ATE501202T1 - Benzoxazin enthaltende vernetztbare misschungen - Google Patents

Benzoxazin enthaltende vernetztbare misschungen

Info

Publication number
ATE501202T1
ATE501202T1 AT03702069T AT03702069T ATE501202T1 AT E501202 T1 ATE501202 T1 AT E501202T1 AT 03702069 T AT03702069 T AT 03702069T AT 03702069 T AT03702069 T AT 03702069T AT E501202 T1 ATE501202 T1 AT E501202T1
Authority
AT
Austria
Prior art keywords
underfills
cross
mixtures containing
resin
containing benzoxazine
Prior art date
Application number
AT03702069T
Other languages
English (en)
Inventor
Osama Musa
Original Assignee
Henkel Ag & Co Kgaa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel Ag & Co Kgaa filed Critical Henkel Ag & Co Kgaa
Application granted granted Critical
Publication of ATE501202T1 publication Critical patent/ATE501202T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D265/00—Heterocyclic compounds containing six-membered rings having one nitrogen atom and one oxygen atom as the only ring hetero atoms
    • C07D265/04—1,3-Oxazines; Hydrogenated 1,3-oxazines
    • C07D265/12—1,3-Oxazines; Hydrogenated 1,3-oxazines condensed with carbocyclic rings or ring systems
    • C07D265/14—1,3-Oxazines; Hydrogenated 1,3-oxazines condensed with carbocyclic rings or ring systems condensed with one six-membered ring
    • C07D265/16—1,3-Oxazines; Hydrogenated 1,3-oxazines condensed with carbocyclic rings or ring systems condensed with one six-membered ring with only hydrogen or carbon atoms directly attached in positions 2 and 4
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Paints Or Removers (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
AT03702069T 2002-02-23 2003-01-10 Benzoxazin enthaltende vernetztbare misschungen ATE501202T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/080,738 US6620905B1 (en) 2002-02-23 2002-02-23 Curable compositions containing benzoxazine
PCT/US2003/000859 WO2003072638A1 (en) 2002-02-23 2003-01-10 Curable compositions containing benzoxazine

Publications (1)

Publication Number Publication Date
ATE501202T1 true ATE501202T1 (de) 2011-03-15

Family

ID=27765239

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03702069T ATE501202T1 (de) 2002-02-23 2003-01-10 Benzoxazin enthaltende vernetztbare misschungen

Country Status (7)

Country Link
US (1) US6620905B1 (de)
EP (1) EP1476493B1 (de)
AT (1) ATE501202T1 (de)
AU (1) AU2003202955A1 (de)
DE (1) DE60336302D1 (de)
TW (1) TWI243834B (de)
WO (1) WO2003072638A1 (de)

Families Citing this family (66)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2379505A1 (en) * 2001-04-02 2002-10-02 Hidenori Tanaka Coating composition containing benzoxazine compound
US6899960B2 (en) * 2002-03-22 2005-05-31 Intel Corporation Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material
WO2003107427A1 (en) * 2002-06-17 2003-12-24 Henkel Loctite Corporation Interlayer dielectric and pre-applied die attach adhesive materials
US7176044B2 (en) * 2002-11-25 2007-02-13 Henkel Corporation B-stageable die attach adhesives
US7157509B2 (en) * 2003-06-27 2007-01-02 Henkel Corporation Curable compositions
US20050042961A1 (en) * 2003-08-18 2005-02-24 Henkel Loctite Corporation Curable compositions for advanced processes, and products made therefrom
US7390430B2 (en) * 2004-02-17 2008-06-24 National Starch And Chemical Investment Holding Corporation Curable liquid compositions containing bisoxazoline
US20060025509A1 (en) * 2004-07-29 2006-02-02 Ruzhi Zhang Fluxing no-flow underfill composition containing benzoxazines
KR101255866B1 (ko) * 2004-11-30 2013-04-17 가부시끼가이샤 다이셀 지환식 에폭시(메트)아크릴레이트 및 그의 제조 방법, 및공중합체
US7666938B2 (en) * 2004-12-03 2010-02-23 Henkel Corporation Nanoparticle silica filled benzoxazine compositions
US8029889B1 (en) 2004-12-03 2011-10-04 Henkel Corporation Prepregs, towpregs and preforms
US7649060B2 (en) * 2005-12-02 2010-01-19 Henkel Corporation Curable compositions
JP2006265433A (ja) * 2005-03-25 2006-10-05 Toyo Ink Mfg Co Ltd 硬化性材料、および、それを硬化させてなる硬化物
KR100818254B1 (ko) 2005-09-03 2008-03-31 삼성에스디아이 주식회사 폴리벤조옥사진계 화합물, 이를 포함한 전해질막 및 이를채용한 연료전지
KR100818253B1 (ko) 2005-09-03 2008-04-01 삼성에스디아이 주식회사 폴리벤조옥사진계 화합물, 이를 포함한 전해질막 및 이를채용한 연료전지
EP2218748B1 (de) * 2005-09-03 2012-10-10 Samsung SDI Co., Ltd. Polybenzoxazin Verbindung, Elektrolyt-Membran enthaltend dieser Verbindung und Elektrolyt-Membran benutzende Brenndstofzell
US7674864B2 (en) * 2005-12-23 2010-03-09 Boston Scientific Scimed, Inc. Polymeric hybrid precursors, polymeric hybrid precursor composite matrices, medical devices, and methods
US8455088B2 (en) 2005-12-23 2013-06-04 Boston Scientific Scimed, Inc. Spun nanofiber, medical devices, and methods
CN101490187A (zh) * 2006-05-16 2009-07-22 洛德公司 用于电子组件的可固化的防护剂
KR100818255B1 (ko) * 2006-05-29 2008-04-02 삼성에스디아이 주식회사 폴리벤조옥사진계 화합물, 이를 포함한 전해질막 및 이를채용한 연료전지
KR100745741B1 (ko) 2006-08-22 2007-08-02 삼성에스디아이 주식회사 연료전지용 막 전극 접합체 및 이를 채용한 연료전지
CN101578332B (zh) * 2006-11-13 2014-04-16 汉高公司 具有核壳橡胶的苯并噁嗪组合物
US7537827B1 (en) 2006-12-13 2009-05-26 Henkel Corporation Prepreg laminates
EP2167478A4 (de) * 2007-06-18 2011-07-27 Henkel Corp Benzoxazinhaltige stoffzusammensetzungen und daraus hergestellte härtbare zusammensetzungen
EP2036910B1 (de) * 2007-09-11 2012-06-27 Samsung Electronics Co., Ltd. Auf Benzoxazin basierendes Monomer, entsprechendes Polymer, Elektrode für eine Brennstoffelektrode, die dieses enthält, Elektrolytmembran für eine Brennstoffelektrode, die dieses enthält, und Brennstoffelektrode, die dieses einsetzt
EP2036912B1 (de) 2007-09-11 2012-08-08 Samsung Electronics Co., Ltd. Phosphor enthaltendes, auf Benzoxazin basierendes Monomer, entsprechendes Polymer, Elektrode für eine Brennstoffelektrode, die dieses enthält, Elektrolytmembran für eine Brennstoffelektrode, die dieses enthält, und Brennstoffelektrode, die dieses einsetzt
KR101366808B1 (ko) * 2007-10-11 2014-02-25 삼성전자주식회사 폴리벤즈이미다졸-염기 복합체, 이로부터 형성된폴리벤조옥사진계 화합물의 가교체 및 이를 이용한연료전지
KR101537311B1 (ko) * 2007-11-02 2015-07-17 삼성전자주식회사 연료전지용 전해질막 및 이를 이용한 연료전지
EP2058321B1 (de) 2007-11-02 2014-01-08 Samsung Electronics Co., Ltd. Phosphor enthaltendes Monomer, entsprechendes Polymer, Elektrode für eine Brennstoffzelle, die das Polymer enthält, Elektrolytmembran für eine Brennstoffzelle, die das Polymer enthält, und Brennstoffelektrode, die die Elektrode einsetzt
US8188210B2 (en) * 2007-11-02 2012-05-29 Samsung Electronics Co., Ltd. Naphthoxazine benzoxazine-based monomer, polymer thereof, electrode for fuel cell including the polymer, electrolyte membrane for fuel cell including the polymer, and fuel cell using the electrode
EP2062891B1 (de) 2007-11-06 2012-08-08 Samsung Electronics Co., Ltd. Auf Benzoxazin basierendes Monomer, entsprechendes Polymer, Elektrode für eine Brennstoffzelle, die das Polymer enthält, Elektrolytmembran für eine Brennstoffzelle, die das Polymer enthält, und Brennstoffzelle, die die Elektrode einsetzt
CN101883807B (zh) * 2007-12-06 2013-08-14 汉高两合股份公司 可固化苯并噁嗪大分子单体、它们的制备及其固化产物
CN101952262B (zh) * 2008-02-21 2012-07-18 亨斯迈先进材料美国有限责任公司 用于高tg应用的无卤苯并噁嗪基可固化组合物
WO2009133011A1 (en) * 2008-05-02 2009-11-05 Henkel Ag & Co. Kgaa Benzoxazine compositions containing (co)polymer
US8215585B2 (en) * 2008-05-13 2012-07-10 The Boeing Company Impact resistant core
US8286919B2 (en) * 2008-05-13 2012-10-16 The Boeing Company Impact resistant composite structures
JP2011526991A (ja) * 2008-06-30 2011-10-20 ヘンケル コーポレイション 高性能接着剤およびそれらの使用方法
JP5484464B2 (ja) * 2008-08-14 2014-05-07 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン 重合性組成物
US8383706B2 (en) * 2009-06-05 2013-02-26 3M Innovative Properties Company Benzoxazine-thiol adducts
US8389758B2 (en) * 2009-06-05 2013-03-05 3M Innovative Properties Company Benzoxazine-thiol adducts
JP5654026B2 (ja) * 2009-10-15 2015-01-14 ヘンケル コーポレイションＨｅｎｋｅｌ Ｃｏｒｐｏｒａｔｉｏｎ 嫌気硬化性組成物
CN101817925B (zh) * 2010-04-15 2011-09-21 华烁科技股份有限公司 存储稳定性高的二氨型苯并噁嗪树脂的制造方法
WO2012018753A1 (en) * 2010-08-04 2012-02-09 3M Innovative Properties Company Method of preparing benzoxazine-thiol polymer films
US8410202B1 (en) * 2011-10-24 2013-04-02 Xerox Corporation Coating compositions
TWI450913B (zh) * 2011-11-04 2014-09-01 Elite Material Co Ltd Thermosetting resin composition and application board and circuit board
GB201205574D0 (en) * 2012-03-29 2012-05-16 Cytec Tech Corp Benzoxazines and compositions containing the same
WO2013161088A1 (en) * 2012-04-25 2013-10-31 Henkel Ag & Co. Kgaa Curable resin composition, cured product and method of producing a cured product
KR20150125003A (ko) * 2013-03-04 2015-11-06 헌츠만 어드밴스드 머티리얼스 아메리카스 엘엘씨 폴리설폰계 강인화제를 함유하는 벤족사진 경화성 조성물
KR20160003641A (ko) * 2013-04-30 2016-01-11 쓰리엠 이노베이티브 프로퍼티즈 컴파니 폴리(벤족사진)의 제조 방법
CN104449484B (zh) * 2013-09-25 2018-06-15 3M创新有限公司 压敏胶、导电胶组合物及由其制得的胶带和用途
CN103694192B (zh) * 2013-12-26 2015-06-17 上海交通大学 一种具光引发性能的苯并噁嗪化合物、制备方法及其应用
US9540539B2 (en) * 2014-05-27 2017-01-10 Infineon Technologies Ag Primer composition, method of forming a primer layer on a semiconductor device, and method of encapsulating a semiconductor device
CN106459558B (zh) * 2014-06-13 2019-03-08 Dic株式会社 固化性树脂组合物、其固化物、半导体密封材料、半导体装置、预浸料、电路基板、积层膜
US9902706B2 (en) * 2014-10-27 2018-02-27 Cytec Industries Inc. Process for making benzoxazines
CN107108885B (zh) * 2014-12-29 2019-09-03 塞特工业公司 三官能苯并噁嗪以及其在可固化树脂组合物和复合材料中的用途
CN105130975B (zh) * 2015-07-30 2017-11-17 哈尔滨工程大学 三胺型喹喔啉基苯并噁嗪及其制备方法
CN108350145B (zh) 2015-09-04 2021-06-22 卡本有限公司 用于增材制造的氰酸酯双重固化树脂
JP6268564B2 (ja) 2015-12-08 2018-01-31 Dic株式会社 オキサジン化合物、組成物及び硬化物
KR102644665B1 (ko) * 2015-12-16 2024-03-07 디아이씨 가부시끼가이샤 옥사진 화합물, 조성물 및 경화물
KR102644666B1 (ko) * 2015-12-16 2024-03-07 디아이씨 가부시끼가이샤 옥사진 화합물, 조성물 및 경화물
CN109082118B (zh) * 2017-06-14 2021-02-09 台光电子材料(昆山)有限公司 一种树脂组合物及其制品
CN109111739B (zh) * 2017-06-26 2020-12-01 中山台光电子材料有限公司 树脂组合物及由其制成的物品
CN109305896B (zh) * 2017-07-26 2022-07-19 郑州大学 一种低极性树脂及其制备方法和应用
US12030992B2 (en) * 2019-12-27 2024-07-09 Canon Kabushiki Kaisha Photocurable composition
WO2023009204A1 (en) * 2021-07-28 2023-02-02 Quadratic 3D, Inc. Compositions, methods for forming an article, and products thereof
CN117924207A (zh) * 2023-12-11 2024-04-26 中国科学院深圳先进技术研究院 一种高玻璃化转变温度的环氧树脂柔性薄膜

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4557979A (en) * 1984-02-17 1985-12-10 Monsanto Company Process for deposition of resin dispersions on metal substrates
US5543516A (en) 1994-05-18 1996-08-06 Edison Polymer Innovation Corporation Process for preparation of benzoxazine compounds in solventless systems
JPH10259248A (ja) * 1997-01-20 1998-09-29 Hitachi Chem Co Ltd 熱硬化性組成物及びその硬化物
US5900447A (en) 1997-05-01 1999-05-04 Edison Polymer Innovation Corporation Composition for forming high thermal conductivity polybenzoxazine-based material and method
US5973144A (en) 1997-10-03 1999-10-26 Ishida; Hatsuo High char yield benzoxazines
US6207786B1 (en) * 1998-11-10 2001-03-27 Edison Polymer Innovation Corporation Ternary systems of benzoxazine, epoxy, and phenolic resins
WO2000061650A1 (en) * 1999-04-14 2000-10-19 Edison Polymer Innovation Corporation Development of low viscosity benzoxazine resins
WO2001034581A1 (en) 1999-11-05 2001-05-17 The Dow Chemical Company High char yield benzoxazine compositions
US6437026B1 (en) 2001-01-05 2002-08-20 Cookson Singapore Pte Ltd. Hardener for epoxy molding compounds

Also Published As

Publication number Publication date
WO2003072638A1 (en) 2003-09-04
TWI243834B (en) 2005-11-21
AU2003202955A1 (en) 2003-09-09
EP1476493B1 (de) 2011-03-09
DE60336302D1 (de) 2011-04-21
EP1476493A1 (de) 2004-11-17
US6620905B1 (en) 2003-09-16
TW200400983A (en) 2004-01-16

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