ATE500535T1 - Belichtungsmasken, und methoden zur herstellung von masken - Google Patents
Belichtungsmasken, und methoden zur herstellung von maskenInfo
- Publication number
- ATE500535T1 ATE500535T1 AT03719289T AT03719289T ATE500535T1 AT E500535 T1 ATE500535 T1 AT E500535T1 AT 03719289 T AT03719289 T AT 03719289T AT 03719289 T AT03719289 T AT 03719289T AT E500535 T1 ATE500535 T1 AT E500535T1
- Authority
- AT
- Austria
- Prior art keywords
- masks
- array
- methods
- added
- contacts
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 2
- 238000000059 patterning Methods 0.000 abstract 2
- 230000005855 radiation Effects 0.000 abstract 2
- 230000010363 phase shift Effects 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
- G03F1/30—Alternating PSM, e.g. Levenson-Shibuya PSM; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
- G03F1/29—Rim PSM or outrigger PSM; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/36—Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Eyeglasses (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Measuring Leads Or Probes (AREA)
- Electron Beam Exposure (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/072,440 US6841310B2 (en) | 2002-02-05 | 2002-02-05 | Radiation patterning tools, and methods of forming radiation patterning tools |
| PCT/US2003/002288 WO2003067330A2 (en) | 2002-02-05 | 2003-01-24 | Radiation patterning tools, and methods of forming radiation patterning tools |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE500535T1 true ATE500535T1 (de) | 2011-03-15 |
Family
ID=27659481
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT03719289T ATE500535T1 (de) | 2002-02-05 | 2003-01-24 | Belichtungsmasken, und methoden zur herstellung von masken |
Country Status (10)
| Country | Link |
|---|---|
| US (2) | US6841310B2 (de) |
| EP (1) | EP1472575B1 (de) |
| JP (1) | JP4139859B2 (de) |
| KR (1) | KR100590360B1 (de) |
| CN (1) | CN1646987B (de) |
| AT (1) | ATE500535T1 (de) |
| AU (1) | AU2003223161A1 (de) |
| DE (1) | DE60336208D1 (de) |
| TW (1) | TW579457B (de) |
| WO (1) | WO2003067330A2 (de) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6670109B2 (en) | 2001-08-29 | 2003-12-30 | Micron Technology, Inc. | Photolithographic methods of using a single reticle to form overlapping patterns |
| DE102004003341B4 (de) * | 2004-01-22 | 2006-12-21 | Infineon Technologies Ag | Halbtonphasenmaske mit mehreren Transmissionen und Verfahren zu ihrer Herstellung |
| JP4535243B2 (ja) * | 2004-05-11 | 2010-09-01 | ルネサスエレクトロニクス株式会社 | 位相シフトマスクの製造方法 |
| JP4582574B2 (ja) * | 2004-06-04 | 2010-11-17 | シャープ株式会社 | 位相シフトマスクおよびその製造方法 |
| US7262123B2 (en) * | 2004-07-29 | 2007-08-28 | Micron Technology, Inc. | Methods of forming wire bonds for semiconductor constructions |
| TWI317850B (en) * | 2006-05-19 | 2009-12-01 | Toppan Chunghwa Electronic Co Ltd | Structure and fabricating method of compound phase-shift mask |
| CN101122736A (zh) * | 2006-07-06 | 2008-02-13 | Asml蒙片工具有限公司 | 一种改进的cpl掩模及产生cpl掩模的方法和程序产品 |
| US7776494B2 (en) * | 2006-12-28 | 2010-08-17 | Global Foundries Inc. | Lithographic mask and methods for fabricating a semiconductor device |
| KR100914291B1 (ko) * | 2007-10-31 | 2009-08-27 | 주식회사 하이닉스반도체 | 림 타입의 포토마스크 제조방법 |
| US8268542B2 (en) * | 2007-12-03 | 2012-09-18 | International Business Machines Corporation | Method for reducing side lobe printing using a barrier layer |
| US7930657B2 (en) | 2008-01-23 | 2011-04-19 | Micron Technology, Inc. | Methods of forming photomasks |
| US8845908B2 (en) | 2010-08-24 | 2014-09-30 | Micron Technology, Inc. | Reticles, and methods of mitigating asymmetric lens heating in photolithography |
| US8691478B2 (en) | 2012-09-10 | 2014-04-08 | Industrial Technology Research Institute | Attenuated phase shift mask for multi-patterning |
| TWI704647B (zh) * | 2015-10-22 | 2020-09-11 | 聯華電子股份有限公司 | 積體電路及其製程 |
| KR102315273B1 (ko) | 2017-05-25 | 2021-10-20 | 삼성전자 주식회사 | 위상 반전 마스크 및 반도체 소자의 제조 방법 |
| CN116027644B (zh) * | 2023-02-03 | 2025-12-05 | 中国科学院微电子研究所 | 一种光刻对准结构及其制造方法 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6007324A (en) * | 1977-10-23 | 1999-12-28 | Taiwan Semiconductor Manufacturing Company, Ltd. | Double layer method for fabricating a rim type attenuating phase shifting mask |
| DE69028871T2 (de) | 1989-04-28 | 1997-02-27 | Fujitsu Ltd | Maske, Herstellungsverfahren und Musterherstellung mit einer solchen Maske |
| DE69131497T2 (de) * | 1990-06-21 | 2000-03-30 | Matsushita Electronics Corp., Kadoma | Photomaske, die in der Photolithographie benutzt wird und ein Herstellungsverfahren derselben |
| US5578402A (en) * | 1990-06-21 | 1996-11-26 | Matsushita Electronics Corporation | Photomask used by photolithography and a process of producing same |
| US5217830A (en) * | 1991-03-26 | 1993-06-08 | Micron Technology, Inc. | Method of fabricating phase shifting reticles using ion implantation |
| US5208125A (en) * | 1991-07-30 | 1993-05-04 | Micron Technology, Inc. | Phase shifting reticle fabrication using ion implantation |
| US5308721A (en) * | 1992-06-29 | 1994-05-03 | At&T Bell Laboratories | Self-aligned method of making phase-shifting lithograhic masks having three or more phase-shifts |
| TW284911B (de) * | 1992-08-18 | 1996-09-01 | At & T Corp | |
| US5789118A (en) * | 1992-08-21 | 1998-08-04 | Intel Corporation | Method and apparatus for precision determination of phase-shift in a phase-shifted reticle |
| US5348826A (en) * | 1992-08-21 | 1994-09-20 | Intel Corporation | Reticle with structurally identical inverted phase-shifted features |
| US5302477A (en) * | 1992-08-21 | 1994-04-12 | Intel Corporation | Inverted phase-shifted reticle |
| US5300379A (en) * | 1992-08-21 | 1994-04-05 | Intel Corporation | Method of fabrication of inverted phase-shifted reticle |
| US5700602A (en) * | 1992-08-21 | 1997-12-23 | Intel Corporation | Method and apparatus for precision determination of phase-shift in a phase-shifted reticle |
| KR0158904B1 (ko) * | 1994-12-02 | 1999-02-01 | 김주용 | 콘택마스크 |
| US6680150B2 (en) * | 2001-05-25 | 2004-01-20 | Agere Systems Inc. | Suppression of side-lobe printing by shape engineering |
-
2002
- 2002-02-05 US US10/072,440 patent/US6841310B2/en not_active Expired - Fee Related
-
2003
- 2003-01-24 JP JP2003566622A patent/JP4139859B2/ja not_active Expired - Fee Related
- 2003-01-24 AT AT03719289T patent/ATE500535T1/de not_active IP Right Cessation
- 2003-01-24 AU AU2003223161A patent/AU2003223161A1/en not_active Abandoned
- 2003-01-24 DE DE60336208T patent/DE60336208D1/de not_active Expired - Lifetime
- 2003-01-24 EP EP03719289A patent/EP1472575B1/de not_active Expired - Lifetime
- 2003-01-24 WO PCT/US2003/002288 patent/WO2003067330A2/en not_active Ceased
- 2003-01-24 KR KR1020047012099A patent/KR100590360B1/ko not_active Expired - Fee Related
- 2003-01-24 CN CN038079208A patent/CN1646987B/zh not_active Expired - Fee Related
- 2003-01-30 TW TW092102210A patent/TW579457B/zh not_active IP Right Cessation
-
2004
- 2004-09-01 US US10/931,883 patent/US7291425B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP1472575A2 (de) | 2004-11-03 |
| EP1472575B1 (de) | 2011-03-02 |
| JP4139859B2 (ja) | 2008-08-27 |
| US7291425B2 (en) | 2007-11-06 |
| JP2006504981A (ja) | 2006-02-09 |
| WO2003067330A3 (en) | 2004-04-08 |
| DE60336208D1 (de) | 2011-04-14 |
| KR100590360B1 (ko) | 2006-06-19 |
| CN1646987A (zh) | 2005-07-27 |
| TW200307857A (en) | 2003-12-16 |
| WO2003067330A2 (en) | 2003-08-14 |
| US6841310B2 (en) | 2005-01-11 |
| KR20040081488A (ko) | 2004-09-21 |
| US20030152844A1 (en) | 2003-08-14 |
| TW579457B (en) | 2004-03-11 |
| WO2003067330B1 (en) | 2004-04-29 |
| CN1646987B (zh) | 2010-05-26 |
| AU2003223161A1 (en) | 2003-09-02 |
| US20050026052A1 (en) | 2005-02-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| ATE500535T1 (de) | Belichtungsmasken, und methoden zur herstellung von masken | |
| WO2005043249A3 (en) | Composite optical lithography method for patterning lines of unequal width | |
| WO2004093141A3 (en) | Methods for producing light emitting device | |
| GB2389454B (en) | Maskless particle-beam system for exposing a pattern on a substrate | |
| WO2002101803A1 (en) | Mask and production method therefor and production method for semiconductor device | |
| WO2007137058A3 (en) | Methods to reduce the minimum pitch in a pattern | |
| TW200636865A (en) | Method for etching a molybdenum layer suitable for photomask fabrication | |
| TW200707527A (en) | Method of correcting mask pattern and method of forming the same | |
| TW200504851A (en) | Semiconductor device manufacture method and etching system | |
| PL1611466T3 (pl) | Sposób wytwarzania dwóch nakładających się mikrostruktur | |
| TW200612479A (en) | Method for fabricating semiconductor device using tungsten as sacrificial hard mask | |
| ATE364573T1 (de) | Mikromechanische uhrwerkbauteile und verfahren zu ihrer herstellung | |
| WO2004082111A3 (en) | Mosfet power transistors and methods | |
| EP1707648A3 (de) | Abscheidungsmaske | |
| WO2004072737A3 (en) | Method for generating a circular periodic structure on a basic support material | |
| EP1635217A4 (de) | Prozess zur herstellung eines halbleiterbauelements und zur erzeugung von maskenstrukturdaten | |
| TW200602816A (en) | Method of manufacturing micro-structure body, method of manufacturing stamper using the micro-structure body, and method of manufacturing micro-structure body made of resin using the stamper | |
| TW200516712A (en) | Method for forming metal line in semiconductor device | |
| TW200509201A (en) | Exposure method, mask, manufacturing method of semiconductor device, and semiconductor device | |
| TW200735175A (en) | Integrated circuit fabrication | |
| TW340966B (en) | The salicide process for mask ROM | |
| TW200507016A (en) | Method for manufacturing mask for focus monitoring, and method for manufacturing semiconductor device | |
| TW200604725A (en) | Mask for decreasing the fabrication cost and method for design the same | |
| TW200509199A (en) | Method and apparatus for manufacturing multiple circuit patterns using a multiple project mask | |
| TW200722909A (en) | Method of forming etching mask |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |