ATE506701T1 - Verfahren für hochqualitative begrenzung für auf einem unterteilten substrat hergestellte halbleiterbauelemente - Google Patents
Verfahren für hochqualitative begrenzung für auf einem unterteilten substrat hergestellte halbleiterbauelementeInfo
- Publication number
- ATE506701T1 ATE506701T1 AT08748460T AT08748460T ATE506701T1 AT E506701 T1 ATE506701 T1 AT E506701T1 AT 08748460 T AT08748460 T AT 08748460T AT 08748460 T AT08748460 T AT 08748460T AT E506701 T1 ATE506701 T1 AT E506701T1
- Authority
- AT
- Austria
- Prior art keywords
- semiconductor devices
- devices produced
- divided substrate
- substrate
- partitioned
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 5
- 239000000758 substrate Substances 0.000 title abstract 4
- 238000010276 construction Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
- 238000003491 array Methods 0.000 abstract 2
- 230000008021 deposition Effects 0.000 abstract 2
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/013—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
- H10H20/0133—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials
- H10H20/01335—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials the light-emitting regions comprising nitride materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/32308—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm
- H01S5/32341—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm blue laser based on GaN or GaP
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/327—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIBVI compounds, e.g. ZnCdSe-laser
Landscapes
- Led Devices (AREA)
- Element Separation (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710104428A CN100580905C (zh) | 2007-04-20 | 2007-04-20 | 获得在分割衬底上制造的半导体器件的高质量边界的方法 |
| US11/776,881 US20080261403A1 (en) | 2007-04-20 | 2007-07-12 | Method for obtaining high-quality boundary for semiconductor devices fabricated on a partitioned substrate |
| PCT/CN2008/000902 WO2008128444A1 (en) | 2007-04-20 | 2008-05-06 | Method for obtaining high-quality boundary for semiconductor devices fabricated on a partitioned substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE506701T1 true ATE506701T1 (de) | 2011-05-15 |
Family
ID=39872642
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT08748460T ATE506701T1 (de) | 2007-04-20 | 2008-05-06 | Verfahren für hochqualitative begrenzung für auf einem unterteilten substrat hergestellte halbleiterbauelemente |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US20080261403A1 (de) |
| EP (1) | EP2140504B1 (de) |
| CN (1) | CN100580905C (de) |
| AT (1) | ATE506701T1 (de) |
| DE (1) | DE602008006376D1 (de) |
| WO (1) | WO2008128444A1 (de) |
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| US8247886B1 (en) | 2009-03-09 | 2012-08-21 | Soraa, Inc. | Polarization direction of optical devices using selected spatial configurations |
| US8634442B1 (en) | 2009-04-13 | 2014-01-21 | Soraa Laser Diode, Inc. | Optical device structure using GaN substrates for laser applications |
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| US8837545B2 (en) | 2009-04-13 | 2014-09-16 | Soraa Laser Diode, Inc. | Optical device structure using GaN substrates and growth structures for laser applications |
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| US8247887B1 (en) | 2009-05-29 | 2012-08-21 | Soraa, Inc. | Method and surface morphology of non-polar gallium nitride containing substrates |
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| KR101640830B1 (ko) * | 2009-08-17 | 2016-07-22 | 삼성전자주식회사 | 기판 구조체 및 그 제조 방법 |
| US8355418B2 (en) | 2009-09-17 | 2013-01-15 | Soraa, Inc. | Growth structures and method for forming laser diodes on {20-21} or off cut gallium and nitrogen containing substrates |
| US8750342B1 (en) | 2011-09-09 | 2014-06-10 | Soraa Laser Diode, Inc. | Laser diodes with scribe structures |
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| US10147850B1 (en) | 2010-02-03 | 2018-12-04 | Soraa, Inc. | System and method for providing color light sources in proximity to predetermined wavelength conversion structures |
| CN101814565A (zh) * | 2010-03-02 | 2010-08-25 | 上海蓝光科技有限公司 | 一种发光二极管芯片的结构及其制造方法 |
| US8451876B1 (en) | 2010-05-17 | 2013-05-28 | Soraa, Inc. | Method and system for providing bidirectional light sources with broad spectrum |
| US9450143B2 (en) | 2010-06-18 | 2016-09-20 | Soraa, Inc. | Gallium and nitrogen containing triangular or diamond-shaped configuration for optical devices |
