ATE496104T1 - B-zustandsklebstoff für die chipverklebung - Google Patents

B-zustandsklebstoff für die chipverklebung

Info

Publication number
ATE496104T1
ATE496104T1 AT03786906T AT03786906T ATE496104T1 AT E496104 T1 ATE496104 T1 AT E496104T1 AT 03786906 T AT03786906 T AT 03786906T AT 03786906 T AT03786906 T AT 03786906T AT E496104 T1 ATE496104 T1 AT E496104T1
Authority
AT
Austria
Prior art keywords
chip bonding
adhesives
condition adhesive
methods
adhesive
Prior art date
Application number
AT03786906T
Other languages
English (en)
Inventor
Deborah Forray
Puwei Liu
Santos Benedicto P Delos
Original Assignee
Henkel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel Corp filed Critical Henkel Corp
Application granted granted Critical
Publication of ATE496104T1 publication Critical patent/ATE496104T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H10W72/07338—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by curing, e.g. thermosetting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
  • Dental Preparations (AREA)
AT03786906T 2002-11-25 2003-11-20 B-zustandsklebstoff für die chipverklebung ATE496104T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US42872402P 2002-11-25 2002-11-25
US10/459,601 US7176044B2 (en) 2002-11-25 2003-06-12 B-stageable die attach adhesives
PCT/US2003/037109 WO2004048491A1 (en) 2002-11-25 2003-11-20 B-stageable die attach adhesives

Publications (1)

Publication Number Publication Date
ATE496104T1 true ATE496104T1 (de) 2011-02-15

Family

ID=32329264

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03786906T ATE496104T1 (de) 2002-11-25 2003-11-20 B-zustandsklebstoff für die chipverklebung

Country Status (8)

Country Link
US (2) US7176044B2 (de)
EP (1) EP1565536B1 (de)
KR (1) KR101069047B1 (de)
AT (1) ATE496104T1 (de)
AU (1) AU2003295705A1 (de)
DE (1) DE60335821D1 (de)
TW (1) TWI295312B (de)
WO (1) WO2004048491A1 (de)

Families Citing this family (69)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100449776C (zh) * 2002-06-17 2009-01-07 亨凯尔公司 间层电介质和预施涂的模片连接粘合剂材料
US8513375B2 (en) * 2003-05-05 2013-08-20 Designer Molecules, Inc. Imide-linked maleimide and polymaleimide compounds
US7884174B2 (en) * 2003-05-05 2011-02-08 Designer Molecules, Inc. Imide-linked maleimide and polymaleimide compounds
WO2005056675A1 (en) * 2003-11-21 2005-06-23 Lord Corporation Dual-stage wafer applied underfills
CN102604591A (zh) * 2004-03-19 2012-07-25 住友电木株式会社 树脂组合物及采用该树脂组合物制作的半导体装置
US7560519B2 (en) * 2004-06-02 2009-07-14 Lord Corporation Dual-stage wafer applied underfills
US7875688B2 (en) * 2004-06-04 2011-01-25 Designer Molecules, Inc. Free-radical curable polyesters and methods for use thereof
US7795362B2 (en) * 2004-07-16 2010-09-14 Designer Molecules, Inc. Olefin oligomers containing pendant maleimide groups
EP1874885B1 (de) * 2005-04-04 2008-11-05 National Starch and Chemical Investment Holding Corporation Strahlenhärtbares, mit trockenmittel gefülltes klebe-/dichtmittel
US20080003373A1 (en) * 2005-05-11 2008-01-03 Yazaki Corporation Antireflective coating compositions and methods for depositing such coatings
US8043534B2 (en) * 2005-10-21 2011-10-25 Designer Molecules, Inc. Maleimide compositions and methods for use thereof
US8378017B2 (en) * 2005-12-29 2013-02-19 Designer Molecules, Inc. Thermosetting adhesive compositions
US8530573B2 (en) 2006-05-10 2013-09-10 Designer Molecules, Inc. Modified calcium carbonate-filled adhesive compositions and methods for use thereof
US8287686B2 (en) * 2006-07-24 2012-10-16 Designer Molecules, Inc. Derivatives of poly(styrene-co-allyl alcohol) and methods for use thereof
DE102006042032A1 (de) * 2006-09-07 2008-03-27 Infineon Technologies Ag Halbleiterbauelement
WO2008077140A2 (en) * 2006-12-19 2008-06-26 Designer Molecules, Inc. Hydrolytically resistant thermoset monomers
US7825188B2 (en) * 2006-12-19 2010-11-02 Designer Molecules, Inc. Thermoplastic elastomer with acyloxyphenyl hard block segment
US7422707B2 (en) * 2007-01-10 2008-09-09 National Starch And Chemical Investment Holding Corporation Highly conductive composition for wafer coating
WO2008092168A2 (en) * 2007-01-26 2008-07-31 Designer Molecules, Inc. Methods for the preparation of imides, maleimides and maleimide-terminated polyimide compounds
US20100113643A1 (en) * 2007-04-09 2010-05-06 Designer Molecules, Inc. Curatives for epoxy adhesive compositions
US8431655B2 (en) * 2007-04-09 2013-04-30 Designer Molecules, Inc. Curatives for epoxy compositions
US8039663B2 (en) * 2007-04-09 2011-10-18 Designer Molecules, Inc. Monomers derived from pentacyclopentadecane dimethanol
US7868113B2 (en) 2007-04-11 2011-01-11 Designer Molecules, Inc. Low shrinkage polyester thermosetting resins
WO2008128209A1 (en) * 2007-04-12 2008-10-23 Designer Molecules, Inc. Polyfunctional epoxy oligomers
US8063161B2 (en) * 2007-04-16 2011-11-22 Designer Molecules, Inc. Low temperature curing acrylate and maleimide based formulations and methods for use thereof
US7928153B2 (en) 2007-08-14 2011-04-19 Designer Molecules, Inc. Thermosetting polyether oligomers, compositions and methods for use thereof
US8398898B2 (en) * 2008-02-23 2013-03-19 Designer Molecules, Inc. Soluble metal salts for use as conductivity promoters
WO2009117345A2 (en) * 2008-03-17 2009-09-24 Henkel Corporation Adhesive compositions for use in die attach applications
WO2009117729A2 (en) * 2008-03-21 2009-09-24 Designer Molecules, Inc. Anti-bleed compounds, compositions and methods for use thereof
US8308892B2 (en) 2008-04-09 2012-11-13 Designer Molecules, Inc. Di-cinnamyl compounds and methods for use thereof
TW200948888A (en) * 2008-04-16 2009-12-01 Henkel Corp Flow controllable B-stageable composition
US8008419B2 (en) * 2008-08-13 2011-08-30 Designer Molecules, Inc. Siloxane monomers and methods for use thereof
US8013104B2 (en) * 2008-08-13 2011-09-06 Designer Molecules, Inc. Thermosetting hyperbranched compositions and methods for use thereof
