ATE489732T1 - Verfahren zur lasertrassierung - Google Patents
Verfahren zur lasertrassierungInfo
- Publication number
- ATE489732T1 ATE489732T1 AT07732971T AT07732971T ATE489732T1 AT E489732 T1 ATE489732 T1 AT E489732T1 AT 07732971 T AT07732971 T AT 07732971T AT 07732971 T AT07732971 T AT 07732971T AT E489732 T1 ATE489732 T1 AT E489732T1
- Authority
- AT
- Austria
- Prior art keywords
- panel
- lines
- scribe lines
- scribe
- unit
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special environment or atmosphere, e.g. in an enclosure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special environment or atmosphere, e.g. in an enclosure
- B23K26/1224—Working by laser beam, e.g. welding, cutting or boring in a special environment or atmosphere, e.g. in an enclosure in vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special environment or atmosphere, e.g. in an enclosure
- B23K26/123—Working by laser beam, e.g. welding, cutting or boring in a special environment or atmosphere, e.g. in an enclosure in an atmosphere of particular gases
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Photovoltaic Devices (AREA)
- Lasers (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB0611738A GB2439962B (en) | 2006-06-14 | 2006-06-14 | Process and apparatus for laser scribing |
| PCT/GB2007/001952 WO2007144565A2 (en) | 2006-06-14 | 2007-05-25 | Process for laser scribing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE489732T1 true ATE489732T1 (de) | 2010-12-15 |
Family
ID=36775601
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT07732971T ATE489732T1 (de) | 2006-06-14 | 2007-05-25 | Verfahren zur lasertrassierung |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US7964820B2 (de) |
| EP (1) | EP2027606B1 (de) |
| JP (1) | JP2009539618A (de) |
| KR (1) | KR20090064511A (de) |
| CN (1) | CN101506999B (de) |
| AT (1) | ATE489732T1 (de) |
| DE (1) | DE602007010771D1 (de) |
| GB (1) | GB2439962B (de) |
| TW (1) | TWI317176B (de) |
| WO (1) | WO2007144565A2 (de) |
Families Citing this family (68)
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| GB0622232D0 (en) * | 2006-11-08 | 2006-12-20 | Rumsby Philip T | Method and apparatus for laser beam alignment for solar panel scribing |
| GB0802289D0 (en) * | 2008-02-07 | 2008-03-12 | Rumsby Philip T | Method and appartus for making a partially transparent solar panel |
| DE102008014258B4 (de) * | 2008-03-13 | 2009-10-29 | Schott Solar Gmbh | Verfahren zur Bildung der Trennlinien eines photovoltaischen Moduls mit serienverschalteten Zellen |
| DE102008014263A1 (de) * | 2008-03-13 | 2009-09-24 | Schott Solar Gmbh | Verfahren und Vorrichtung zur Bildung der Trennlinien eines fotovoltaischen Moduls mit serienverschalteten Zellen |
| TW201002466A (en) * | 2008-04-10 | 2010-01-16 | Applied Materials Inc | Laser-scribing platform |
| TW201006600A (en) * | 2008-04-10 | 2010-02-16 | Applied Materials Inc | Laser-scribing platform and hybrid writing strategy |
| CN101999166A (zh) * | 2008-04-11 | 2011-03-30 | 应用材料股份有限公司 | 用于激光刻划、熔接或任何构图系统的动态刻划对准 |
| TW201006598A (en) * | 2008-04-11 | 2010-02-16 | Applied Materials Inc | Laser scribe inspection methods and systems |
| US20090314752A1 (en) * | 2008-05-14 | 2009-12-24 | Applied Materials, Inc. | In-situ monitoring for laser ablation |
| US20110126688A1 (en) * | 2008-05-26 | 2011-06-02 | Masanobu Soyama | Scribing apparatus for thin film solar cell |
| US8258427B2 (en) * | 2008-05-30 | 2012-09-04 | Corning Incorporated | Laser cutting of glass along a predetermined line |
| DE102008032555B3 (de) * | 2008-07-10 | 2010-01-21 | Innolas Systems Gmbh | Strukturierungsvorrichtung für die Strukturierung von plattenförmigen Elementen, insbesondere von Dünnschicht-Solarmodulen, entsprechendes Strukturierungsverfahren sowie Verwendung derselben |
| DE102008059813A1 (de) * | 2008-07-17 | 2010-01-21 | Lss Laser Scribing Systems Ag | Laser-Scribing-System zum Strukturieren von Substraten für Dünnschichtsolarmodule |
| JP5372429B2 (ja) * | 2008-08-05 | 2013-12-18 | 株式会社ディスコ | 板状物の分割方法 |
| EP2332177A4 (de) * | 2008-09-29 | 2012-12-26 | Thinsilicon Corp | Monolithisch integriertes solarmodul |
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| JP5253217B2 (ja) * | 2009-02-13 | 2013-07-31 | 株式会社日立ハイテクノロジーズ | 基板アライメント方法、基板アライメント装置、レーザ加工裝置及びソーラパネル製造方法 |
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| KR101029095B1 (ko) | 2009-03-20 | 2011-04-13 | 주식회사 셀코스 | In-situ 레이저 스크라이빙 장치 |
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| US20100269853A1 (en) * | 2009-04-27 | 2010-10-28 | Applied Materials, Inc. | Debris-extraction exhaust system |
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| JP2001241421A (ja) | 2000-02-29 | 2001-09-07 | Nitto Seiko Co Ltd | ねじおよび製品の解体方法 |
| US20030044539A1 (en) * | 2001-02-06 | 2003-03-06 | Oswald Robert S. | Process for producing photovoltaic devices |
| JP2002261315A (ja) * | 2001-03-05 | 2002-09-13 | Kanegafuchi Chem Ind Co Ltd | 薄膜光電変換モジュールの製造方法 |
| US6559411B2 (en) * | 2001-08-10 | 2003-05-06 | First Solar, Llc | Method and apparatus for laser scribing glass sheet substrate coatings |
| CN1424594A (zh) * | 2001-12-11 | 2003-06-18 | 中国科学院光电技术研究所 | 用激光直写装置制造光栅的方法 |
| US7259321B2 (en) | 2002-01-07 | 2007-08-21 | Bp Corporation North America Inc. | Method of manufacturing thin film photovoltaic modules |
| US20050109747A1 (en) * | 2002-02-25 | 2005-05-26 | Alexander Dennis R. | Laser scribing and machining of materials |
| JP4110219B2 (ja) * | 2002-08-30 | 2008-07-02 | 株式会社東京精密 | レーザーダイシング装置 |
| JP2004170455A (ja) * | 2002-11-15 | 2004-06-17 | Mitsubishi Heavy Ind Ltd | レーザ加工装置、レーザ加工システム及び太陽電池 |
| JP2005081392A (ja) * | 2003-09-09 | 2005-03-31 | Fuji Electric Holdings Co Ltd | レーザ加工方法およびレーザ加工装置 |
| CN100371834C (zh) * | 2003-11-26 | 2008-02-27 | 中国科学院长春光学精密机械与物理研究所 | 一种平面全息光栅制作中精确控制刻线密度的方法 |
| JP4713100B2 (ja) * | 2004-07-29 | 2011-06-29 | 株式会社カネカ | 光電変換装置の製造方法及び光電変換装置 |
| CN100495081C (zh) * | 2005-11-04 | 2009-06-03 | 中国科学院上海光学精密机械研究所 | 制备纳米光栅的装置和方法 |
| US7977601B2 (en) * | 2005-11-28 | 2011-07-12 | Electro Scientific Industries, Inc. | X and Y orthogonal cut direction processing with set beam separation using 45 degree beam split orientation apparatus and method |
-
2006
- 2006-06-14 GB GB0611738A patent/GB2439962B/en not_active Expired - Fee Related
-
2007
- 2007-05-25 AT AT07732971T patent/ATE489732T1/de not_active IP Right Cessation
- 2007-05-25 DE DE602007010771T patent/DE602007010771D1/de active Active
- 2007-05-25 CN CN2007800280227A patent/CN101506999B/zh not_active Expired - Fee Related
- 2007-05-25 EP EP07732971A patent/EP2027606B1/de not_active Not-in-force
- 2007-05-25 KR KR1020087030460A patent/KR20090064511A/ko not_active Withdrawn
- 2007-05-25 WO PCT/GB2007/001952 patent/WO2007144565A2/en not_active Ceased
- 2007-05-25 JP JP2009514872A patent/JP2009539618A/ja active Pending
- 2007-05-28 TW TW096118931A patent/TWI317176B/zh active
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2008
- 2008-01-16 US US12/015,145 patent/US7964820B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| GB0611738D0 (en) | 2006-07-26 |
| TWI317176B (en) | 2009-11-11 |
| JP2009539618A (ja) | 2009-11-19 |
| US20090188543A1 (en) | 2009-07-30 |
| WO2007144565A2 (en) | 2007-12-21 |
| US7964820B2 (en) | 2011-06-21 |
| DE602007010771D1 (de) | 2011-01-05 |
| CN101506999B (zh) | 2011-08-31 |
| EP2027606B1 (de) | 2010-11-24 |
| WO2007144565A3 (en) | 2008-02-14 |
| EP2027606A2 (de) | 2009-02-25 |
| GB2439962A (en) | 2008-01-16 |
| CN101506999A (zh) | 2009-08-12 |
| KR20090064511A (ko) | 2009-06-19 |
| GB2439962B (en) | 2008-09-24 |
| TW200812097A (en) | 2008-03-01 |
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