ATE504385T1 - Verfahren und vorrichtung zum erhöhen der materialentfernungsrate bei der laserbearbeitung - Google Patents

Verfahren und vorrichtung zum erhöhen der materialentfernungsrate bei der laserbearbeitung

Info

Publication number
ATE504385T1
ATE504385T1 AT02797163T AT02797163T ATE504385T1 AT E504385 T1 ATE504385 T1 AT E504385T1 AT 02797163 T AT02797163 T AT 02797163T AT 02797163 T AT02797163 T AT 02797163T AT E504385 T1 ATE504385 T1 AT E504385T1
Authority
AT
Austria
Prior art keywords
laser
burst
bursts
increasing
time
Prior art date
Application number
AT02797163T
Other languages
English (en)
Inventor
Andrew Forsman
Paul Banks
Michael Perry
Original Assignee
Gen Atomics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gen Atomics filed Critical Gen Atomics
Application granted granted Critical
Publication of ATE504385T1 publication Critical patent/ATE504385T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
    • B23K26/0676—Dividing the beam into multiple beams, e.g. multi-focusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1 ns or less

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Lasers (AREA)
AT02797163T 2001-12-04 2002-12-03 Verfahren und vorrichtung zum erhöhen der materialentfernungsrate bei der laserbearbeitung ATE504385T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US33825801P 2001-12-04 2001-12-04
US10/120,731 US6664498B2 (en) 2001-12-04 2002-04-10 Method and apparatus for increasing the material removal rate in laser machining
PCT/US2002/038471 WO2003047807A1 (en) 2001-12-04 2002-12-03 Method and apparatus for increasing the material removal rate in laser machining

Publications (1)

Publication Number Publication Date
ATE504385T1 true ATE504385T1 (de) 2011-04-15

Family

ID=26818702

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02797163T ATE504385T1 (de) 2001-12-04 2002-12-03 Verfahren und vorrichtung zum erhöhen der materialentfernungsrate bei der laserbearbeitung

Country Status (9)

Country Link
US (1) US6664498B2 (de)
EP (1) EP1461181B1 (de)
JP (2) JP4741795B2 (de)
CN (1) CN100358668C (de)
AT (1) ATE504385T1 (de)
AU (1) AU2002362037A1 (de)
CA (1) CA2468723C (de)
DE (1) DE60239703D1 (de)
WO (1) WO2003047807A1 (de)

Families Citing this family (115)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7838794B2 (en) 1999-12-28 2010-11-23 Gsi Group Corporation Laser-based method and system for removing one or more target link structures
US7723642B2 (en) 1999-12-28 2010-05-25 Gsi Group Corporation Laser-based system for memory link processing with picosecond lasers
US6281471B1 (en) 1999-12-28 2001-08-28 Gsi Lumonics, Inc. Energy-efficient, laser-based method and system for processing target material
US7671295B2 (en) 2000-01-10 2010-03-02 Electro Scientific Industries, Inc. Processing a memory link with a set of at least two laser pulses
US6781090B2 (en) * 2001-03-12 2004-08-24 Electro Scientific Industries, Inc. Quasi-CW diode-pumped, solid-state harmonic laser system and method employing same
US6806440B2 (en) * 2001-03-12 2004-10-19 Electro Scientific Industries, Inc. Quasi-CW diode pumped, solid-state UV laser system and method employing same
US7027155B2 (en) * 2001-03-29 2006-04-11 Gsi Lumonics Corporation Methods and systems for precisely relatively positioning a waist of a pulsed laser beam and method and system for controlling energy delivered to a target structure
US20070173075A1 (en) * 2001-03-29 2007-07-26 Joohan Lee Laser-based method and system for processing a multi-material device having conductive link structures
US6664498B2 (en) * 2001-12-04 2003-12-16 General Atomics Method and apparatus for increasing the material removal rate in laser machining
ES2270062T3 (es) * 2002-03-13 2007-04-01 O-Pen Aps Tecladillo tactil y procedimiento de operacion de dicho tecladillo tactil.
US6951995B2 (en) 2002-03-27 2005-10-04 Gsi Lumonics Corp. Method and system for high-speed, precise micromachining an array of devices
US6580054B1 (en) * 2002-06-10 2003-06-17 New Wave Research Scribing sapphire substrates with a solid state UV laser
US6806544B2 (en) * 2002-11-05 2004-10-19 New Wave Research Method and apparatus for cutting devices from conductive substrates secured during cutting by vacuum pressure
US6960813B2 (en) * 2002-06-10 2005-11-01 New Wave Research Method and apparatus for cutting devices from substrates
WO2004068553A2 (en) * 2003-01-29 2004-08-12 The Regents Of The University Of Michigan Method for forming nanoscale features
US6979798B2 (en) * 2003-03-07 2005-12-27 Gsi Lumonics Corporation Laser system and method for material processing with ultra fast lasers
US7435940B2 (en) * 2003-03-12 2008-10-14 Flatfrog Laboratories Ab System and a method of determining the position of a radiation emitting element
EP1462206A1 (de) * 2003-03-26 2004-09-29 Lasag Ag Laservorrichtung zum Bohren von Löchern in Bauteilen einer Flüssigkeitsinjektionsvorrichtung
US6947454B2 (en) * 2003-06-30 2005-09-20 Electro Scientific Industries, Inc. Laser pulse picking employing controlled AOM loading
US7442914B2 (en) * 2003-09-12 2008-10-28 Flatfrog Laboratories Ab System and method of determining a position of a radiation emitting element
ATE514991T1 (de) 2003-09-12 2011-07-15 Flatfrog Lab Ab System und verfahren zur bestimmung einer position eines strahlungsstreu-/- reflexionselements
JP2005138143A (ja) * 2003-11-06 2005-06-02 Disco Abrasive Syst Ltd レーザ光線を利用する加工装置
US20050136622A1 (en) * 2003-12-18 2005-06-23 Mulligan Rose A. Methods and apparatus for laser dicing
US7173212B1 (en) 2004-02-13 2007-02-06 Semak Vladimir V Method and apparatus for laser cutting and drilling of semiconductor materials and glass
US7486705B2 (en) 2004-03-31 2009-02-03 Imra America, Inc. Femtosecond laser processing system with process parameters, controls and feedback
US7491909B2 (en) * 2004-03-31 2009-02-17 Imra America, Inc. Pulsed laser processing with controlled thermal and physical alterations
US7885311B2 (en) 2007-03-27 2011-02-08 Imra America, Inc. Beam stabilized fiber laser
US7352784B2 (en) * 2004-07-20 2008-04-01 Jds Uniphase Corporation Laser burst boosting method and apparatus
US20060114948A1 (en) * 2004-11-29 2006-06-01 Lo Ho W Workpiece processing system using a common imaged optical assembly to shape the spatial distributions of light energy of multiple laser beams
US7396706B2 (en) * 2004-12-09 2008-07-08 Electro Scientific Industries, Inc. Synchronization technique for forming a substantially stable laser output pulse profile having different wavelength peaks
US7301981B2 (en) 2004-12-09 2007-11-27 Electro Scientific Industries, Inc. Methods for synchronized pulse shape tailoring
DE602006004913D1 (de) * 2005-04-28 2009-03-12 Semiconductor Energy Lab Verfahren und Vorrichtung zur Herstellung von Halbleitern mittels Laserstrahlung
FI20060358L (fi) * 2006-04-12 2007-10-13 Picodeon Ltd Oy Menetelmä ablaatiokynnyksen säätämiseksi
KR100795526B1 (ko) * 2006-03-02 2008-01-16 한국표준과학연구원 물질상태변이 유발을 통한 레이저 가공방법 및 가공장치
WO2007121142A2 (en) * 2006-04-12 2007-10-25 The Regents Of The University Of California Improved light source employing laser-produced plasma
US8624157B2 (en) 2006-05-25 2014-01-07 Electro Scientific Industries, Inc. Ultrashort laser pulse wafer scribing
US20080018943A1 (en) * 2006-06-19 2008-01-24 Eastman Kodak Company Direct engraving of flexographic printing plates
US8084706B2 (en) 2006-07-20 2011-12-27 Gsi Group Corporation System and method for laser processing at non-constant velocities
EP2250714B1 (de) * 2008-02-19 2015-01-14 Bergmann Messgeräte Entwicklung KG Burst-erzeugung von laserimpulsen
CN105583526B (zh) 2008-03-21 2018-08-17 Imra美国公司 基于激光的材料加工方法和系统
US20090246530A1 (en) * 2008-03-27 2009-10-01 Imra America, Inc. Method For Fabricating Thin Films
US20090246413A1 (en) * 2008-03-27 2009-10-01 Imra America, Inc. Method for fabricating thin films
US20110122387A1 (en) * 2008-05-13 2011-05-26 The Regents Of The University Of California System and method for light source employing laser-produced plasma
SE533704C2 (sv) 2008-12-05 2010-12-07 Flatfrog Lab Ab Pekkänslig apparat och förfarande för drivning av densamma
US8246714B2 (en) * 2009-01-30 2012-08-21 Imra America, Inc. Production of metal and metal-alloy nanoparticles with high repetition rate ultrafast pulsed laser ablation in liquids
US10307862B2 (en) * 2009-03-27 2019-06-04 Electro Scientific Industries, Inc Laser micromachining with tailored bursts of short laser pulses
US8524139B2 (en) * 2009-08-10 2013-09-03 FEI Compay Gas-assisted laser ablation
DK2289708T3 (da) * 2009-08-26 2012-02-27 Indaffil Holding Ag Fremgangsmåde til fremstilling af en overfladestruktur af en metallisk trykkeplade, et endeløst bånd eller en prægevalse
US8890025B2 (en) * 2009-09-24 2014-11-18 Esi-Pyrophotonics Lasers Inc. Method and apparatus to scribe thin film layers of cadmium telluride solar cells
DE102009044316B4 (de) * 2009-10-22 2015-04-30 Ewag Ag Verfahren zur Herstellung einer Fläche und/oder einer Kante an einem Rohling sowie Laserbearbeitungsvorrichtung zur Durchführung des Verfahrens
JP5724173B2 (ja) 2009-11-16 2015-05-27 オムロン株式会社 レーザ加工装置およびレーザ加工方法
US8858676B2 (en) * 2010-02-10 2014-10-14 Imra America, Inc. Nanoparticle production in liquid with multiple-pulse ultrafast laser ablation
US8540173B2 (en) * 2010-02-10 2013-09-24 Imra America, Inc. Production of fine particles of functional ceramic by using pulsed laser
US20110192450A1 (en) * 2010-02-10 2011-08-11 Bing Liu Method for producing nanoparticle solutions based on pulsed laser ablation for fabrication of thin film solar cells
KR20130059337A (ko) 2010-03-30 2013-06-05 아이엠알에이 아메리카, 인코포레이티드. 레이저 기반 재료 가공 장치 및 방법들
WO2011158617A1 (ja) * 2010-06-14 2011-12-22 三菱電機株式会社 レーザ加工装置、及びレーザ加工方法
US8927897B2 (en) * 2010-11-17 2015-01-06 Rolls-Royce Corporation Laser maintenance tool
KR20140006027A (ko) 2011-03-07 2014-01-15 아이엠알에이 아메리카, 인코포레이티드. 피크 전력이 증가한 광 펄스 소스
US20130289546A1 (en) * 2011-10-04 2013-10-31 Richard Stoltz Producing higher optical ablative power using multiple pulses having controllable temporal relationships
EP2788142B1 (de) 2011-12-07 2020-02-26 General Atomics Verfahren und systeme zur verwendung bei der laserbearbeitung
KR20130083721A (ko) * 2012-01-13 2013-07-23 삼성전자주식회사 레이저 어블레이션을 이용한 관통 실리콘 비아 형성방법
CN104488362B (zh) * 2012-05-21 2017-05-10 Asml荷兰有限公司 辐射源
US10168835B2 (en) 2012-05-23 2019-01-01 Flatfrog Laboratories Ab Spatial resolution in touch displays
WO2014022681A1 (en) 2012-08-01 2014-02-06 Gentex Corporation Assembly with laser induced channel edge and method thereof
TWI473373B (zh) 2012-11-30 2015-02-11 Ind Tech Res Inst 間隔時間可調脈衝序列產生裝置
US10019113B2 (en) 2013-04-11 2018-07-10 Flatfrog Laboratories Ab Tomographic processing for touch detection
WO2015005847A1 (en) 2013-07-12 2015-01-15 Flatfrog Laboratories Ab Partial detect mode
CN103343204A (zh) * 2013-07-19 2013-10-09 江苏大学 一种变脉宽激光器
US9102011B2 (en) * 2013-08-02 2015-08-11 Rofin-Sinar Technologies Inc. Method and apparatus for non-ablative, photoacoustic compression machining in transparent materials using filamentation by burst ultrafast laser pulses
CN103484653B (zh) * 2013-09-04 2015-09-09 中国航空工业集团公司北京航空制造工程研究所 环形激光冲击强化紧固孔的装置和方法
US10146376B2 (en) 2014-01-16 2018-12-04 Flatfrog Laboratories Ab Light coupling in TIR-based optical touch systems
WO2015108480A1 (en) 2014-01-16 2015-07-23 Flatfrog Laboratories Ab Improvements in tir-based optical touch systems of projection-type
EP3161594A4 (de) 2014-06-27 2018-01-17 FlatFrog Laboratories AB Nachweis von oberflächenverschmutzung
CN104308368B (zh) * 2014-09-03 2015-12-30 大连理工大学 多脉冲激光烧蚀金属覆层定量去除方法
CN107209608A (zh) 2015-01-28 2017-09-26 平蛙实验室股份公司 动态触摸隔离帧
US10318074B2 (en) 2015-01-30 2019-06-11 Flatfrog Laboratories Ab Touch-sensing OLED display with tilted emitters
EP3537269A1 (de) 2015-02-09 2019-09-11 FlatFrog Laboratories AB Optisches berührungssystem
WO2016140612A1 (en) 2015-03-02 2016-09-09 Flatfrog Laboratories Ab Optical component for light coupling
US10391586B1 (en) 2015-03-11 2019-08-27 Coherent, Inc. Method for laser-marking of anodized aluminum
US10672603B2 (en) 2015-10-23 2020-06-02 Infineon Technologies Ag System and method for removing dielectric material
JP2018536944A (ja) 2015-12-09 2018-12-13 フラットフロッグ ラボラトリーズ アーベーＦｌａｔＦｒｏｇ Ｌａｂｏｒａｔｏｒｉｅｓ ＡＢ 改善されたスタイラスの識別
US20170189992A1 (en) * 2015-12-31 2017-07-06 Nlight, Inc. Black sub-anodized marking using picosecond bursts
CN105397314B (zh) * 2015-12-31 2017-03-08 中国航空工业集团公司北京航空制造工程研究所 复合脉冲激光打孔方法及装置
US20170225393A1 (en) * 2016-02-04 2017-08-10 Global Filtration Systems, A Dba Of Gulf Filtration Systems Inc. Apparatus and method for forming three-dimensional objects using two-photon absorption linear solidification
CN106346141B (zh) * 2016-09-07 2019-04-12 华中科技大学 一种基于复合激光束的金属切割装置
TWI630974B (zh) * 2016-11-02 2018-08-01 財團法人工業技術研究院 雷射系統及雷射炫彩加工方法
WO2018096430A1 (en) 2016-11-24 2018-05-31 Flatfrog Laboratories Ab Automatic optimisation of touch signal
KR102495467B1 (ko) 2016-12-07 2023-02-06 플라트프로그 라보라토리즈 에이비 개선된 터치 장치
CN116679845A (zh) 2017-02-06 2023-09-01 平蛙实验室股份公司 触摸感测装置
US20180275830A1 (en) 2017-03-22 2018-09-27 Flatfrog Laboratories Ab Object characterisation for touch displays
EP4036697B1 (de) 2017-03-28 2026-01-07 FlatFrog Laboratories AB Optische berührungserfassungsvorrichtung
WO2019023015A1 (en) 2017-07-25 2019-01-31 Imra America, Inc. MULTI PULSE AMPLIFICATION
WO2019045629A1 (en) 2017-09-01 2019-03-07 Flatfrog Laboratories Ab IMPROVED OPTICAL COMPONENT
EP3697564B1 (de) * 2017-11-20 2023-10-18 IPG Photonics Corporation Lasersystem und -verfahren zur verarbeitung von materialien
JP7096000B2 (ja) * 2018-01-30 2022-07-05 浜松ホトニクス株式会社 レーザ加工装置及びレーザ加工方法
US11567610B2 (en) 2018-03-05 2023-01-31 Flatfrog Laboratories Ab Detection line broadening
CN108907478A (zh) * 2018-08-15 2018-11-30 东莞市盛雄激光设备有限公司 一种激光切割装置和方法
US12535586B2 (en) 2018-08-31 2026-01-27 SiLC Technology, Inc. Reduction of ADC sampling rates in LIDAR systems
US12055969B2 (en) 2018-10-20 2024-08-06 Flatfrog Laboratories Ab Frame for a touch-sensitive device and tool therefor
CN109967865B (zh) * 2018-12-20 2020-07-10 华中科技大学 一种基于注入式电离的超短激光脉冲加工系统及其应用
EP3685954B1 (de) * 2019-01-22 2024-01-24 Synova S.A. Verfahren zum schneiden eines werkstücks mit einem komplexen fluidstrahlgeführten laserstrahl
WO2020153890A1 (en) 2019-01-25 2020-07-30 Flatfrog Laboratories Ab A videoconferencing terminal and method of operating the same
CN110091075A (zh) * 2019-05-31 2019-08-06 大族激光科技产业集团股份有限公司 晶圆开槽方法及装置
ES2991658T3 (es) 2019-11-25 2024-12-04 Flatfrog Lab Ab Un aparato táctil
US12282653B2 (en) 2020-02-08 2025-04-22 Flatfrog Laboratories Ab Touch apparatus with low latency interactions
JP7681911B2 (ja) 2020-02-10 2025-05-23 フラットフロッグ ラボラトリーズ アーベー 改良型タッチ検知装置
JP7421951B2 (ja) 2020-02-26 2024-01-25 浜松ホトニクス株式会社 レーザ加工装置及びレーザ加工方法
WO2022019311A1 (ja) * 2020-07-20 2022-01-27 古河電気工業株式会社 金属箔のレーザ切断方法
JP7453130B2 (ja) * 2020-11-26 2024-03-19 株式会社モリタ製作所 歯科用治療装置
CN113589616A (zh) * 2021-07-26 2021-11-02 苏州大学 一种基于等离子体吸收增强的激光与物质作用加强方法
US12578443B2 (en) 2022-04-23 2026-03-17 Silc Technologies, Inc. Data refinement in optical imaging systems
CN115464280A (zh) * 2022-10-27 2022-12-13 广东中科微精光子制造科技有限公司 激光钻孔装置
EP4410469A1 (de) 2023-01-31 2024-08-07 Vilnius University Ablation von materialien mit zwei zeitgetrennten laserpulsen
US12578439B2 (en) 2023-04-11 2026-03-17 Silc Technologies, Inc. Increasing resolution in imaging systems
US20250347785A1 (en) * 2024-05-09 2025-11-13 Silc Technologies, Inc. Increasing range of imaging systems