| US8816319B1 (en) | 2010-11-05 | 2014-08-26 | Soraa Laser Diode, Inc. | Method of strain engineering and related optical device using a gallium and nitrogen containing active region |
| US9048170B2 (en) | 2010-11-09 | 2015-06-02 | Soraa Laser Diode, Inc. | Method of fabricating optical devices using laser treatment |
| US8597967B1 (en) | 2010-11-17 | 2013-12-03 | Soraa, Inc. | Method and system for dicing substrates containing gallium and nitrogen material |
| CN102569543B (zh) * | 2010-12-30 | 2015-09-02 | 比亚迪股份有限公司 | 一种发光二极管芯片的制作方法 |
| US9595813B2 (en) | 2011-01-24 | 2017-03-14 | Soraa Laser Diode, Inc. | Laser package having multiple emitters configured on a substrate member |
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| US20130082274A1 (en) | 2011-09-29 | 2013-04-04 | Bridgelux, Inc. | Light emitting devices having dislocation density maintaining buffer layers |
| US9178114B2 (en) | 2011-09-29 | 2015-11-03 | Manutius Ip, Inc. | P-type doping layers for use with light emitting devices |
| US8664679B2 (en) | 2011-09-29 | 2014-03-04 | Toshiba Techno Center Inc. | Light emitting devices having light coupling layers with recessed electrodes |
| US8853668B2 (en) | 2011-09-29 | 2014-10-07 | Kabushiki Kaisha Toshiba | Light emitting regions for use with light emitting devices |
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| US8698163B2 (en) | 2011-09-29 | 2014-04-15 | Toshiba Techno Center Inc. | P-type doping layers for use with light emitting devices |
| US8971370B1 (en) | 2011-10-13 | 2015-03-03 | Soraa Laser Diode, Inc. | Laser devices using a semipolar plane |
| US8912025B2 (en) | 2011-11-23 | 2014-12-16 | Soraa, Inc. | Method for manufacture of bright GaN LEDs using a selective removal process |
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| US9343871B1 (en) | 2012-04-05 | 2016-05-17 | Soraa Laser Diode, Inc. | Facet on a gallium and nitrogen containing laser diode |
| US9978904B2 (en) | 2012-10-16 | 2018-05-22 | Soraa, Inc. | Indium gallium nitride light emitting devices |
| WO2014084682A1 (ko) * | 2012-11-29 | 2014-06-05 | Kim Sungdong | 모기판으로부터 반도체 박막을 박피하는 방법 및 이를 이용한 반도체 장치의 제조 방법 |
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| CN104576865A (zh) * | 2013-10-25 | 2015-04-29 | 广东德力光电有限公司 | 一种应力释放的GaN基发光二极管结构及制作方法 |
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| US11421843B2 (en) | 2018-12-21 | 2022-08-23 | Kyocera Sld Laser, Inc. | Fiber-delivered laser-induced dynamic light system |
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| US11884202B2 (en) | 2019-01-18 | 2024-01-30 | Kyocera Sld Laser, Inc. | Laser-based fiber-coupled white light system |
| US12152742B2 (en) | 2019-01-18 | 2024-11-26 | Kyocera Sld Laser, Inc. | Laser-based light guide-coupled wide-spectrum light system |
| TWI725688B (zh) * | 2019-12-26 | 2021-04-21 | 新唐科技股份有限公司 | 半導體結構及其製造方法 |
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| DE60212755T2 (de) * | 2001-04-18 | 2006-11-16 | Nippon Telegraph And Telephone Corp. | Optische Halbleitervorrichtung und Herstellungsverfahren |
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| JP2003209280A (ja) * | 2002-01-11 | 2003-07-25 | Hitachi Cable Ltd | 発光ダイオードアレイ |
| US7030032B2 (en) * | 2003-05-13 | 2006-04-18 | Raytheon Company | Photodiode passivation technique |
| JP2006086516A (ja) * | 2004-08-20 | 2006-03-30 | Showa Denko Kk | 半導体発光素子の製造方法 |
| CN1697205A (zh) * | 2005-04-15 | 2005-11-16 | 南昌大学 | 在硅衬底上制备铟镓铝氮薄膜及发光器件的方法 |
| US20080087875A1 (en) * | 2006-10-11 | 2008-04-17 | Feng-Hsu Fan | Protection for the epitaxial structure of metal devices |
-
2007
- 2007-04-20 CN CN200710104428A patent/CN100580905C/zh not_active Expired - Fee Related
- 2007-07-12 US US11/776,881 patent/US20080261403A1/en not_active Abandoned
-
2008
- 2008-05-06 DE DE602008006376T patent/DE602008006376D1/de active Active
- 2008-05-06 EP EP08748460A patent/EP2140504B1/de not_active Not-in-force
- 2008-05-06 WO PCT/CN2008/000902 patent/WO2008128444A1/en not_active Ceased
- 2008-05-06 AT AT08748460T patent/ATE506701T1/de not_active IP Right Cessation
-
2011
- 2011-07-06 US US13/177,412 patent/US8426325B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US20080261403A1 (en) | 2008-10-23 |
| CN101290908A (zh) | 2008-10-22 |
| EP2140504A1 (de) | 2010-01-06 |
| WO2008128444A1 (en) | 2008-10-30 |
| US20110281422A1 (en) | 2011-11-17 |
| EP2140504B1 (de) | 2011-04-20 |
| US8426325B2 (en) | 2013-04-23 |
| DE602008006376D1 (de) | 2011-06-01 |
| CN100580905C (zh) | 2010-01-13 |
| EP2140504A4 (de) | 2010-04-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |