ATE499458T1 - Verfahren zur herstellung einer porösen sioch- schicht - Google Patents
Verfahren zur herstellung einer porösen sioch- schichtInfo
- Publication number
- ATE499458T1 ATE499458T1 AT03008723T AT03008723T ATE499458T1 AT E499458 T1 ATE499458 T1 AT E499458T1 AT 03008723 T AT03008723 T AT 03008723T AT 03008723 T AT03008723 T AT 03008723T AT E499458 T1 ATE499458 T1 AT E499458T1
- Authority
- AT
- Austria
- Prior art keywords
- atomic
- film
- porous
- gaseous reagents
- producing
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/401—Oxides containing silicon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
- H10P14/6326—Deposition processes
- H10P14/6328—Deposition from the gas or vapour phase
- H10P14/6334—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/045—Silicon oxycarbide, oxynitride or oxycarbonitride glasses
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/66—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/66—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials
- H10P14/668—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials
- H10P14/6681—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Inorganic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Chemical Vapour Deposition (AREA)
- Formation Of Insulating Films (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Silicon Polymers (AREA)
- Catalysts (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US37310402P | 2002-04-17 | 2002-04-17 | |
| US10/150,798 US6846515B2 (en) | 2002-04-17 | 2002-05-17 | Methods for using porogens and/or porogenated precursors to provide porous organosilica glass films with low dielectric constants |
| US10/409,468 US7384471B2 (en) | 2002-04-17 | 2003-04-07 | Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constants |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE499458T1 true ATE499458T1 (de) | 2011-03-15 |
Family
ID=46150309
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT03008723T ATE499458T1 (de) | 2002-04-17 | 2003-04-16 | Verfahren zur herstellung einer porösen sioch- schicht |
Country Status (3)
| Country | Link |
|---|---|
| JP (3) | JP5774830B2 (de) |
| KR (1) | KR100494194B1 (de) |
| AT (1) | ATE499458T1 (de) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8293001B2 (en) | 2002-04-17 | 2012-10-23 | Air Products And Chemicals, Inc. | Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constants |
| US9061317B2 (en) | 2002-04-17 | 2015-06-23 | Air Products And Chemicals, Inc. | Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constants |
| US8951342B2 (en) | 2002-04-17 | 2015-02-10 | Air Products And Chemicals, Inc. | Methods for using porogens for low k porous organosilica glass films |
| US20080268177A1 (en) * | 2002-05-17 | 2008-10-30 | Air Products And Chemicals, Inc. | Porogens, Porogenated Precursors and Methods for Using the Same to Provide Porous Organosilica Glass Films with Low Dielectric Constants |
| US20040197474A1 (en) * | 2003-04-01 | 2004-10-07 | Vrtis Raymond Nicholas | Method for enhancing deposition rate of chemical vapor deposition films |
| US7498273B2 (en) * | 2006-05-30 | 2009-03-03 | Applied Materials, Inc. | Formation of high quality dielectric films of silicon dioxide for STI: usage of different siloxane-based precursors for harp II—remote plasma enhanced deposition processes |
| US7410916B2 (en) * | 2006-11-21 | 2008-08-12 | Applied Materials, Inc. | Method of improving initiation layer for low-k dielectric film by digital liquid flow meter |
| JP5730910B2 (ja) | 2010-02-09 | 2015-06-10 | ソガンデハッキョー・サンハックヒョップリョックダン | 高温オゾン処理を含むナノ細孔の超低誘電薄膜の製造方法 |
| KR102316276B1 (ko) | 2020-04-20 | 2021-10-25 | 한국과학기술연구원 | 다단기공구조를 갖는 킬레이트 복합체 및 그 제조방법 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998050945A2 (en) * | 1997-05-07 | 1998-11-12 | Skamser Daniel J | Low density film for low dielectric constant applications |
| JP3173426B2 (ja) * | 1997-06-09 | 2001-06-04 | 日本電気株式会社 | シリカ絶縁膜の製造方法及び半導体装置の製造方法 |
| JP3756666B2 (ja) * | 1998-05-08 | 2006-03-15 | 松下電器産業株式会社 | 多孔質膜の形成方法及びその形成装置 |
| JP3888794B2 (ja) * | 1999-01-27 | 2007-03-07 | 松下電器産業株式会社 | 多孔質膜の形成方法、配線構造体及びその形成方法 |
| JP3633821B2 (ja) * | 1999-03-18 | 2005-03-30 | 独立行政法人科学技術振興機構 | 気相からの低誘電率多孔質シリカ膜の形成方法 |
| US6541367B1 (en) * | 2000-01-18 | 2003-04-01 | Applied Materials, Inc. | Very low dielectric constant plasma-enhanced CVD films |
| JP2001274153A (ja) * | 2000-03-24 | 2001-10-05 | Hitachi Kokusai Electric Inc | 絶縁膜の製造方法 |
| WO2002011204A1 (en) * | 2000-08-02 | 2002-02-07 | International Business Machines Corporation | Multiphase low dielectric constant material and method of deposition |
| SG137694A1 (en) * | 2000-10-25 | 2007-12-28 | Ibm | Ultralow dielectric constant material as an intralevel or interlevel dieletric in a semiconductor device and electronic device containing the same |
| KR20030002993A (ko) * | 2001-06-29 | 2003-01-09 | 학교법인 포항공과대학교 | 저유전체 박막의 제조방법 |
| US7384471B2 (en) * | 2002-04-17 | 2008-06-10 | Air Products And Chemicals, Inc. | Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constants |
-
2003
- 2003-04-16 AT AT03008723T patent/ATE499458T1/de not_active IP Right Cessation
- 2003-04-17 KR KR10-2003-0024269A patent/KR100494194B1/ko not_active Expired - Lifetime
-
2010
- 2010-09-30 JP JP2010222519A patent/JP5774830B2/ja not_active Expired - Lifetime
-
2012
- 2012-04-04 JP JP2012085485A patent/JP5711176B2/ja not_active Expired - Lifetime
-
2014
- 2014-05-07 JP JP2014096336A patent/JP2014150287A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP2012144738A (ja) | 2012-08-02 |
| KR100494194B1 (ko) | 2005-06-10 |
| JP2014150287A (ja) | 2014-08-21 |
| KR20030082479A (ko) | 2003-10-22 |
| JP5774830B2 (ja) | 2015-09-09 |
| JP5711176B2 (ja) | 2015-04-30 |
| JP2011014925A (ja) | 2011-01-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |