ATE49613T1 - METHOD FOR THE POLAROGRAPHIC DETERMINATION OF ADDITIVES IN GALVANIC BATHS. - Google Patents
METHOD FOR THE POLAROGRAPHIC DETERMINATION OF ADDITIVES IN GALVANIC BATHS.Info
- Publication number
- ATE49613T1 ATE49613T1 AT87106582T AT87106582T ATE49613T1 AT E49613 T1 ATE49613 T1 AT E49613T1 AT 87106582 T AT87106582 T AT 87106582T AT 87106582 T AT87106582 T AT 87106582T AT E49613 T1 ATE49613 T1 AT E49613T1
- Authority
- AT
- Austria
- Prior art keywords
- polarographic
- additives
- peak
- evaluated
- voltage
- Prior art date
Links
- 239000000654 additive Substances 0.000 title abstract 4
- 238000000034 method Methods 0.000 title abstract 2
- 230000000996 additive effect Effects 0.000 abstract 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 abstract 2
- 229910052753 mercury Inorganic materials 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 238000005282 brightening Methods 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 238000009713 electroplating Methods 0.000 abstract 1
- 238000003969 polarography Methods 0.000 abstract 1
- 239000000080 wetting agent Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
- C25D21/14—Controlled addition of electrolyte components
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Automation & Control Theory (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrolytic Production Of Metals (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
1. Method of determining brightening additives and wetting agents in copper electroplating baths by polarography, characterized in that the current-voltage relationship of the bath solution (B1) under examination is determined at the electrodes (Qe, Ge) of a polarographic analyser having a dropping mercury electrode (Qe) with a suspended mercury drop and with an applied direct voltage and in that, when an abrupt rise in the current level (i) in the form of a polarographic peak (PG, PN) occurs, the respective peak voltage (PGS, PNS) is evaluated as a characteristic parameter for the type of additive contained in the bath solution and the peak height (PGH, PNH) is evaluated as a characteristic parameter for the effective concentration of said additive.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE3617046 | 1986-05-21 | ||
| EP87106582A EP0246494B1 (en) | 1986-05-21 | 1987-05-07 | Process for supplying additives to electroplating baths by polarography |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE49613T1 true ATE49613T1 (en) | 1990-02-15 |
Family
ID=6301279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT87106582T ATE49613T1 (en) | 1986-05-21 | 1987-05-07 | METHOD FOR THE POLAROGRAPHIC DETERMINATION OF ADDITIVES IN GALVANIC BATHS. |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP0246494B1 (en) |
| JP (1) | JPS62285057A (en) |
| AT (1) | ATE49613T1 (en) |
| DE (1) | DE3761442D1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1932953B1 (en) * | 2006-12-11 | 2012-11-14 | Atotech Deutschland GmbH | Galvanic process with analysis of the electrolytic bath through solid phase extraction |
| JP5509121B2 (en) * | 2011-02-28 | 2014-06-04 | メルテックス株式会社 | Method for quantitative analysis of sulfur compounds in electroless nickel plating solution |
| CN103014823B (en) * | 2013-01-05 | 2015-05-13 | 华进半导体封装先导技术研发中心有限公司 | Method for quickly determining effect of additive for improving copper electrodeposition |
-
1987
- 1987-05-07 EP EP87106582A patent/EP0246494B1/en not_active Expired - Lifetime
- 1987-05-07 DE DE8787106582T patent/DE3761442D1/en not_active Expired - Lifetime
- 1987-05-07 AT AT87106582T patent/ATE49613T1/en not_active IP Right Cessation
- 1987-05-19 JP JP62122355A patent/JPS62285057A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| EP0246494B1 (en) | 1990-01-17 |
| EP0246494A1 (en) | 1987-11-25 |
| DE3761442D1 (en) | 1990-02-22 |
| JPS62285057A (en) | 1987-12-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| REN | Ceased due to non-payment of the annual fee |