US8637611B2 (en) 2008-08-13 2014-01-28 Designer Molecules, Inc. Amide-extended crosslinking compounds and methods for use thereof
US8158748B2 (en) * 2008-08-13 2012-04-17 Designer Molecules, Inc. Hetero-functional compounds and methods for use thereof
US8217120B2 (en) * 2008-08-13 2012-07-10 Designer Molecules, Inc. Functionalized styrene oligomers and polymers
US20100052122A1 (en) * 2008-08-27 2010-03-04 Advanced Semiconductor Engineering, Inc. Wire bodning package structure
US8288591B2 (en) * 2008-11-20 2012-10-16 Designer Molecules, Inc. Curing agents for epoxy resins
US20110237633A1 (en) * 2008-12-11 2011-09-29 Bijoy Panicker Small molecule modulators of hepatocyte growth factor (scatter factor) activity
JP2012516914A (ja) * 2009-02-02 2012-07-26 ロード コーポレイション マレイミド末端基を持つポリイミドを含む構造用接着剤
JP5703287B2 (ja) 2009-03-31 2015-04-15 サノフィ−アベンティス・ドイチュラント・ゲゼルシャフト・ミット・ベシュレンクテル・ハフツング 接着剤を使用する薬物送達デバイス本体の製造方法及び薬物送達デバイス本体
US20100252783A1 (en) * 2009-04-07 2010-10-07 Syh-Tau Yeh Ambient-curable anisotropic conductive adhesive
US8710682B2 (en) * 2009-09-03 2014-04-29 Designer Molecules Inc, Inc. Materials and methods for stress reduction in semiconductor wafer passivation layers
US8415812B2 (en) * 2009-09-03 2013-04-09 Designer Molecules, Inc. Materials and methods for stress reduction in semiconductor wafer passivation layers
EP2323047B1 (de) * 2009-10-09 2020-02-19 Software AG Primärdatenbanksystem, Replizierungsdatenbanksystem und Verfahren zur Replizierung von Daten eines Primärdatenbanksystems
US8698320B2 (en) * 2009-12-07 2014-04-15 Henkel IP & Holding GmbH Curable resin compositions useful as underfill sealants for use with low-k dielectric-containing semiconductor devices
JP5993845B2 (ja) 2010-06-08 2016-09-14 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング 先ダイシング法を行う微細加工されたウェーハへの接着剤の被覆
TWI456012B (zh) 2010-06-08 2014-10-11 漢高智慧財產控股公司 使用脈衝式ｕｖ光源之晶圓背面塗覆方法
US8686162B2 (en) 2010-08-25 2014-04-01 Designer Molecules Inc, Inc. Maleimide-functional monomers in amorphous form
US8816021B2 (en) 2010-09-10 2014-08-26 Designer Molecules, Inc. Curable composition with rubber-like properties
US20120100379A1 (en) * 2010-10-20 2012-04-26 Greene, Tweed Of Delaware, Inc. Fluoroelastomer bonding compositions suitable for high-temperature applications
WO2012106223A2 (en) 2011-02-01 2012-08-09 Henkel Corporation Pre-cut wafer applied underfill film on dicing tape
WO2012106191A2 (en) 2011-02-01 2012-08-09 Henkel Corporation Pre- cut wafer applied underfill film
CN103534327B (zh) 2011-04-05 2015-05-20 汉高知识产权控股有限责任公司 可b阶段化且无需固化的晶圆背面涂覆粘合剂
EP2608231A1 (de) 2011-12-21 2013-06-26 Henkel AG & Co. KGaA Elektrische Komponente
TWI545702B (zh) * 2012-10-25 2016-08-11 矽品精密工業股份有限公司 半導體封裝件及其製法
US8962389B2 (en) 2013-05-30 2015-02-24 Freescale Semiconductor, Inc. Microelectronic packages including patterned die attach material and methods for the fabrication thereof
TWI651387B (zh) 2013-09-30 2019-02-21 漢高智慧財產控股公司 用於大型晶粒半導體封裝之導電黏晶薄膜及供其製備之組合物
JP6092752B2 (ja) * 2013-10-30 2017-03-08 京セラ株式会社 配線基板
KR102363099B1 (ko) 2016-02-19 2022-02-15 애버리 데니슨 코포레이션 접착제를 제조하는 2단계 방법 및 관련 조성물
KR101753158B1 (ko) 2016-04-28 2017-08-09 (주)이녹스첨단소재 비전도성 접착필름용 조성물 및 이를 포함하는 비전도성 접착필름
CN110099939B (zh) 2016-10-25 2022-09-06 艾利丹尼森公司 在主链中具有光引发剂基团的嵌段聚合物及其用于粘合剂组合物中的用途
CN106803502A (zh) * 2016-12-29 2017-06-06 广州凯耀资产管理有限公司 一种集成电路封装结构
US11084913B2 (en) * 2017-10-12 2021-08-10 Texas Research International, Inc. Anaerobic composite matrix resins
US20190112438A1 (en) * 2017-10-12 2019-04-18 Texas Research International, Inc. Anaerobic composite matrix resins
JP7507088B2 (ja) 2017-12-19 2024-06-27 エイブリィ・デニソン・コーポレイション ペンダント官能基の後重合官能化
US11552040B2 (en) * 2020-07-21 2023-01-10 Western Digital Technologies, Inc. Package process, DAF replacement
CN116313820A (zh) * 2021-12-21 2023-06-23 先进半导体材料(深圳)有限公司 引线框架的贴片机
WO2026050296A1 (en) * 2024-08-26 2026-03-05 Henkel Ag & Co. Kgaa B-stage thermally conductive adhesive

Family Cites Families (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2928446A (en) * 1957-04-05 1960-03-15 Little Inc A Self-locking screw-threaded fastening member
JPS535920B2 (de) * 1974-06-03 1978-03-02
JPS5339429A (en) 1976-09-22 1978-04-11 Hitachi Ltd Inverter
US4325985A (en) * 1980-03-31 1982-04-20 The Oakland Corporation Thread lock
US4412048A (en) * 1981-09-11 1983-10-25 Westinghouse Electric Corp. Solventless UV dryable B-stageable epoxy adhesive
AU566422B2 (en) * 1981-10-15 1987-10-22 Thompson, W.H. A polymerisable fluid
US4851454A (en) 1986-07-17 1989-07-25 The Dow Chemical Company Photolytically crosslinkable thermally stable composition
US4816294A (en) * 1987-05-04 1989-03-28 Midwest Research Institute Method and apparatus for removing and preventing window deposition during photochemical vapor deposition (photo-CVD) processes
US4759874A (en) 1987-08-03 1988-07-26 The Dow Chemical Company Benzocyclobutene-based die attach adhesive compositions
DE3827626A1 (de) * 1988-08-10 1990-03-08 Teroson Gmbh Reaktiver schmelzklebstoff
US5015695A (en) 1989-05-09 1991-05-14 Shell Oil Company Functionalized elastomeric polymer production
JPH0395225A (ja) 1989-09-08 1991-04-19 Fujitsu Ltd マレイミド樹脂組成物
US5208188A (en) 1989-10-02 1993-05-04 Advanced Micro Devices, Inc. Process for making a multilayer lead frame assembly for an integrated circuit structure and multilayer integrated circuit die package formed by such process
US5148265A (en) 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies with fan-in leads
US5140404A (en) 1990-10-24 1992-08-18 Micron Technology, Inc. Semiconductor device manufactured by a method for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tape
US5177032A (en) 1990-10-24 1993-01-05 Micron Technology, Inc. Method for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tape
US5298562A (en) * 1991-08-19 1994-03-29 Sartomer Company, Inc. Calcium di(meth)acrylate cured halogenated polyethylene polymers
DE4130329A1 (de) * 1991-09-12 1993-03-18 Bayer Ag Waermehaertbare reaktionsharzgemische, ein verfahren zu ihrer herstellung und die verwendung zur herstellung von press-massen und formkoerpern
JP2642554B2 (ja) 1991-12-27 1997-08-20 電気化学工業株式会社 接着剤組成物
US5300608A (en) * 1992-03-31 1994-04-05 Loctite Corporation Process for preparing alkoxy-terminated organosiloxane fluids using organo-lithium reagents
JP3221512B2 (ja) 1992-06-10 2001-10-22 ジェイエスアール株式会社 ゴム組成物
TW259846B (de) 1992-09-11 1995-10-11 Canon Kk
US5358992A (en) * 1993-02-26 1994-10-25 Quantum Materials, Inc. Die-attach composition comprising polycyanate ester monomer
US5286679A (en) 1993-03-18 1994-02-15 Micron Technology, Inc. Method for attaching a semiconductor die to a leadframe using a patterned adhesive layer
US5323060A (en) * 1993-06-02 1994-06-21 Micron Semiconductor, Inc. Multichip module having a stacked chip arrangement
CA2188552A1 (en) 1994-05-19 1995-11-30 Jozef Huybrechts Coatings comprising self-stabilized lattices prepared in an aqueous carrier
US6034194A (en) * 1994-09-02 2000-03-07 Quantum Materials/Dexter Corporation Bismaleimide-divinyl adhesive compositions and uses therefor
US5789757A (en) * 1996-09-10 1998-08-04 The Dexter Corporation Malemide containing formulations and uses therefor
US5585671A (en) 1994-10-07 1996-12-17 Nagesh; Voddarahalli K. Reliable low thermal resistance package for high power flip clip ICs
US5708129A (en) 1995-04-28 1998-01-13 Johnson Matthey, Inc. Die attach adhesive with reduced resin bleed
DE69622412T2 (de) * 1995-08-29 2003-03-20 Minnesota Mining And Mfg. Co., Saint Paul Verfahren zur herstellung einer elektronischen anordnung mit klebeverbindung mittels eines nachgiebigen substrats
JPH09286971A (ja) 1996-04-19 1997-11-04 Toray Dow Corning Silicone Co Ltd シリコーン系ダイボンディング剤、半導体装置の製造方法および半導体装置
US5962854A (en) * 1996-06-12 1999-10-05 Ishizuka Electronics Corporation Infrared sensor and infrared detector
US5717034A (en) 1996-07-29 1998-02-10 Quantum Materials, Inc. Perfluorinated hydrocarbon polymer-filled adhesive formulations and uses therefor
US5912282A (en) 1996-12-16 1999-06-15 Shell Oil Company Die attach adhesive compositions
JP4394281B2 (ja) * 1998-01-16 2010-01-06 ロックタイト （アール アンド ディー） リミテッド 硬化性のエポキシ−ベースの組成物
US5973166A (en) * 1998-03-02 1999-10-26 The Dexter Corporation Method for the preparation of maleimides
JP4098403B2 (ja) 1998-06-01 2008-06-11 富士通株式会社 接着剤、接着方法及び実装基板の組み立て体
US6063828A (en) * 1998-07-02 2000-05-16 National Starch And Chemical Investment Holding Corporation Underfill encapsulant compositions for use in electronic devices
US6281314B1 (en) * 1998-07-02 2001-08-28 National Starch And Chemical Investment Holding Corporation Compositions for use in the fabrication of circuit components and printed wire boards
US6316566B1 (en) * 1998-07-02 2001-11-13 National Starch And Chemical Investment Holding Corporation Package encapsulant compositions for use in electronic devices
US6265530B1 (en) 1998-07-02 2001-07-24 National Starch And Chemical Investment Holding Corporation Die attach adhesives for use in microelectronic devices
SG105450A1 (en) 1998-07-02 2004-08-27 Nat Starch Chem Invest Allylated amide compounds and die attach adhesives prepared therefrom
AR023110A1 (es) 1999-03-22 2002-09-04 Loctite Corp Articulos roscados con revestimiento deformable curado sobre los mismos
US6211320B1 (en) 1999-07-28 2001-04-03 Dexter Corporation Low viscosity acrylate monomers formulations containing same and uses therefor
JP3601443B2 (ja) 1999-11-30 2004-12-15 日立化成工業株式会社 接着フィルムとその製造方法、半導体搭載用配線基板及び半導体装置
JP3562465B2 (ja) 1999-11-30 2004-09-08 日立化成工業株式会社 接着剤組成物、接着フィルム及び半導体搭載用配線基板
DE50009029D1 (de) 2000-04-08 2005-01-27 Siemens Building Tech Ag Verfahren zur Optimierung eines Wasserspray-Löschsystems und Wasserspray-Löschsystem zur Durchführung des Verfahrens
US6512043B2 (en) 2000-05-10 2003-01-28 Illinois Tool Works Inc. Two-part structural adhesive having long working time
US6522018B1 (en) 2000-05-16 2003-02-18 Micron Technology, Inc. Ball grid array chip packages having improved testing and stacking characteristics
CN1180044C (zh) 2000-05-18 2004-12-15 国家淀粉及化学投资控股公司 含有乙烯基醚和氨基甲酸酯或脲官能团的小片连接粘合剂
US20030034124A1 (en) * 2001-06-19 2003-02-20 Yasuhiro Sugaya Dielectric resonator, dielectric filter and method of producing the same, filter device combined to a transmit-receive antenna and communication apparatus using the same
US6620651B2 (en) * 2001-10-23 2003-09-16 National Starch And Chemical Investment Holding Corporation Adhesive wafers for die attach application
US20030129438A1 (en) 2001-12-14 2003-07-10 Becker Kevin Harris Dual cure B-stageable adhesive for die attach
US6833629B2 (en) 2001-12-14 2004-12-21 National Starch And Chemical Investment Holding Corporation Dual cure B-stageable underfill for wafer level
US20050211555A1 (en) * 2002-02-14 2005-09-29 Solus Biosystems, Inc. Method for multiple sample screening using IR spectroscopy
US6620905B1 (en) 2002-02-23 2003-09-16 National Starch And Chemical Investment Holding Corporation Curable compositions containing benzoxazine
US20040038442A1 (en) * 2002-08-26 2004-02-26 Kinsman Larry D. Optically interactive device packages and methods of assembly
US6969914B2 (en) * 2002-08-29 2005-11-29 Micron Technology, Inc. Electronic device package

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US7851254B2 (en) 2010-12-14
EP1565536A1 (de) 2005-08-24
TWI295312B (en) 2008-04-01
KR101069047B1 (ko) 2011-09-30
US20080160315A1 (en) 2008-07-03
KR20050083978A (ko) 2005-08-26
US20040102566A1 (en) 2004-05-27
US7176044B2 (en) 2007-02-13
WO2004048491A1 (en) 2004-06-10
TW200426200A (en) 2004-12-01
EP1565536B1 (de) 2011-01-19
DE60335821D1 (de) 2011-03-03

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