ATE496396T1 - Laser-verarbeitungsvorrichtungen und -verfahren - Google Patents

Laser-verarbeitungsvorrichtungen und -verfahren

Info

Publication number
ATE496396T1
ATE496396T1 AT04735829T AT04735829T ATE496396T1 AT E496396 T1 ATE496396 T1 AT E496396T1 AT 04735829 T AT04735829 T AT 04735829T AT 04735829 T AT04735829 T AT 04735829T AT E496396 T1 ATE496396 T1 AT E496396T1
Authority
AT
Austria
Prior art keywords
processing
laser
laser beam
processing apparatus
irradiated
Prior art date
Application number
AT04735829T
Other languages
English (en)
Inventor
You-Hie Han
Won-Chul Jung
Original Assignee
Eo Technics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eo Technics Co Ltd filed Critical Eo Technics Co Ltd
Application granted granted Critical
Publication of ATE496396T1 publication Critical patent/ATE496396T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/50—Recording sheets characterised by the coating used to improve ink, dye or pigment receptivity, e.g. for ink-jet or thermal dye transfer recording
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
AT04735829T 2004-04-19 2004-06-02 Laser-verarbeitungsvorrichtungen und -verfahren ATE496396T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020040026749A KR100514996B1 (ko) 2004-04-19 2004-04-19 레이저 가공 장치
PCT/KR2004/001315 WO2005101487A1 (en) 2004-04-19 2004-06-02 Laser processing apparatus

Publications (1)

Publication Number Publication Date
ATE496396T1 true ATE496396T1 (de) 2011-02-15

Family

ID=35150255

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04735829T ATE496396T1 (de) 2004-04-19 2004-06-02 Laser-verarbeitungsvorrichtungen und -verfahren

Country Status (9)

Country Link
US (1) US7688492B2 (de)
EP (1) EP1738409B1 (de)
JP (1) JP4856058B2 (de)
KR (1) KR100514996B1 (de)
CN (1) CN1947239B (de)
AT (1) ATE496396T1 (de)
CA (1) CA2564124A1 (de)
DE (1) DE602004031154D1 (de)
WO (1) WO2005101487A1 (de)

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CN101879657B (zh) * 2009-05-08 2016-06-29 东莞市中镓半导体科技有限公司 固体激光剥离设备和剥离方法
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TWI448730B (zh) * 2011-10-25 2014-08-11 Ind Tech Res Inst 均勻打光之掃描式視覺系統
CN104395033B (zh) * 2012-07-04 2017-06-23 法国圣戈班玻璃厂 用于在使用至少两个桥情况下对大面积衬底进行激光处理的设备和方法
CN103894734A (zh) * 2012-12-31 2014-07-02 上海微电子装备有限公司 一种激光退火装置及其操作方法
JP6161188B2 (ja) * 2013-02-05 2017-07-12 株式会社ブイ・テクノロジー レーザ加工装置、レーザ加工方法
CN103551735A (zh) * 2013-10-18 2014-02-05 昆山思拓机器有限公司 一种导电橡胶垫的加工装置及工艺
JP6347714B2 (ja) * 2014-10-02 2018-06-27 株式会社ディスコ ウエーハの加工方法
CN106271105B (zh) * 2016-08-31 2018-05-25 武汉凌云光电科技有限责任公司 一种可实现光纤端面角度控制的激光切割方法及系统
CN106362992B (zh) * 2016-11-29 2019-03-01 苏州热工研究院有限公司 管道内壁去污的激光清洁系统
FR3080321B1 (fr) * 2018-04-23 2020-03-27 Addup Appareil et procede pour fabriquer un objet tridimensionnel
AU2019203404B2 (en) 2018-05-15 2024-11-07 Howmedica Osteonics Corp. Fabrication of components using shaped energy beam profiles
US10903121B1 (en) 2019-08-14 2021-01-26 Applied Materials, Inc. Hybrid wafer dicing approach using a uniform rotating beam laser scribing process and plasma etch process
CN114778490B (zh) * 2022-05-06 2025-03-25 天津大学 一种基于锁相放大的扫描式试纸条定量检测系统及方法
US12564068B2 (en) * 2022-10-06 2026-02-24 Thinsic Inc. Carbon assisted semiconductor dicing and method

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Also Published As

Publication number Publication date
JP2007532322A (ja) 2007-11-15
KR100514996B1 (ko) 2005-09-15
US7688492B2 (en) 2010-03-30
CA2564124A1 (en) 2005-10-27
EP1738409B1 (de) 2011-01-19
JP4856058B2 (ja) 2012-01-18
CN1947239A (zh) 2007-04-11
EP1738409A1 (de) 2007-01-03
US20080088900A1 (en) 2008-04-17
WO2005101487A1 (en) 2005-10-27
CN1947239B (zh) 2011-08-31
DE602004031154D1 (de) 2011-03-03
EP1738409A4 (de) 2008-10-08

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