ATE485598T1 - Verfahren zum verschliessen einer mikrokavität und gehäuse mit mindestens einer mikrokavität - Google Patents

Verfahren zum verschliessen einer mikrokavität und gehäuse mit mindestens einer mikrokavität

Info

Publication number
ATE485598T1
ATE485598T1 AT03795528T AT03795528T ATE485598T1 AT E485598 T1 ATE485598 T1 AT E485598T1 AT 03795528 T AT03795528 T AT 03795528T AT 03795528 T AT03795528 T AT 03795528T AT E485598 T1 ATE485598 T1 AT E485598T1
Authority
AT
Austria
Prior art keywords
wafer
bonding material
microcavity
patterned intermediate
closing
Prior art date
Application number
AT03795528T
Other languages
English (en)
Inventor
Frank Niklaus
Goeran Stemme
Joachim Oberhammer
Original Assignee
Niklaus Consulting
Bonsens Ab
Joachim Oberhammer
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Niklaus Consulting, Bonsens Ab, Joachim Oberhammer filed Critical Niklaus Consulting
Application granted granted Critical
Publication of ATE485598T1 publication Critical patent/ATE485598T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/48—Fillings including materials for absorbing or reacting with moisture or other undesired substances
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00269—Bonding of solid lids or wafers to the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0118—Bonding a wafer on the substrate, i.e. where the cap consists of another wafer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0172—Seals
    • B81C2203/019—Seals characterised by the material or arrangement of seals between parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/038—Bonding techniques not provided for in B81C2203/031 - B81C2203/037

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Micromachines (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
  • Prostheses (AREA)
AT03795528T 2002-09-10 2003-09-10 Verfahren zum verschliessen einer mikrokavität und gehäuse mit mindestens einer mikrokavität ATE485598T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE0202681A SE0202681D0 (sv) 2002-09-10 2002-09-10 Hermetic sealing with combined adhesive bonding and sealing rings
PCT/SE2003/001408 WO2004025727A1 (en) 2002-09-10 2003-09-10 Method for sealing a microcavity and package comprising at least one microcavity

Publications (1)

Publication Number Publication Date
ATE485598T1 true ATE485598T1 (de) 2010-11-15

Family

ID=20288952

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03795528T ATE485598T1 (de) 2002-09-10 2003-09-10 Verfahren zum verschliessen einer mikrokavität und gehäuse mit mindestens einer mikrokavität

Country Status (7)

Country Link
EP (1) EP1540727B1 (de)
AT (1) ATE485598T1 (de)
AU (1) AU2003258943A1 (de)
DE (1) DE60334628D1 (de)
ES (1) ES2353869T3 (de)
SE (1) SE0202681D0 (de)
WO (1) WO2004025727A1 (de)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7259449B2 (en) 2004-09-27 2007-08-21 Idc, Llc Method and system for sealing a substrate
US7422962B2 (en) * 2004-10-27 2008-09-09 Hewlett-Packard Development Company, L.P. Method of singulating electronic devices
EP1861333B1 (de) * 2004-11-04 2018-12-26 Microchips Biotech, Inc. Druck- und kaltschweissdichtverfahren und -vorrichtungen
US7576426B2 (en) * 2005-04-01 2009-08-18 Skyworks Solutions, Inc. Wafer level package including a device wafer integrated with a passive component
US7561334B2 (en) 2005-12-20 2009-07-14 Qualcomm Mems Technologies, Inc. Method and apparatus for reducing back-glass deflection in an interferometric modulator display device
WO2007120887A2 (en) * 2006-04-13 2007-10-25 Qualcomm Mems Technologies, Inc Packaging a mems device using a frame
US8513789B2 (en) 2006-10-10 2013-08-20 Tessera, Inc. Edge connect wafer level stacking with leads extending along edges
US7829438B2 (en) 2006-10-10 2010-11-09 Tessera, Inc. Edge connect wafer level stacking
US7901989B2 (en) 2006-10-10 2011-03-08 Tessera, Inc. Reconstituted wafer level stacking
US7952195B2 (en) 2006-12-28 2011-05-31 Tessera, Inc. Stacked packages with bridging traces
CN101809739B (zh) 2007-07-27 2014-08-20 泰塞拉公司 具有后应用的衬垫延长部分的重构晶片堆封装
US8551815B2 (en) 2007-08-03 2013-10-08 Tessera, Inc. Stack packages using reconstituted wafers
US8043895B2 (en) 2007-08-09 2011-10-25 Tessera, Inc. Method of fabricating stacked assembly including plurality of stacked microelectronic elements
WO2009038686A2 (en) * 2007-09-14 2009-03-26 Tessera Technologies Hungary Kft. Hermetic wafer level cavity package
DE102007058951B4 (de) * 2007-12-07 2020-03-26 Snaptrack, Inc. MEMS Package
EP2308087B1 (de) 2008-06-16 2020-08-12 Tessera, Inc. Stapelung von kapselungen auf chipmassstab auf waferebene mit randkontakten
GB0817309D0 (en) * 2008-09-19 2008-10-29 Univ Heriot Watt Encapsulation method
CN102422412A (zh) 2009-03-13 2012-04-18 德塞拉股份有限公司 具有穿过结合垫延伸的通路的堆叠式微电子组件
DE102009002363B4 (de) * 2009-04-14 2019-03-07 Robert Bosch Gmbh Verfahren zum Befestigen einer ersten Trägereinrichtung an einer zweiten Trägereinrichtung
SE537499C2 (sv) 2009-04-30 2015-05-26 Silex Microsystems Ab Bondningsmaterialstruktur och process med bondningsmaterialstruktur
JP6117788B2 (ja) 2011-08-25 2017-04-19 マイクロチップス バイオテック，インコーポレイテッド 空間効率的な封じ込めデバイスおよびこれを作成する方法
US10427153B2 (en) 2011-08-25 2019-10-01 Microchips Biotech, Inc. Systems and methods for sealing a plurality of reservoirs of a microchip element with a sealing grid
JP2013165212A (ja) * 2012-02-13 2013-08-22 Adwelds:Kk 電子デバイスの封止構造および接合装置
US8900906B2 (en) 2012-03-08 2014-12-02 Robert Bosch Gmbh Atomic layer deposition strengthening members and method of manufacture
DE102012206869B4 (de) * 2012-04-25 2021-05-27 Robert Bosch Gmbh Mikromechanisches Bauelement und Verfahren zur Herstellung eines mikromechanischen Bauelements
SG11201504886SA (en) 2012-12-21 2015-07-30 Microchips Biotech Inc Implantable medical device for minimally-invasive insertion
JP6387357B2 (ja) 2013-02-28 2018-09-05 マイクロチップス バイオテック，インコーポレイテッド 低侵襲挿入のための植え込み型医療デバイス
US9199838B2 (en) 2013-10-25 2015-12-01 Robert Bosch Gmbh Thermally shorted bolometer
US20190202684A1 (en) * 2017-12-29 2019-07-04 Texas Instruments Incorporated Protective bondline control structure
CN109545766B (zh) * 2018-11-14 2020-08-21 长江存储科技有限责任公司 三维存储器及其制造方法
US10759658B2 (en) 2018-12-10 2020-09-01 Texas Instruments Incorporated Hermetic vertical shear weld wafer bonding

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6499354B1 (en) * 1998-05-04 2002-12-31 Integrated Sensing Systems (Issys), Inc. Methods for prevention, reduction, and elimination of outgassing and trapped gases in micromachined devices
US6062461A (en) * 1998-06-03 2000-05-16 Delphi Technologies, Inc. Process for bonding micromachined wafers using solder
US6519075B2 (en) * 2000-11-03 2003-02-11 Agere Systems Inc. Packaged MEMS device and method for making the same

Also Published As

Publication number Publication date
ES2353869T3 (es) 2011-03-07
AU2003258943A8 (en) 2004-04-30
EP1540727B1 (de) 2010-10-20
EP1540727A1 (de) 2005-06-15
DE60334628D1 (de) 2010-12-02
WO2004025727A1 (en) 2004-03-25
WO2004025727A8 (en) 2004-12-23
SE0202681D0 (sv) 2002-09-10
AU2003258943A1 (en) 2004-04-30

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