ATE486492T1 - Abschirmungs- und wärmeableitungsvorrichtung - Google Patents

Abschirmungs- und wärmeableitungsvorrichtung

Info

Publication number
ATE486492T1
ATE486492T1 AT08715155T AT08715155T ATE486492T1 AT E486492 T1 ATE486492 T1 AT E486492T1 AT 08715155 T AT08715155 T AT 08715155T AT 08715155 T AT08715155 T AT 08715155T AT E486492 T1 ATE486492 T1 AT E486492T1
Authority
AT
Austria
Prior art keywords
shielding
heat sink
heat
conductive
conductive surface
Prior art date
Application number
AT08715155T
Other languages
English (en)
Inventor
Linfang Jin
Liechun Zhou
Original Assignee
Huawei Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Tech Co Ltd filed Critical Huawei Tech Co Ltd
Application granted granted Critical
Publication of ATE486492T1 publication Critical patent/ATE486492T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cookers (AREA)
AT08715155T 2007-04-04 2008-03-05 Abschirmungs- und wärmeableitungsvorrichtung ATE486492T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN200720143737.4U CN201104378Y (zh) 2007-04-04 2007-04-04 屏蔽和散热装置
PCT/CN2008/070419 WO2008122220A1 (fr) 2007-04-04 2008-03-05 Dispositif de blindage et de dissipation thermique

Publications (1)

Publication Number Publication Date
ATE486492T1 true ATE486492T1 (de) 2010-11-15

Family

ID=39830485

Family Applications (1)

Application Number Title Priority Date Filing Date
AT08715155T ATE486492T1 (de) 2007-04-04 2008-03-05 Abschirmungs- und wärmeableitungsvorrichtung

Country Status (6)

Country Link
US (1) US7692927B2 (de)
EP (1) EP2031952B1 (de)
CN (1) CN201104378Y (de)
AT (1) ATE486492T1 (de)
DE (2) DE202008017728U1 (de)
WO (1) WO2008122220A1 (de)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201104378Y (zh) 2007-04-04 2008-08-20 华为技术有限公司 屏蔽和散热装置
JP4842346B2 (ja) * 2009-04-21 2011-12-21 シャープ株式会社 電子部品モジュールおよびその製造方法
CN101873784B (zh) * 2009-04-27 2012-08-08 台达电子工业股份有限公司 电子元件的散热模块及其组装方法
DE102010008553B4 (de) 2010-02-19 2011-09-22 Continental Automotive Gmbh Vorrichtung zur Abschirmung eines Elektronikmoduls
KR101404238B1 (ko) * 2011-06-29 2014-06-05 미쓰비시덴키 가부시키가이샤 전자기기
US8760868B2 (en) * 2011-08-30 2014-06-24 Apple Inc. Electronic device enclosures and heatsink structures with thermal management features
JP5920356B2 (ja) * 2011-10-25 2016-05-18 富士通株式会社 水冷装置、水冷装置を有する電子機器、及び水冷方法
DE102012107668A1 (de) * 2012-08-21 2014-03-20 Epcos Ag Bauelementanordnung
US9439333B2 (en) 2013-01-15 2016-09-06 Genesis Technology Usa, Inc. Heat-dissipating EMI/RFI shield
US9398700B2 (en) * 2013-06-21 2016-07-19 Invensas Corporation Method of forming a reliable microelectronic assembly
KR102172314B1 (ko) 2013-11-12 2020-10-30 삼성전자주식회사 반도체 장치
CN104813760B (zh) * 2014-03-18 2018-02-02 华为终端（东莞）有限公司 一种散热组件及电子设备
CN105338783B (zh) * 2014-07-01 2018-08-31 联想(北京)有限公司 一种电子设备以及用于电子设备的散热装置
WO2016058182A1 (zh) 2014-10-17 2016-04-21 华为技术有限公司 散热屏蔽结构及通信产品
CN105764302B (zh) * 2014-12-18 2019-12-13 中兴通讯股份有限公司 一种导热垫、散热器和散热组件
JP6330690B2 (ja) * 2015-02-19 2018-05-30 株式会社オートネットワーク技術研究所 基板ユニット
CN204721769U (zh) * 2015-05-14 2015-10-21 中兴通讯股份有限公司 移动通信终端
US10104806B2 (en) * 2015-09-04 2018-10-16 Toshiba Memory Corporation Semiconductor storage device
KR102473586B1 (ko) * 2015-10-27 2022-12-05 삼성전자주식회사 방열장치를 포함하는 디스플레이 기기 및 전자 기기
CN106686962B (zh) * 2015-11-09 2023-08-29 天津莱尔德电子材料有限公司 可用作bls盖的导电多孔材料
CN106876347B (zh) * 2015-12-11 2019-05-21 青岛海尔多媒体有限公司 一种外设模块及外设模块连接装置
US9913361B2 (en) 2016-01-06 2018-03-06 International Business Machines Corporation Integrated circuit device assembly
WO2017131688A1 (en) * 2016-01-28 2017-08-03 Hewlett Packard Enterprise Development Lp Heat transfer adapter plate
CN107105596A (zh) * 2016-02-23 2017-08-29 中兴通讯股份有限公司 散热组件
CN205389320U (zh) * 2016-03-23 2016-07-20 乐视控股（北京）有限公司 一种散热屏蔽装置
WO2017164873A1 (en) * 2016-03-24 2017-09-28 Intel Corporation Electrical devices and methods for forming electrical devices
CN106304819A (zh) * 2016-08-23 2017-01-04 昆山市中迪新材料技术有限公司 一种具有散热功能的屏蔽器件及其制备方法
CN106413369A (zh) * 2016-10-31 2017-02-15 努比亚技术有限公司 一种屏蔽罩及电路板
JP6096977B1 (ja) * 2016-11-11 2017-03-15 シナノケンシ株式会社 電動ポンプ
CN106850883B (zh) 2016-12-20 2020-03-24 Oppo广东移动通信有限公司 支架组件、功能模组及移动终端
US20180199453A1 (en) * 2017-01-10 2018-07-12 Whisker Labs, Inc. Electronics enclosure
WO2019000162A1 (en) * 2017-06-26 2019-01-03 Thomson Licensing ELECTROMAGNETIC SHIELDING OF ELECTRONIC DEVICE
CN107172872B (zh) * 2017-06-26 2024-02-13 上海传英信息技术有限公司 电子终端的散热装置与电子终端
US10649503B2 (en) * 2017-06-29 2020-05-12 Qualcomm Incorporated Device comprising compressed thermal interface material (TIM) and electromagnetic (EMI) shield comprising flexible portion
CN109561641B (zh) * 2017-09-27 2021-03-02 北京小米移动软件有限公司 屏蔽罩、印制电路板及电子设备
US10999957B2 (en) * 2018-02-12 2021-05-04 Samsung Electro-Mechanics Co., Ltd. Communication module and mounting structure thereof
JP7208720B2 (ja) * 2018-06-21 2023-01-19 デクセリアルズ株式会社 半導体装置及び半導体装置の製造方法
US10674646B1 (en) * 2019-10-25 2020-06-02 Aliner Industries Inc. EMI shield with increased heat dissipating effect
CN113498296B (zh) * 2020-03-20 2024-08-23 上海禾赛科技有限公司 具有导热装置的电路结构及其制作方法
CN117178357A (zh) * 2021-03-08 2023-12-05 特斯拉公司 减少静电放电和/或电磁干扰影响的部件的冷却片上系统
CN115023099B (zh) * 2021-11-10 2023-11-21 荣耀终端有限公司 电子设备
CN115413157A (zh) * 2022-08-05 2022-11-29 深圳移航通信技术有限公司 电子装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5241453A (en) * 1991-11-18 1993-08-31 The Whitaker Corporation EMI shielding device
US5357404A (en) * 1991-11-18 1994-10-18 The Whitaker Corporation EMI shield, and assembly using same
US6507101B1 (en) * 1999-03-26 2003-01-14 Hewlett-Packard Company Lossy RF shield for integrated circuits
US6229702B1 (en) * 1999-06-02 2001-05-08 Advanced Semiconductor Engineering, Inc. Ball grid array semiconductor package having improved heat dissipation efficiency, overall electrical performance and enhanced bonding capability
US6377474B1 (en) * 2000-01-13 2002-04-23 International Business Corporation Electrical grounding schemes for socketed processor and heatsink assembly
US6577504B1 (en) * 2000-08-30 2003-06-10 Intel Corporation Integrated heat sink for different size components with EMI suppression features
US20040052064A1 (en) * 2001-11-15 2004-03-18 Oliver Michael J. Electromagnetic shielding and cooling device for printed circuit board
TW511885U (en) * 2002-01-30 2002-11-21 Hon Hai Prec Ind Co Ltd Assembly of heat dissipation apparatus
JP4251452B2 (ja) * 2002-03-06 2009-04-08 タイコ・エレクトロニクス・コーポレイション トランシーバモジュール組立体のイジェクタ機構
US6744640B2 (en) * 2002-04-10 2004-06-01 Gore Enterprise Holdings, Inc. Board-level EMI shield with enhanced thermal dissipation
US7245896B2 (en) * 2002-06-24 2007-07-17 Lg Electronics Inc. Apparatus for improving reception sensitivity of public wave receiver by reducing noise externally-emitted in the public wave receiver
US6992894B1 (en) * 2003-03-17 2006-01-31 Unisys Corporation Method and apparatus for EMI shielding
JP4469563B2 (ja) * 2003-06-05 2010-05-26 株式会社ソニー・コンピュータエンタテインメント 電子機器、電磁波放射抑制部材
US6858796B1 (en) * 2003-09-29 2005-02-22 Sun Microsystems, Inc. Grounding mechanism retention feature
JP3641632B1 (ja) * 2003-10-06 2005-04-27 Ｆｃｍ株式会社 導電性シート、それを用いた製品およびその製造方法
US7327577B2 (en) * 2005-11-03 2008-02-05 International Business Machines Corporation Method and apparatus for grounding a heat sink in thermal contact with an electronic component using a grounding spring having multiple-jointed spring fingers
CN201104378Y (zh) 2007-04-04 2008-08-20 华为技术有限公司 屏蔽和散热装置

Also Published As

Publication number Publication date
DE602008003166D1 (de) 2010-12-09
WO2008122220A1 (fr) 2008-10-16
DE202008017728U1 (de) 2010-05-12
US7692927B2 (en) 2010-04-06
CN201104378Y (zh) 2008-08-20
US20090040731A1 (en) 2009-02-12
EP2031952A1 (de) 2009-03-04
EP2031952B1 (de) 2010-10-27
EP2031952A4 (de) 2009-06-17

Similar Documents

Publication Publication Date Title
ATE486492T1 (de) Abschirmungs- und wärmeableitungsvorrichtung
CN204069618U (zh) 一种电磁屏蔽罩及电路板
US8619428B2 (en) Electronic package structure
EP1884992A4 (de) Leiterplatte
WO2007002760A3 (en) Top-surface-mount power light emitter with integral heat sink
TW200419752A (en) Semiconductor package with heat sink
JP2017135368A5 (de)
MY195758A (en) Electronic Device Including Cooling Structure
ATE476753T1 (de) Electronische einrichtung, informationsprozessor und anordnung zum unterdrücken von elektromagnetischen störungen
ATE532400T1 (de) Wärmeleitendes montageelement zur anbringung einer bestückten leiterplatte an einem kühlkörper
TW200742524A (en) Multilayer printed circuit board
TW200633632A (en) Shielding structure
TW200731576A (en) Electronic component substrate and method for manufacturing the same
TW200713535A (en) Packaging configurations for vertical electronic devices using conductive traces disposed on laminated board layers
ATE540561T1 (de) Leiterplatte und herstellungsverfahren dafür
CN104582430A (zh) 具有附连到散热器的焊料球体的电气组件
ATE426318T1 (de) Leiterplatte
US8879264B2 (en) Stacked heat dissipating module of an electronic device
TWI267173B (en) Circuit device and method for manufacturing thereof
JP2008091817A5 (de)
KR101602706B1 (ko) 방열 금속이 부착된 임베디드 기판 및 그 제작 방법
EP1715732A3 (de) Gedruckte Leiterplattenstruktur mit einer Schicht auf einer ihrer Oberflächen zur Wärmeableitung durch Konvektion
TWI491329B (zh) 電路板模組
CN204425774U (zh) 一种适用于铝基电路板的直插式端子
TW200644784A (en) The use of solder paste for heat dissipation

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties