ATE506695T1 - Chemisch-mechanisches polierstück mit wellenförmigen rillen - Google Patents

Chemisch-mechanisches polierstück mit wellenförmigen rillen

Info

Publication number: ATE506695T1
Authority: AT; Austria
Prior art keywords: mechanical polishing; shaped grooves; chemical; wavy; polishing piece
Prior art date: 2001-08-16

Application number

AT01965710T

Other languages

English (en)

Inventor

In-Ha Park

Jae-Seok Kim

In-Ju Hwang

Tae-Kyoung Kwon

Original Assignee

Skc Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2001-08-16

Filing date

2001-08-29

Publication date

2011-05-15

2001-08-29 Application filed by Skc Co Ltd filed Critical Skc Co Ltd

2011-05-15 Application granted granted Critical

2011-05-15 Publication of ATE506695T1 publication Critical patent/ATE506695T1/de

Links

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
- H10P52/40—Chemomechanical polishing [CMP]
- H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S451/00—Abrading
- Y10S451/921—Pad for lens shaping tool

Landscapes

Engineering & Computer Science (AREA)
Mechanical Engineering (AREA)
Mechanical Treatment Of Semiconductor (AREA)
Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Sampling And Sample Adjustment (AREA)

AT01965710T 2001-08-16 2001-08-29 Chemisch-mechanisches polierstück mit wellenförmigen rillen ATE506695T1 (de)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
KR1020010049354A KR20030015567A (ko)	2001-08-16	2001-08-16	웨이브 형태의 그루브가 형성된 화학적 기계적 연마패드
PCT/KR2001/001464 WO2003017347A1 (en)	2001-08-16	2001-08-29	Chemical mechanical polishing pad having wave-shaped grooves

Publications (1)

Publication Number	Publication Date
ATE506695T1 true ATE506695T1 (de)	2011-05-15

Family

ID=19713250

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
AT01965710T ATE506695T1 (de)	2001-08-16	2001-08-29	Chemisch-mechanisches polierstück mit wellenförmigen rillen

Country Status (9)

Country	Link
US (1)	US6729950B2 (de)
EP (1)	EP1433197B1 (de)
JP (1)	JP2005500689A (de)
KR (1)	KR20030015567A (de)
CN (1)	CN1284210C (de)
AT (1)	ATE506695T1 (de)
DE (1)	DE60144494D1 (de)
TW (1)	TW504429B (de)
WO (1)	WO2003017347A1 (de)

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US20080220702A1 (en) *	2006-07-03	2008-09-11	Sang Fang Chemical Industry Co., Ltd.	Polishing pad having surface texture
US20080003935A1 (en) *	2006-07-03	2008-01-03	Chung-Chih Feng	Polishing pad having surface texture
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US8002611B2 (en) *	2006-12-27	2011-08-23	Texas Instruments Incorporated	Chemical mechanical polishing pad having improved groove pattern
US20080293343A1 (en) *	2007-05-22	2008-11-27	Yuchun Wang	Pad with shallow cells for electrochemical mechanical processing
US9180570B2 (en) *	2008-03-14	2015-11-10	Nexplanar Corporation	Grooved CMP pad
KR101004256B1 (ko)	2008-03-20	2011-01-03	엠.씨.케이 (주)	연마패드 및 그 제조방법
TWI449597B (zh) *	2008-07-09	2014-08-21	Iv Technologies Co Ltd	研磨墊及其製造方法
TWI535527B (zh) *	2009-07-20	2016-06-01	智勝科技股份有限公司	研磨方法、研磨墊與研磨系統
KR101044281B1 (ko) *	2009-07-30	2011-06-28	서강대학교산학협력단	기공이 형성된 ｃｍｐ 연마패드와 그의 제조방법
JP5635194B2 (ja)	2010-09-15	2014-12-03	エルジー・ケム・リミテッド	Ｃｍｐ用研磨パッド
EP2546105B1 (de)	2011-07-14	2014-05-21	LG Electronics Inc.	Haltevorrichtung für tragbare elektronische Vorrichtung
KR101295921B1 (ko) *	2011-11-07	2013-08-13	주식회사 엘지실트론	연마패드의 표면처리방법 및 이를 이용한 웨이퍼의 연마방법
CN103372812A (zh) *	2013-07-12	2013-10-30	中国科学院上海光学精密机械研究所	大型环抛机抛光胶盘的开槽装置
US9849562B2 (en)	2015-12-28	2017-12-26	Shine-File Llc	And manufacture of an abrasive polishing tool
CN105619202A (zh) *	2016-02-26	2016-06-01	上海华力微电子有限公司	一种化学机械研磨装置及其化学机械研磨方法
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CN110842764A (zh) *	2019-11-18	2020-02-28	张俊杰	一种用于超硬陶瓷球体部件研制的研磨盘装置
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CN113153380B (zh) *	2021-05-18	2022-04-26	中铁第四勘察设计院集团有限公司	一种用于提高盾构隧道中管片接缝防水性能的方法

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2001
- 2001-08-16 KR KR1020010049354A patent/KR20030015567A/ko not_active Ceased
- 2001-08-29 WO PCT/KR2001/001464 patent/WO2003017347A1/en not_active Ceased
- 2001-08-29 US US10/129,386 patent/US6729950B2/en not_active Expired - Lifetime
- 2001-08-29 EP EP01965710A patent/EP1433197B1/de not_active Expired - Lifetime
- 2001-08-29 AT AT01965710T patent/ATE506695T1/de not_active IP Right Cessation
- 2001-08-29 JP JP2003522156A patent/JP2005500689A/ja active Pending
- 2001-08-29 DE DE60144494T patent/DE60144494D1/de not_active Expired - Lifetime
- 2001-08-29 CN CNB018235417A patent/CN1284210C/zh not_active Expired - Lifetime
- 2001-10-15 TW TW090125420A patent/TW504429B/zh not_active IP Right Cessation

Also Published As

Publication number	Publication date
EP1433197B1 (de)	2011-04-20
DE60144494D1 (de)	2011-06-01
US20030034131A1 (en)	2003-02-20
US6729950B2 (en)	2004-05-04
EP1433197A4 (de)	2008-04-09
TW504429B (en)	2002-10-01
EP1433197A1 (de)	2004-06-30
WO2003017347A1 (en)	2003-02-27
JP2005500689A (ja)	2005-01-06
CN1543670A (zh)	2004-11-03
CN1284210C (zh)	2006-11-08
KR20030015567A (ko)	2003-02-25

Legal Events

Date	Code	Title	Description
2011-10-15	RER	Ceased as to paragraph 5 lit. 3 law introducing patent treaties

Publication	Publication Date	Title
ATE506695T1 (de)	2011-05-15	Chemisch-mechanisches polierstück mit wellenförmigen rillen
TW200600260A (en)	2006-01-01	Polishing pad comprising hydrophobic region and endpoint detection port
ATE432145T1 (de)	2009-06-15	Leitender polierkörper zum elektrochemisch- mechanischen polieren
WO2002053322A3 (en)	2003-05-01	System and method for polishing and planarization of semiconductor wafers using reduced surface area polishing pads
IL155856A0 (en)	2003-12-23	Abrasive article having a window system for polishing wafers, and methods
DE60115710D1 (de)	2006-01-12	Artikel mit flixiertem schleifmittel zum verändern einer halbleiterscheibe
TW200510123A (en)	2005-03-16	Polishing pad with oriented pore structure
SG152899A1 (en)	2009-06-29	Chemical mechanical planarization or polishing pad with sections having varied groove patterns
GB2376908A (en)	2002-12-31	A workpiece carrier with adjustable pressure zones and barriers
TW200640612A (en)	2006-12-01	Polishing pad, method of producing the same and method of producing semiconductor device by using the same
ATE409212T1 (de)	2008-10-15	An feststoff gebundener radikalbildender aktivator und verwendung zur verbesserung von formulierungen für das chemisch-mechanische polieren
WO2003083918A1 (en)	2003-10-09	Polishing pad and semiconductor substrate manufacturing method using the polishing pad
ATE317314T1 (de)	2006-02-15	Schleifscheibe mit schleifsegmenten
ATE235347T1 (de)	2003-04-15	Verfahren zur chemisch-mechanischen planarisierung von stopschicht halbleiterscheiben
TW592164U (en)	2004-06-11	Conductive polishing article for electrochemical mechanical polishing
DE60144538D1 (de)	2011-06-09	Chemisches mechanisches polierstück mit mikrolöchern
AU2003296130A8 (en)	2004-07-29	Slurry composition for chemical mechanical polishing, method for planarization of surface of semiconductor element using the same, and method for controlling selection ratio of slurry composition
AU5124901A (en)	2001-10-15	Method for polishing a memory or rigid disk with an amino acid-containing composition
MY135136A (en)	2008-02-29	Undulated pad conditioner and method of using same
TW200531784A (en)	2005-10-01	Chemical mechanical polishing pad
DE50106751D1 (de)	2005-08-25	Schleiflamelle und Schleifteller mit einer Mehrzahl von solchen
MY137105A (en)	2008-12-31	Chemical mechanical polishing pad having wave-shaped grooves
JPH11151662A (ja)	1999-06-08	研磨布
MY137114A (en)	2008-12-31	Chemical mechanical polishing pad having holes and/or grooves
KR200357678Y1 (ko)	2004-08-09	화학적 기계적 폴리싱용 폴리싱 패드