ATE494768T1 - Verfahren zum tragen von elektronischen komponenten und elektronische vorrichtung und elastische haltevorrichtung für ein elektronisches bauelement - Google Patents

Verfahren zum tragen von elektronischen komponenten und elektronische vorrichtung und elastische haltevorrichtung für ein elektronisches bauelement

Info

Publication number
ATE494768T1
ATE494768T1 AT02388071T AT02388071T ATE494768T1 AT E494768 T1 ATE494768 T1 AT E494768T1 AT 02388071 T AT02388071 T AT 02388071T AT 02388071 T AT02388071 T AT 02388071T AT E494768 T1 ATE494768 T1 AT E494768T1
Authority
AT
Austria
Prior art keywords
electronic
pcb
electronic component
structural element
elastic holding
Prior art date
Application number
AT02388071T
Other languages
English (en)
Inventor
Per Holmberg
Original Assignee
Sony Ericsson Mobile Comm Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Ericsson Mobile Comm Ab filed Critical Sony Ericsson Mobile Comm Ab
Application granted granted Critical
Publication of ATE494768T1 publication Critical patent/ATE494768T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistors by means of a mounting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10393—Clamping a component by an element or a set of elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2045—Protection against vibrations

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Mounting Components In General For Electric Apparatus (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Casings For Electric Apparatus (AREA)
AT02388071T 2002-11-19 2002-11-19 Verfahren zum tragen von elektronischen komponenten und elektronische vorrichtung und elastische haltevorrichtung für ein elektronisches bauelement ATE494768T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP02388071A EP1422985B1 (de) 2002-11-19 2002-11-19 Verfahren zum Tragen von elektronischen Komponenten und Elektronische Vorrichtung und elastische Haltevorrichtung für ein elektronisches Bauelement

Publications (1)

Publication Number Publication Date
ATE494768T1 true ATE494768T1 (de) 2011-01-15

Family

ID=32187283

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02388071T ATE494768T1 (de) 2002-11-19 2002-11-19 Verfahren zum tragen von elektronischen komponenten und elektronische vorrichtung und elastische haltevorrichtung für ein elektronisches bauelement

Country Status (5)

Country Link
EP (1) EP1422985B1 (de)
JP (1) JP4713154B2 (de)
CN (1) CN101189928B (de)
AT (1) ATE494768T1 (de)
DE (1) DE60238844D1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010245561A (ja) * 2010-07-13 2010-10-28 Fujitsu Media Device Kk 電子部品の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0340959B1 (de) * 1988-05-06 1994-12-28 Digital Equipment Corporation Schaltungschipspackung zum Schützen gegen elektromagnetische Interferenzen, elektrostatische Entladungen und thermische und mechanische Spannungen
JPH1041678A (ja) * 1996-07-25 1998-02-13 Hitachi Ltd 光受信器
FR2798553B1 (fr) * 1999-09-14 2001-10-12 Sagem Dispositif de protection de composants electroniques
JP2001326492A (ja) * 2000-05-17 2001-11-22 Casio Comput Co Ltd 熱および電磁ノイズ兼用対策部品、および電子機器
US6570086B1 (en) * 2000-06-06 2003-05-27 Mitsubishi Denki Kabushiki Kaisha Cooling structure of communication device
JP4447155B2 (ja) * 2000-12-18 2010-04-07 Ｆｄｋ株式会社 電磁波抑制熱伝導シート

Also Published As

Publication number Publication date
CN101189928B (zh) 2010-12-01
EP1422985B1 (de) 2011-01-05
CN101189928A (zh) 2008-05-28
JP4713154B2 (ja) 2011-06-29
EP1422985A1 (de) 2004-05-26
DE60238844D1 (de) 2011-02-17
JP2006514427A (ja) 2006-04-27

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Legal Events

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