ATE498872T1 - Verfahren zur herstellung eines transponders und transponder - Google Patents

Verfahren zur herstellung eines transponders und transponder

Info

Publication number
ATE498872T1
ATE498872T1 AT06831913T AT06831913T ATE498872T1 AT E498872 T1 ATE498872 T1 AT E498872T1 AT 06831913 T AT06831913 T AT 06831913T AT 06831913 T AT06831913 T AT 06831913T AT E498872 T1 ATE498872 T1 AT E498872T1
Authority
AT
Austria
Prior art keywords
transponder
area
producing
electric contact
electric
Prior art date
Application number
AT06831913T
Other languages
English (en)
Inventor
Reinhard Rogy
Christian Zenz
Original Assignee
Nxp Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nxp Bv filed Critical Nxp Bv
Application granted granted Critical
Publication of ATE498872T1 publication Critical patent/ATE498872T1/de

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07752—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna using an interposer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117—Shapes of semiconductor bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49016—Antenna or wave energy "plumbing" making
    • Y10T29/49018—Antenna or wave energy "plumbing" making with other electrical component

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Details Of Aerials (AREA)
  • Saccharide Compounds (AREA)
  • Medicines Containing Material From Animals Or Micro-Organisms (AREA)
  • Radar Systems Or Details Thereof (AREA)
AT06831913T 2005-11-28 2006-11-23 Verfahren zur herstellung eines transponders und transponder ATE498872T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP05111388 2005-11-28
PCT/IB2006/054408 WO2007060631A1 (en) 2005-11-28 2006-11-23 A method of producing a transponder and a transponder

Publications (1)

Publication Number Publication Date
ATE498872T1 true ATE498872T1 (de) 2011-03-15

Family

ID=37890396

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06831913T ATE498872T1 (de) 2005-11-28 2006-11-23 Verfahren zur herstellung eines transponders und transponder

Country Status (7)

Country Link
US (2) US8968510B2 (de)
EP (1) EP1966743B1 (de)
JP (1) JP2009517730A (de)
CN (1) CN101317186B (de)
AT (1) ATE498872T1 (de)
DE (1) DE602006020179D1 (de)
WO (1) WO2007060631A1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12224232B2 (en) 2019-03-08 2025-02-11 Siliconix Incorporated Semiconductor package having side wall plating
EP3935663A4 (de) 2019-03-08 2022-11-02 Siliconix Incorporated Halbleitergehäuse mit seitenwandplattierung
CN113035721A (zh) 2019-12-24 2021-06-25 维谢综合半导体有限责任公司 用于侧壁镀覆导电膜的封装工艺
CN113035722A (zh) 2019-12-24 2021-06-25 维谢综合半导体有限责任公司 具有选择性模制的用于镀覆的封装工艺
WO2021161972A1 (ja) * 2020-02-13 2021-08-19 旭化成株式会社 透明アンテナ及びｒｆタグ

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5255839A (en) 1992-01-02 1993-10-26 Motorola, Inc. Method for solder application and reflow
US6864570B2 (en) 1993-12-17 2005-03-08 The Regents Of The University Of California Method and apparatus for fabricating self-assembling microstructures
IL108359A (en) 1994-01-17 2001-04-30 Shellcase Ltd Method and apparatus for producing integrated circuit devices
US5468999A (en) 1994-05-26 1995-11-21 Motorola, Inc. Liquid encapsulated ball grid array semiconductor device with fine pitch wire bonding
US5798146A (en) * 1995-09-14 1998-08-25 Tri-Star Technologies Surface charging to improve wettability
JP3003624B2 (ja) 1997-05-27 2000-01-31 ソニー株式会社 半導体装置
FR2769389B1 (fr) 1997-10-07 2000-01-28 Rue Cartes Et Systemes De Carte a microcircuit combinant des plages de contact exterieur et une antenne, et procede de fabrication d'une telle carte
US6091332A (en) 1998-06-09 2000-07-18 Motorola, Inc. Radio frequency identification tag having printed circuit interconnections
US6107920A (en) 1998-06-09 2000-08-22 Motorola, Inc. Radio frequency identification tag having an article integrated antenna
EP1110243A1 (de) 1998-07-28 2001-06-27 Infineon Technologies AG Integriertes bauelement, verbundkörper aus einem integrierten bauelement und einer leiterstruktur, chip-karte und verfahren zur herstellung des integrierten bauelementes
US6404643B1 (en) 1998-10-15 2002-06-11 Amerasia International Technology, Inc. Article having an embedded electronic device, and method of making same
DE60021454T2 (de) * 1999-02-09 2006-05-24 Magnus Granhed Eingekapselte Antenne in passivem Transponder
US6891110B1 (en) * 1999-03-24 2005-05-10 Motorola, Inc. Circuit chip connector and method of connecting a circuit chip
CN1440307A (zh) * 2000-04-14 2003-09-03 卡尔·赖默 对底材进行连续表面修饰的装置和方法
US6853087B2 (en) 2000-09-19 2005-02-08 Nanopierce Technologies, Inc. Component and antennae assembly in radio frequency identification devices
US6867983B2 (en) 2002-08-07 2005-03-15 Avery Dennison Corporation Radio frequency identification device and method
JP3808030B2 (ja) 2002-11-28 2006-08-09 沖電気工業株式会社 半導体装置及びその製造方法
FI20022107L (fi) 2002-11-29 2004-05-30 Rafsec Oy Menetelmä sirujen kiinnittämiseksi transponderiin
US6940408B2 (en) * 2002-12-31 2005-09-06 Avery Dennison Corporation RFID device and method of forming
EP1460690A1 (de) 2003-02-25 2004-09-22 Broadcom Corporation Optimierung der Signalleitungen und des Platzbedarfs auf der Leiterplatte in einer Kugelmatrixverpackung
DE10308855A1 (de) * 2003-02-27 2004-09-16 Infineon Technologies Ag Elektronisches Bauteil und Halbleiterwafer, sowie Verfahren zur Herstellung derselben

Also Published As

Publication number Publication date
CN101317186A (zh) 2008-12-03
CN101317186B (zh) 2010-09-08
US8968510B2 (en) 2015-03-03
WO2007060631A1 (en) 2007-05-31
EP1966743B1 (de) 2011-02-16
EP1966743A1 (de) 2008-09-10
US20080309462A1 (en) 2008-12-18
US20150144704A1 (en) 2015-05-28
DE602006020179D1 (de) 2011-03-31
JP2009517730A (ja) 2009-04-30
US9779349B2 (en) 2017-10-03

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties