ATE490550T1 - Gehäuseklemmeinheit - Google Patents

Gehäuseklemmeinheit

Info

Publication number
ATE490550T1
ATE490550T1 AT07006438T AT07006438T ATE490550T1 AT E490550 T1 ATE490550 T1 AT E490550T1 AT 07006438 T AT07006438 T AT 07006438T AT 07006438 T AT07006438 T AT 07006438T AT E490550 T1 ATE490550 T1 AT E490550T1
Authority
AT
Austria
Prior art keywords
pod
support table
engagement portion
interior
wafer
Prior art date
Application number
AT07006438T
Other languages
English (en)
Inventor
Toshihiko Miyajima
Jun Emoto
Hidetoshi Horibe
Original Assignee
Tdk Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tdk Corp filed Critical Tdk Corp
Application granted granted Critical
Publication of ATE490550T1 publication Critical patent/ATE490550T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3218—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1918—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3406—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door or cover
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3408—Docking arrangements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Input Circuits Of Receivers And Coupling Of Receivers And Audio Equipment (AREA)
  • Installation Of Indoor Wiring (AREA)
  • Vehicle Body Suspensions (AREA)
AT07006438T 2006-03-29 2007-03-28 Gehäuseklemmeinheit ATE490550T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006089922A JP4338205B2 (ja) 2006-03-29 2006-03-29 ポッドクランプユニット、ポッドクランプユニットを有するロードポート、ポッド及びロードポートを有するミニエンバイロンメントシステム

Publications (1)

Publication Number Publication Date
ATE490550T1 true ATE490550T1 (de) 2010-12-15

Family

ID=38231145

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07006438T ATE490550T1 (de) 2006-03-29 2007-03-28 Gehäuseklemmeinheit

Country Status (6)

Country Link
US (1) US7927058B2 (de)
EP (1) EP1840954B1 (de)
JP (1) JP4338205B2 (de)
KR (1) KR100896843B1 (de)
AT (1) ATE490550T1 (de)
DE (1) DE602007010858D1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5676168B2 (ja) * 2010-07-14 2015-02-25 株式会社ディスコ 研削装置
JP5617708B2 (ja) * 2011-03-16 2014-11-05 東京エレクトロン株式会社 蓋体開閉装置
JP5565389B2 (ja) * 2011-07-29 2014-08-06 Ｔｄｋ株式会社 ロードポート装置及び当該装置に用いられるクランプ装置
WO2013050805A1 (de) * 2011-10-06 2013-04-11 Roth & Rau Ag Substratwendeeinrichtung
JP6554872B2 (ja) * 2015-03-31 2019-08-07 Tdk株式会社 ガスパージ装置、ロードポート装置、パージ対象容器の設置台およびガスパージ方法
KR102592920B1 (ko) * 2018-07-16 2023-10-23 삼성전자주식회사 로드락 모듈 및 이를 포함하는 반도체 제조 장치
KR102126466B1 (ko) * 2018-09-27 2020-06-24 크린팩토메이션 주식회사 이에프이엠
TWI848670B (zh) * 2022-06-30 2024-07-11 家登精密工業股份有限公司 保護包裝組件
JP7886812B2 (ja) * 2022-12-14 2026-07-08 信越ポリマー株式会社 基板収納容器

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54152594A (en) * 1978-05-23 1979-11-30 Ishikawajima Harima Heavy Ind Co Ltd Take out device for goods-delivery box
JP3076831B2 (ja) 1989-11-22 2000-08-14 日本テキサス・インスツルメンツ株式会社 素子試験装置
US5137063A (en) * 1990-02-05 1992-08-11 Texas Instruments Incorporated Vented vacuum semiconductor wafer cassette
US5302078A (en) * 1992-02-05 1994-04-12 Alpha Enterprises, Inc. Audiocassette automatic unloading machine
JPH07183354A (ja) 1993-12-24 1995-07-21 Tokyo Electron Ltd 基板の搬送システム及び基板の搬送方法
JP2000016583A (ja) 1998-07-03 2000-01-18 Shinko Electric Co Ltd 半導体ウエハー搬送容器装着装置
US6501070B1 (en) * 1998-07-13 2002-12-31 Newport Corporation Pod load interface equipment adapted for implementation in a fims system
US7147424B2 (en) * 2000-07-07 2006-12-12 Applied Materials, Inc. Automatic door opener
US20020044859A1 (en) * 2000-08-28 2002-04-18 Shinsung Eng Corporation FOUP loading apparatus for FOUP opener
US6676356B2 (en) * 2000-09-18 2004-01-13 Tokyo Electron Limited Device for attaching target substrate transfer container to semiconductor processing apparatus
JP4555918B2 (ja) 2000-09-18 2010-10-06 東京エレクトロン株式会社 ウェハ搬送容器装着装置
US7360985B2 (en) * 2002-12-30 2008-04-22 Tdk Corporation Wafer processing apparatus including clean box stopping mechanism
JP4261951B2 (ja) 2003-03-26 2009-05-13 大日本スクリーン製造株式会社 基板処理装置
JP3888991B2 (ja) 2003-10-23 2007-03-07 Ｔｄｋ株式会社 ポッドオープナにおけるポッドクランプユニット、ポッドクランプユニットに対応するポッドおよびポッドクランプユニットを用いたクランプ機構およびクランプ方法
JP3917138B2 (ja) 2004-01-23 2007-05-23 Ｔｄｋ株式会社 ポッドオープナのポッドクランプユニット、当該ポッドクランプユニットを用いたポッドクランプ機構及びクランプ方法
US7621714B2 (en) 2003-10-23 2009-11-24 Tdk Corporation Pod clamping unit in pod opener, pod corresponding to pod clamping unit, and clamping mechanism and clamping method using pod clamping unit
KR100583726B1 (ko) 2003-11-12 2006-05-25 삼성전자주식회사 기판 처리 장치 및 기판 처리 방법
US7793906B2 (en) * 2008-03-31 2010-09-14 Shinko Electric Co., Ltd. Clamping mechanism

Also Published As

Publication number Publication date
US20070231112A1 (en) 2007-10-04
EP1840954B1 (de) 2010-12-01
DE602007010858D1 (de) 2011-01-13
JP4338205B2 (ja) 2009-10-07
US7927058B2 (en) 2011-04-19
KR20070098668A (ko) 2007-10-05
EP1840954A1 (de) 2007-10-03
KR100896843B1 (ko) 2009-05-12
JP2007266341A (ja) 2007-10-11

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Legal Events

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