966 WO2006036217A2 (en) 2004-08-18 2005-05-10 Thermal control of deposition in dip pen nanolithography

Publications (1)

Publication Number Publication Date
ATE485536T1 true ATE485536T1 (en) 2010-11-15

Family

ID=43028828

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05771292T ATE485536T1 (en) 2004-08-18 2005-05-10 THERMAL CONTROL OF DEPOSITION IN DPN (DIP-PEN NANOLITHOGRAPHY)

Country Status (3)

Country Link
JP (1) JP5867970B2 (en)
AT (1) ATE485536T1 (en)
DE (1) DE602005024312D1 (en)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69618627T2 (en) * 1996-03-13 2002-09-12 International Business Machines Corp., Armonk BOOM STRUCTURES
US6635311B1 (en) * 1999-01-07 2003-10-21 Northwestern University Methods utilizing scanning probe microscope tips and products therefor or products thereby
KR100389903B1 (en) * 2000-12-01 2003-07-04 삼성전자주식회사 Mass data storage and the method of writing and reading therof by contact resitance measurement
US7034854B2 (en) * 2002-11-12 2006-04-25 Nanoink, Inc. Methods and apparatus for ink delivery to nanolithographic probe systems

Also Published As

Publication number Publication date
JP2015006726A (en) 2015-01-15
DE602005024312D1 (en) 2010-12-02
JP5867970B2 (en) 2016-02-24

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