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4059759A (en) * 1976-05-25 1977-11-22 The United States Of America As Represented By The United States Energy Research And Development Administration Passive and active pulse stacking scheme for pulse shaping
US4769523A (en) * 1985-03-08 1988-09-06 Nippon Kogaku K.K. Laser processing apparatus
US5312396A (en) * 1990-09-06 1994-05-17 Massachusetts Institute Of Technology Pulsed laser system for the surgical removal of tissue
GB9308981D0 (en) * 1993-04-30 1993-06-16 Science And Engineering Resear Laser-excited x-ray source
US5742634A (en) * 1994-08-24 1998-04-21 Imar Technology Co. Picosecond laser
US5790574A (en) * 1994-08-24 1998-08-04 Imar Technology Company Low cost, high average power, high brightness solid state laser
US5554335A (en) 1995-02-22 1996-09-10 Laser Light Technologies, Inc. Process for engraving ceramic surfaces using local laser vitrification
US6150630A (en) * 1996-01-11 2000-11-21 The Regents Of The University Of California Laser machining of explosives
US5720894A (en) * 1996-01-11 1998-02-24 The Regents Of The University Of California Ultrashort pulse high repetition rate laser system for biological tissue processing
WO1998015380A1 (en) 1996-10-08 1998-04-16 The University Of Arkansas Process and apparatus for sequential multi-beam laser processing of materials
US6156030A (en) * 1997-06-04 2000-12-05 Y-Beam Technologies, Inc. Method and apparatus for high precision variable rate material removal and modification
CA2332154C (en) * 2000-01-25 2009-09-15 Peter R. Herman Burst-ultrafast laser machining method
US6552301B2 (en) * 2000-01-25 2003-04-22 Peter R. Herman Burst-ultrafast laser machining method
US6676878B2 (en) * 2001-01-31 2004-01-13 Electro Scientific Industries, Inc. Laser segmented cutting
EP1328372B1 (de) * 2000-10-26 2006-11-29 Xsil Technology Limited Steueurung von laserbearbeitung
US6689985B2 (en) * 2001-01-17 2004-02-10 Orbotech, Ltd. Laser drill for use in electrical circuit fabrication
US6864459B2 (en) * 2001-02-08 2005-03-08 The Regents Of The University Of California High precision, rapid laser hole drilling
US7027155B2 (en) * 2001-03-29 2006-04-11 Gsi Lumonics Corporation Methods and systems for precisely relatively positioning a waist of a pulsed laser beam and method and system for controlling energy delivered to a target structure
US6664498B2 (en) * 2001-12-04 2003-12-16 General Atomics Method and apparatus for increasing the material removal rate in laser machining

Also Published As

Publication number Publication date
US20030183603A1 (en) 2003-10-02
EP1461181A1 (de) 2004-09-29
CA2468723C (en) 2011-08-16
US6664498B2 (en) 2003-12-16
WO2003047807A1 (en) 2003-06-12
AU2002362037A1 (en) 2003-06-17
CA2468723A1 (en) 2003-06-12
JP2009202234A (ja) 2009-09-10
JP2005511314A (ja) 2005-04-28
EP1461181A4 (de) 2008-04-02
CN100358668C (zh) 2008-01-02
CN1617783A (zh) 2005-05-18
JP4741795B2 (ja) 2011-08-10
DE60239703D1 (de) 2011-05-19
EP1461181B1 (de) 2011-04-06

Similar Documents

Publication Publication Date Title
DE60239703D1 (de) Verfahren und vorrichtung zum erhöhen der materialentfernungsrate bei der laserbearbeitung
DE60041181D1 (de) Verfahren und vorrichtung zum beschleunigten verbindungsaufbau während des weiterreichens in fortschrittlichen zellularen netzwerken
DE60008482D1 (de) Verfahren und Vorrichtung zum Strahlen von radförmig angeordneten Stücken durch Ultraschall
DE50212768D1 (de) Verfahren und vorrichtung zum einbringen von löchern in werkstücke mittels laserstrahlen
ATE315976T1 (de) Laser-bearbeitung von materialien
DE69300568D1 (de) Verfahren und Vorrichtung zum Laserschneiden paketierter Metallfolien.
DE602004002510D1 (de) Verfahren und Vorrichtung zum Puls- und Kurzschluss-Lichtbogenschweissen
DE60026807D1 (de) Vorrichtung sowie Verfahren zum Perforieren durch Ultraschall
DE69415484D1 (de) Vorrichtung und verfahren zum laserbearbeiten
DE69410202D1 (de) Verfahren und Vorrichtung zum thixotropen Druckgiessen von hochfesten Werkstücken
DE69908853D1 (de) Verfahren sowie Vorrichtung zum Vergleichen von Mustern durch aktive, visuelle Rückkopplung
DE69332237D1 (de) Vorrichtung und verfahren zur maximal wahrscheinlichkeitsfolgeschätzung
DE502004005513D1 (de) Verfahren und vorrichtung zum pressschweissen mit berücksichtigen der längenabweichungen der werkstücke
DE60302765D1 (de) Vorrichtung und verfahren zum herstellen von kristallinen teilchen
DE60325918D1 (de) Verfahren und Vorrichtung zum superplastischen Verformen von Werkstücken aus mehreren Platten
DE69619773D1 (de) Verfahren zum Ausstossen von Flüssigkeit, Flüssigkeitsausstosskopf und Vorrichtung zum Ausstossen von Flüssigkeit
DE68902126D1 (de) Verfahren und vorrichtung zum verbinden von werkstuecken mittels hart- oder weichloeten.
DE60306215D1 (de) Verfahren und Vorrichtung zum superplastischen Verformen
AU2003247166A1 (en) Laser processing method and laser processing apparatus using ultra-short pulse laser
EP1674189A4 (de) Ultrakurzpuls-laserbearbeitungsverfahren
DE69724185D1 (de) Verfahren zum Ausstossen von Flüssigkeit, Flüssigkeitsversorgungsverfahren, Flüssigkeitsausstosskopf, Flüssigkeitsausstosskopfkassette, die einen solchen Flüssigkeitsausstosskopf verwendet und Vorrichtung zum Ausstossen von Flüssigkeit
DE50114446D1 (de) Vorrichtung und Verfahren zum geräuschabhängigen Anpassen eines akustischen Nutzsignals
DE58907246D1 (de) Verfahren und Vorrichtung zum Schweissen von metallischen Werkstücken durch Ultraschall.
AT4855U3 (de) Verfahren und vorrichtung zum behandeln von maische
DE69302233D1 (de) Verfahren und Vorrichtung zum Werkstückhalten durch Einfrieren

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties