ATE506687T1 - Antenne zur erzeugung gleichförmiger prozessraten - Google Patents

Antenne zur erzeugung gleichförmiger prozessraten

Info

Publication number
ATE506687T1
ATE506687T1 AT04710690T AT04710690T ATE506687T1 AT E506687 T1 ATE506687 T1 AT E506687T1 AT 04710690 T AT04710690 T AT 04710690T AT 04710690 T AT04710690 T AT 04710690T AT E506687 T1 ATE506687 T1 AT E506687T1
Authority
AT
Austria
Prior art keywords
chamber
antenna
substrate
uniform process
generating uniform
Prior art date
Application number
AT04710690T
Other languages
English (en)
Inventor
Mark Wilcoxson
Andrew Bailey
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Application granted granted Critical
Publication of ATE506687T1 publication Critical patent/ATE506687T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32467—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/26—Supports; Mounting means by structural association with other equipment or articles with electric discharge tube
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Details Of Aerials (AREA)
  • Chemical Vapour Deposition (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Aerials With Secondary Devices (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Waveguide Aerials (AREA)
AT04710690T 2003-02-24 2004-02-12 Antenne zur erzeugung gleichförmiger prozessraten ATE506687T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/374,868 US6744213B2 (en) 1999-11-15 2003-02-24 Antenna for producing uniform process rates
PCT/US2004/004399 WO2004077608A2 (en) 2003-02-24 2004-02-12 Antenna for producing uniform process rates

Publications (1)

Publication Number Publication Date
ATE506687T1 true ATE506687T1 (de) 2011-05-15

Family

ID=32926260

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04710690T ATE506687T1 (de) 2003-02-24 2004-02-12 Antenne zur erzeugung gleichförmiger prozessraten

Country Status (10)

Country Link
US (2) US6744213B2 (de)
EP (1) EP1632006B1 (de)
JP (1) JP4869059B2 (de)
KR (1) KR101094124B1 (de)
CN (1) CN1833296B (de)
AT (1) ATE506687T1 (de)
DE (1) DE602004032334D1 (de)
IL (1) IL170926A (de)
TW (1) TWI326940B (de)
WO (1) WO2004077608A2 (de)

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US6855225B1 (en) * 2002-06-25 2005-02-15 Novellus Systems, Inc. Single-tube interlaced inductively coupling plasma source
GB0326500D0 (en) * 2003-11-13 2003-12-17 Oxford Instr Plasma Technology Gas port assembly
US20050205211A1 (en) * 2004-03-22 2005-09-22 Vikram Singh Plasma immersion ion implantion apparatus and method
US7686926B2 (en) * 2004-05-26 2010-03-30 Applied Materials, Inc. Multi-step process for forming a metal barrier in a sputter reactor
US7527713B2 (en) * 2004-05-26 2009-05-05 Applied Materials, Inc. Variable quadruple electromagnet array in plasma processing
US8187416B2 (en) * 2005-05-20 2012-05-29 Applied Materials, Inc. Interior antenna for substrate processing chamber
CN101543141B (zh) * 2006-11-28 2013-07-17 莎姆克株式会社 等离子处理装置
JP5098882B2 (ja) * 2007-08-31 2012-12-12 東京エレクトロン株式会社 プラズマ処理装置
JP5301812B2 (ja) * 2007-11-14 2013-09-25 東京エレクトロン株式会社 プラズマ処理装置
KR101312695B1 (ko) * 2009-08-21 2013-09-27 맷슨 테크놀로지, 인크. 유도 플라즈마 소스
US20110094994A1 (en) * 2009-10-26 2011-04-28 Applied Materials, Inc. Inductively coupled plasma apparatus
US20110094683A1 (en) 2009-10-26 2011-04-28 Applied Materials, Inc. Rf feed structure for plasma processing
JP5554047B2 (ja) * 2009-10-27 2014-07-23 東京エレクトロン株式会社 プラズマ処理装置
US9313872B2 (en) * 2009-10-27 2016-04-12 Tokyo Electron Limited Plasma processing apparatus and plasma processing method
JP5592098B2 (ja) * 2009-10-27 2014-09-17 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ処理方法
US8608903B2 (en) * 2009-10-27 2013-12-17 Tokyo Electron Limited Plasma processing apparatus and plasma processing method
US8741097B2 (en) * 2009-10-27 2014-06-03 Tokyo Electron Limited Plasma processing apparatus and plasma processing method
JP5554099B2 (ja) * 2010-03-18 2014-07-23 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ処理方法
SG10201502985TA (en) * 2010-04-20 2015-05-28 Lam Res Corp Methods and apparatus for an induction coil arrangement in a plasma processing system
JP5851682B2 (ja) * 2010-09-28 2016-02-03 東京エレクトロン株式会社 プラズマ処理装置
JP5916044B2 (ja) * 2010-09-28 2016-05-11 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ処理方法
US8884178B2 (en) * 2010-10-20 2014-11-11 Lam Research Corporation Methods and apparatus for igniting and sustaining plasma
JP5018994B1 (ja) * 2011-11-09 2012-09-05 日新電機株式会社 プラズマ処理装置
FR2998722B1 (fr) * 2012-11-23 2016-04-15 Thales Sa Systeme antennaire a boucles imbriquees et vehicule comprenant un tel systeme antennaire
CN105340059B (zh) * 2013-06-17 2019-03-22 应用材料公司 用于等离子体反应器的增强等离子体源
KR20150088453A (ko) * 2014-01-24 2015-08-03 한국전자통신연구원 다중 대역 플라즈마 루프 안테나
US9825597B2 (en) 2015-12-30 2017-11-21 Skyworks Solutions, Inc. Impedance transformation circuit for amplifier
US10062670B2 (en) 2016-04-18 2018-08-28 Skyworks Solutions, Inc. Radio frequency system-in-package with stacked clocking crystal
KR102629723B1 (ko) 2016-04-19 2024-01-30 스카이워크스 솔루션즈, 인코포레이티드 무선 주파수 모듈의 선택적 차폐
TWI859783B (zh) 2016-12-29 2024-10-21 美商天工方案公司 前端系統、無線通信裝置及封裝前端模組
US10515924B2 (en) 2017-03-10 2019-12-24 Skyworks Solutions, Inc. Radio frequency modules
US10460914B2 (en) 2017-11-30 2019-10-29 Lam Research Corporation Ferrite cage RF isolator for power circuitry
US20200209928A1 (en) * 2018-12-27 2020-07-02 Innolux Corporation Electronic device
CN111785605A (zh) * 2020-06-23 2020-10-16 北京北方华创微电子装备有限公司 一种线圈结构及半导体加工设备
KR20220045895A (ko) * 2020-10-06 2022-04-13 도쿄엘렉트론가부시키가이샤 플라즈마 처리 장치 및 플라즈마 처리용 코일
US12057339B2 (en) 2020-10-23 2024-08-06 Applied Materials, Inc. Bipolar electrostatic chuck to limit DC discharge
CN115764308B (zh) * 2021-09-03 2025-11-14 荣耀终端股份有限公司 一种终端偶极子天线
WO2024048718A1 (ja) 2022-09-02 2024-03-07 株式会社村田製作所 Ｒｆｉｄモジュール
KR20240064104A (ko) * 2022-11-04 2024-05-13 주성엔지니어링(주) 기판 처리 장치
US12074390B2 (en) 2022-11-11 2024-08-27 Tokyo Electron Limited Parallel resonance antenna for radial plasma control
CN116390320A (zh) * 2023-05-30 2023-07-04 安徽农业大学 一种电子回旋共振放电装置及应用
KR20250019240A (ko) * 2023-08-01 2025-02-10 피에스케이 주식회사 기판 처리 장치 및 플라즈마 발생 유닛

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US6514376B1 (en) * 1991-06-27 2003-02-04 Applied Materials Inc. Thermal control apparatus for inductively coupled RF plasma reactor having an overhead solenoidal antenna
US5698036A (en) * 1995-05-26 1997-12-16 Tokyo Electron Limited Plasma processing apparatus
JP3153743B2 (ja) 1995-08-31 2001-04-09 東京エレクトロン株式会社 プラズマ処理装置
US6089182A (en) * 1995-08-17 2000-07-18 Tokyo Electron Limited Plasma processing apparatus
CA2207154A1 (en) 1996-06-10 1997-12-10 Lam Research Corporation Inductively coupled source for deriving substantially uniform plasma flux
US6028395A (en) * 1997-09-16 2000-02-22 Lam Research Corporation Vacuum plasma processor having coil with added conducting segments to its peripheral part
US6028285A (en) * 1997-11-19 2000-02-22 Board Of Regents, The University Of Texas System High density plasma source for semiconductor processing
US6229264B1 (en) * 1999-03-31 2001-05-08 Lam Research Corporation Plasma processor with coil having variable rf coupling
KR100338057B1 (ko) * 1999-08-26 2002-05-24 황 철 주 유도 결합형 플라즈마 발생용 안테나 장치
US6518705B2 (en) * 1999-11-15 2003-02-11 Lam Research Corporation Method and apparatus for producing uniform process rates
US6341574B1 (en) 1999-11-15 2002-01-29 Lam Research Corporation Plasma processing systems
US6320320B1 (en) 1999-11-15 2001-11-20 Lam Research Corporation Method and apparatus for producing uniform process rates
US6302966B1 (en) 1999-11-15 2001-10-16 Lam Research Corporation Temperature control system for plasma processing apparatus
US6322661B1 (en) 1999-11-15 2001-11-27 Lam Research Corporation Method and apparatus for controlling the volume of a plasma
KR100396214B1 (ko) * 2001-06-19 2003-09-02 주성엔지니어링(주) 초단파 병렬 공명 안테나를 구비하는 플라즈마 공정장치
KR100476902B1 (ko) * 2001-07-20 2005-03-17 주식회사 셈테크놀러지 균일 분포 플라즈마를 형성하는 대면적 플라즈마안테나（ｌａｐａ）및 이를 포함하는 플라즈마 발생장치

Also Published As

Publication number Publication date
DE602004032334D1 (de) 2011-06-01
US20030189524A1 (en) 2003-10-09
TWI326940B (en) 2010-07-01
KR20050103504A (ko) 2005-10-31
EP1632006A2 (de) 2006-03-08
US6873112B2 (en) 2005-03-29
JP4869059B2 (ja) 2012-02-01
IL170926A (en) 2012-01-31
JP2006518915A (ja) 2006-08-17
IL170926A0 (en) 2011-08-01
US20040216676A1 (en) 2004-11-04
CN1833296B (zh) 2010-10-20
EP1632006B1 (de) 2011-04-20
WO2004077608A2 (en) 2004-09-10
EP1632006A4 (de) 2008-11-26
KR101094124B1 (ko) 2011-12-15
TW200507338A (en) 2005-02-16
CN1833296A (zh) 2006-09-13
WO2004077608A3 (en) 2006-01-12
US6744213B2 (en) 2004-06-01

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties