ATE494995T1 - Schneidgerät - Google Patents

Schneidgerät

Info

Publication number
ATE494995T1
ATE494995T1 AT09158581T AT09158581T ATE494995T1 AT E494995 T1 ATE494995 T1 AT E494995T1 AT 09158581 T AT09158581 T AT 09158581T AT 09158581 T AT09158581 T AT 09158581T AT E494995 T1 ATE494995 T1 AT E494995T1
Authority
AT
Austria
Prior art keywords
base
plate devices
wire
carrier
adhesive layer
Prior art date
Application number
AT09158581T
Other languages
English (en)
Inventor
Yueh-Ju Lee
Original Assignee
Htc Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Htc Corp filed Critical Htc Corp
Application granted granted Critical
Publication of ATE494995T1 publication Critical patent/ATE494995T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
    • B26D1/547—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a wire-like cutting member
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
    • B26D3/28—Splitting layers from work; Mutually separating layers by cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/01—Means for holding or positioning work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/06—Arrangements for feeding or delivering work of other than sheet, web, or filamentary form
    • B26D7/0616—Arrangements for feeding or delivering work of other than sheet, web, or filamentary form by carriages, e.g. for slicing machines
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes
    • Y10T83/0405—With preparatory or simultaneous ancillary treatment of work
    • Y10T83/041—By heating or cooling
    • Y10T83/0414—At localized area [e.g., line of separation]

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Confectionery (AREA)
  • Control And Other Processes For Unpacking Of Materials (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Adhesive Tapes (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Details Of Cutting Devices (AREA)
  • Surgical Instruments (AREA)
AT09158581T 2009-02-10 2009-04-23 Schneidgerät ATE494995T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW098104139A TWI350790B (en) 2009-02-10 2009-02-10 Cutting apparatus

Publications (1)

Publication Number Publication Date
ATE494995T1 true ATE494995T1 (de) 2011-01-15

Family

ID=41181070

Family Applications (1)

Application Number Title Priority Date Filing Date
AT09158581T ATE494995T1 (de) 2009-02-10 2009-04-23 Schneidgerät

Country Status (5)

Country Link
US (1) US20100199818A1 (de)
EP (1) EP2216147B1 (de)
AT (1) ATE494995T1 (de)
DE (1) DE602009000572D1 (de)
TW (1) TWI350790B (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITMI20061737A1 (it) * 2006-09-12 2008-03-13 Snam Progetti Procedimento per il trasporto di zolfo a basso rischio e ad emissione zero da depositi di zolfo solido in blocchi di notevoli dimensioni
TWI452554B (zh) * 2012-02-29 2014-09-11 Au Optronics Corp 觸控面板、觸控顯示器及其組裝方法
CN103507390A (zh) * 2012-06-20 2014-01-15 苏州工业园区赫光科技有限公司 一种oca光学胶分离装置
US10220537B2 (en) 2012-10-17 2019-03-05 Saxum, Llc Method and apparatus for display screen shield replacement
CN103522729B (zh) 2013-10-24 2016-01-06 合肥京东方光电科技有限公司 拆除触摸面板的系统
CN103676282A (zh) 2013-12-23 2014-03-26 合肥京东方光电科技有限公司 触摸屏和显示屏分离装置及分离方法
CN103753945B (zh) * 2014-01-24 2016-03-02 赫得纳米科技(昆山)有限公司 自动贴合屏层分离装置
CN104503623A (zh) * 2015-01-06 2015-04-08 合肥鑫晟光电科技有限公司 触摸面板与显示模组的分离方法及系统
JP6174189B2 (ja) * 2015-04-20 2017-08-02 ハン、ドン ヒ ディスプレイ用パネルの剥離装置
US9517615B2 (en) * 2015-04-21 2016-12-13 The Boeing Company System and method for automated backing film removal
CN104932125B (zh) * 2015-06-12 2017-11-14 合肥京东方光电科技有限公司 一种液晶显示器拆解装置
US20160375600A1 (en) * 2015-06-29 2016-12-29 Igor Markovsky Joint cutting in a device
WO2017075151A1 (en) * 2015-10-30 2017-05-04 Corning Incorporated Methods for processing a first substrate bonded to a second substrate
CN106391653B (zh) * 2016-09-07 2019-03-01 武汉华星光电技术有限公司 一种用于触控模块和显示模块的贴合件的分离设备
CN107671923A (zh) * 2017-09-15 2018-02-09 张家港协鑫集成科技有限公司 叠瓦组件的拆卸方法及其装置
KR102350632B1 (ko) * 2020-10-22 2022-01-14 주식회사 원광에스앤티 태양광 패널 처리 장치
KR102457744B1 (ko) * 2022-01-05 2022-10-24 주식회사 원광에스앤티 태양광패널 분해장치
CN118769853A (zh) * 2023-04-07 2024-10-15 标致雪铁龙汽车股份有限公司 车辆电池模组的拆卸装置
CN117138915B (zh) * 2023-08-07 2024-03-22 苏州问源环境科技有限公司 一种光伏组件固体废弃物回收破碎装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE446245C (de) * 1927-06-27 Hermann Eilfeld Maschine zum wagerechten Durchtrennen von Kuchen und Torten mittels eines umlaufenden Metallbands oder -drahts, bei welcher der zu trennende Kuchen auf einem in wagerechter Richtung verschiebbaren Schlitten ruht
US4052584A (en) * 1976-04-29 1977-10-04 Bell Telephone Laboratories, Incorporated Method and apparatus for cutting insulating material
DE3040694A1 (de) * 1980-10-29 1982-07-29 Wezel GmbH & Co KG, 3560 Biedenkopf Verfahren und vorrichtung zum herstellen von kalottenfoermigen ausschnitten waermedaemmender waende aus kunststoffschaum
DE3209164C2 (de) * 1982-03-13 1983-12-22 Messner, Caspar O.H., Prof.Dr.sc.techn., Zürich Drahtsäge
DE3837493A1 (de) * 1987-11-16 1989-03-23 Nikolai Schaefer Funktionsmodell nc-hitzdrahtschneidegeraet/plotter
DE4100526A1 (de) * 1991-01-10 1992-07-16 Wacker Chemitronic Vorrichtung und verfahren zum automatischen vereinzeln von gestapelten scheiben
US6382292B1 (en) * 1997-03-27 2002-05-07 Canon Kabushiki Kaisha Method and apparatus for separating composite member using fluid
JP2002123187A (ja) * 2000-10-17 2002-04-26 Matsushita Electric Ind Co Ltd プラズマディスプレイ装置
JP2003288028A (ja) * 2001-12-25 2003-10-10 Canon Inc 画像表示装置の分解方法、画像表示装置の製造方法、支持体の製造方法、画像表示部の製造方法、加工材料の製造方法、および画像表示装置
JPWO2007007396A1 (ja) * 2005-07-12 2009-01-29 日立プラズマディスプレイ株式会社 ガラス製パネルを有する表示装置およびその分離方法

Also Published As

Publication number Publication date
EP2216147B1 (de) 2011-01-12
EP2216147A1 (de) 2010-08-11
TWI350790B (en) 2011-10-21
DE602009000572D1 (de) 2011-02-24
US20100199818A1 (en) 2010-08-12
TW201029817A (en) 2010-08-16

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Legal Events

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