ATE490550T1 - Gehäuseklemmeinheit - Google Patents
GehäuseklemmeinheitInfo
- Publication number
- ATE490550T1 ATE490550T1 AT07006438T AT07006438T ATE490550T1 AT E490550 T1 ATE490550 T1 AT E490550T1 AT 07006438 T AT07006438 T AT 07006438T AT 07006438 T AT07006438 T AT 07006438T AT E490550 T1 ATE490550 T1 AT E490550T1
- Authority
- AT
- Austria
- Prior art keywords
- pod
- support table
- engagement portion
- interior
- wafer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
- H10P72/3218—Conveying cassettes, containers or carriers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
- H10P72/1918—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3406—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door or cover
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3408—Docking arrangements
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/14—Wafer cassette transporting
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Input Circuits Of Receivers And Coupling Of Receivers And Audio Equipment (AREA)
- Installation Of Indoor Wiring (AREA)
- Vehicle Body Suspensions (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006089922A JP4338205B2 (ja) | 2006-03-29 | 2006-03-29 | ポッドクランプユニット、ポッドクランプユニットを有するロードポート、ポッド及びロードポートを有するミニエンバイロンメントシステム |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE490550T1 true ATE490550T1 (de) | 2010-12-15 |
Family
ID=38231145
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT07006438T ATE490550T1 (de) | 2006-03-29 | 2007-03-28 | Gehäuseklemmeinheit |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7927058B2 (de) |
| EP (1) | EP1840954B1 (de) |
| JP (1) | JP4338205B2 (de) |
| KR (1) | KR100896843B1 (de) |
| AT (1) | ATE490550T1 (de) |
| DE (1) | DE602007010858D1 (de) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5676168B2 (ja) * | 2010-07-14 | 2015-02-25 | 株式会社ディスコ | 研削装置 |
| JP5617708B2 (ja) * | 2011-03-16 | 2014-11-05 | 東京エレクトロン株式会社 | 蓋体開閉装置 |
| JP5565389B2 (ja) * | 2011-07-29 | 2014-08-06 | Ｔｄｋ株式会社 | ロードポート装置及び当該装置に用いられるクランプ装置 |
| WO2013050805A1 (de) * | 2011-10-06 | 2013-04-11 | Roth & Rau Ag | Substratwendeeinrichtung |
| JP6554872B2 (ja) * | 2015-03-31 | 2019-08-07 | Tdk株式会社 | ガスパージ装置、ロードポート装置、パージ対象容器の設置台およびガスパージ方法 |
| KR102592920B1 (ko) | 2018-07-16 | 2023-10-23 | 삼성전자주식회사 | 로드락 모듈 및 이를 포함하는 반도체 제조 장치 |
| KR102126466B1 (ko) * | 2018-09-27 | 2020-06-24 | 크린팩토메이션 주식회사 | 이에프이엠 |
| JP2024085031A (ja) * | 2022-12-14 | 2024-06-26 | 信越ポリマー株式会社 | 基板収納容器 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54152594A (en) * | 1978-05-23 | 1979-11-30 | Ishikawajima Harima Heavy Ind Co Ltd | Take out device for goods-delivery box |
| JP3076831B2 (ja) | 1989-11-22 | 2000-08-14 | 日本テキサス・インスツルメンツ株式会社 | 素子試験装置 |
| US5137063A (en) * | 1990-02-05 | 1992-08-11 | Texas Instruments Incorporated | Vented vacuum semiconductor wafer cassette |
| US5302078A (en) * | 1992-02-05 | 1994-04-12 | Alpha Enterprises, Inc. | Audiocassette automatic unloading machine |
| JPH07183354A (ja) | 1993-12-24 | 1995-07-21 | Tokyo Electron Ltd | 基板の搬送システム及び基板の搬送方法 |
| JP2000016583A (ja) | 1998-07-03 | 2000-01-18 | Shinko Electric Co Ltd | 半導体ウエハー搬送容器装着装置 |
| US6501070B1 (en) * | 1998-07-13 | 2002-12-31 | Newport Corporation | Pod load interface equipment adapted for implementation in a fims system |
| US7147424B2 (en) * | 2000-07-07 | 2006-12-12 | Applied Materials, Inc. | Automatic door opener |
| US20020044859A1 (en) * | 2000-08-28 | 2002-04-18 | Shinsung Eng Corporation | FOUP loading apparatus for FOUP opener |
| US6676356B2 (en) * | 2000-09-18 | 2004-01-13 | Tokyo Electron Limited | Device for attaching target substrate transfer container to semiconductor processing apparatus |
| JP4555918B2 (ja) | 2000-09-18 | 2010-10-06 | 東京エレクトロン株式会社 | ウェハ搬送容器装着装置 |
| US7360985B2 (en) * | 2002-12-30 | 2008-04-22 | Tdk Corporation | Wafer processing apparatus including clean box stopping mechanism |
| JP4261951B2 (ja) | 2003-03-26 | 2009-05-13 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| JP3888991B2 (ja) | 2003-10-23 | 2007-03-07 | Ｔｄｋ株式会社 | ポッドオープナにおけるポッドクランプユニット、ポッドクランプユニットに対応するポッドおよびポッドクランプユニットを用いたクランプ機構およびクランプ方法 |
| US7621714B2 (en) * | 2003-10-23 | 2009-11-24 | Tdk Corporation | Pod clamping unit in pod opener, pod corresponding to pod clamping unit, and clamping mechanism and clamping method using pod clamping unit |
| JP3917138B2 (ja) | 2004-01-23 | 2007-05-23 | Ｔｄｋ株式会社 | ポッドオープナのポッドクランプユニット、当該ポッドクランプユニットを用いたポッドクランプ機構及びクランプ方法 |
| KR100583726B1 (ko) | 2003-11-12 | 2006-05-25 | 삼성전자주식회사 | 기판 처리 장치 및 기판 처리 방법 |
| US7793906B2 (en) * | 2008-03-31 | 2010-09-14 | Shinko Electric Co., Ltd. | Clamping mechanism |
-
2006
- 2006-03-29 JP JP2006089922A patent/JP4338205B2/ja not_active Expired - Fee Related
-
2007
- 2007-03-27 US US11/691,683 patent/US7927058B2/en active Active
- 2007-03-28 DE DE602007010858T patent/DE602007010858D1/de active Active
- 2007-03-28 AT AT07006438T patent/ATE490550T1/de not_active IP Right Cessation
- 2007-03-28 EP EP07006438A patent/EP1840954B1/de active Active
- 2007-03-29 KR KR1020070030952A patent/KR100896843B1/ko active Active
Also Published As
| Publication number | Publication date |
|---|---|
| DE602007010858D1 (de) | 2011-01-13 |
| US7927058B2 (en) | 2011-04-19 |
| JP2007266341A (ja) | 2007-10-11 |
| JP4338205B2 (ja) | 2009-10-07 |
| KR20070098668A (ko) | 2007-10-05 |
| US20070231112A1 (en) | 2007-10-04 |
| EP1840954A1 (de) | 2007-10-03 |
| KR100896843B1 (ko) | 2009-05-12 |
| EP1840954B1 (de) | 2010-12-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |