ATE507186T1 - Verfahren zur prüfung der dichtheit eines hermetisch versiegelten mikromechanischen elements und so zu prüfendes element - Google Patents

Verfahren zur prüfung der dichtheit eines hermetisch versiegelten mikromechanischen elements und so zu prüfendes element

Info

Publication number
ATE507186T1
ATE507186T1 AT04797714T AT04797714T ATE507186T1 AT E507186 T1 ATE507186 T1 AT E507186T1 AT 04797714 T AT04797714 T AT 04797714T AT 04797714 T AT04797714 T AT 04797714T AT E507186 T1 ATE507186 T1 AT E507186T1
Authority
AT
Austria
Prior art keywords
tightness
component
tested
testing
cavity
Prior art date
Application number
AT04797714T
Other languages
English (en)
Inventor
Francois Gueissaz
Jean-Paul Randin
Original Assignee
Asulab Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asulab Sa filed Critical Asulab Sa
Application granted granted Critical
Publication of ATE507186T1 publication Critical patent/ATE507186T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C99/00—Subject matter not provided for in other groups of this subclass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M3/00—Investigating fluid-tightness of structures
    • G01M3/40—Investigating fluid-tightness of structures by using electric means, e.g. by observing electric discharges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems ; Auxiliary parts of microstructural devices or systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C99/00—Subject matter not provided for in other groups of this subclass
    • B81C99/0035—Testing
    • B81C99/0045—End test of the packaged device
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M3/00—Investigating fluid-tightness of structures
    • G01M3/02—Investigating fluid-tightness of structures by using fluid or vacuum
    • G01M3/04—Investigating fluid-tightness of structures by using fluid or vacuum by detecting the presence of fluid at the leakage point
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M3/00—Investigating fluid-tightness of structures
    • G01M3/02—Investigating fluid-tightness of structures by using fluid or vacuum
    • G01M3/04—Investigating fluid-tightness of structures by using fluid or vacuum by detecting the presence of fluid at the leakage point
    • G01M3/042—Investigating fluid-tightness of structures by using fluid or vacuum by detecting the presence of fluid at the leakage point by using materials which expand, contract, disintegrate, or decompose in contact with a fluid
    • G01M3/045—Investigating fluid-tightness of structures by using fluid or vacuum by detecting the presence of fluid at the leakage point by using materials which expand, contract, disintegrate, or decompose in contact with a fluid with electrical detection means
    • G01M3/047—Investigating fluid-tightness of structures by using fluid or vacuum by detecting the presence of fluid at the leakage point by using materials which expand, contract, disintegrate, or decompose in contact with a fluid with electrical detection means with photo-electrical detection means, e.g. using optical fibres
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M3/00—Investigating fluid-tightness of structures
    • G01M3/38—Investigating fluid-tightness of structures by using light

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Micromachines (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Examining Or Testing Airtightness (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
AT04797714T 2003-11-21 2004-11-08 Verfahren zur prüfung der dichtheit eines hermetisch versiegelten mikromechanischen elements und so zu prüfendes element ATE507186T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP03026780A EP1533270A1 (de) 2003-11-21 2003-11-21 Verfahren und Vorrichtung zur Dichtheitsprüfung einer hermetisch versiegelten MEMS Packung
PCT/EP2004/012626 WO2005049482A1 (fr) 2003-11-21 2004-11-08 Procede de controle de l'hermeticite d'une cavite close d'un composant micrometrique, et composant micrometrique pour sa mise en oeuvre

Publications (1)

Publication Number Publication Date
ATE507186T1 true ATE507186T1 (de) 2011-05-15

Family

ID=34429415

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04797714T ATE507186T1 (de) 2003-11-21 2004-11-08 Verfahren zur prüfung der dichtheit eines hermetisch versiegelten mikromechanischen elements und so zu prüfendes element

Country Status (10)

Country Link
US (3) US7601537B2 (de)
EP (2) EP1533270A1 (de)
JP (2) JP4664306B2 (de)
KR (1) KR101070979B1 (de)
CN (1) CN1894156B (de)
AT (1) ATE507186T1 (de)
CA (1) CA2546810A1 (de)
DE (1) DE602004032461D1 (de)
TW (1) TWI359264B (de)
WO (1) WO2005049482A1 (de)

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DE112005001580A5 (de) * 2004-04-15 2007-05-24 Nanofocus Ag Verfahren zur optischen Detektion von Lecks in gasdichten Gehäusen von insbesondere mikro-elektromechanischen Systemen (MEMS)
DE102007040864A1 (de) * 2007-08-29 2009-01-02 Tyco Electronics Amp Gmbh Verfahren und Vorrichtung zum Test einer elektrischen Verbindungsvorrichtung hinsichtlich Dichtigkeit
US8634918B2 (en) * 2008-10-09 2014-01-21 Cochlear Limited Medical implant with safety feature
US8267486B2 (en) * 2008-12-23 2012-09-18 Analog Devices, Inc. Apparatus and method of detecting microchip hermeticity
US8581679B2 (en) * 2010-02-26 2013-11-12 Stmicroelectronics Asia Pacific Pte. Ltd. Switch with increased magnetic sensitivity
US8904867B2 (en) * 2010-11-04 2014-12-09 Qualcomm Mems Technologies, Inc. Display-integrated optical accelerometer
FR2969287B1 (fr) * 2010-12-17 2013-10-25 Alcatel Lucent Dispositif de detection de fuite utilisant l'hydrogene comme gaz traceur
RU2538420C2 (ru) * 2012-09-25 2015-01-10 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Национальный исследовательский университет "МИЭТ" (МИЭТ) Устройство контроля герметичности микроструктур
DE102013020388A1 (de) * 2012-12-13 2014-06-18 Tesat-Spacecom Gmbh & Co. Kg Verfahren zur Dichteprüfung eines Gehäuses
US9442131B2 (en) * 2013-03-13 2016-09-13 Analog Devices, Inc. System and method for run-time hermeticity detection of a capped MEMS device
US8921128B2 (en) * 2013-05-29 2014-12-30 Analog Devices, Inc. Method of manufacturing MEMS devices with reliable hermetic seal
GB2518185A (en) * 2013-09-12 2015-03-18 Ibm Electromechanical switching device wtih 2D layered material surfaces
CN106546387B (zh) * 2016-10-28 2019-10-25 中国科学院微电子研究所 一种晶圆级传感器气密性检测装置及方法
EP3385692A1 (de) * 2017-04-03 2018-10-10 Indigo Diabetes N.V. Luftdichtheitsprüfung einer optischen anordnung
CN106840538B (zh) * 2017-04-11 2019-03-01 东华大学 一种利用压力敏感型物质检测真空袋膜漏气点的方法
CN111247409B (zh) * 2017-10-10 2022-05-10 三菱电机株式会社 半导体装置的试验方法及半导体装置的制造方法
JP6381848B1 (ja) * 2018-06-06 2018-08-29 三菱電機株式会社 半導体装置の試験方法、および半導体装置の製造方法
WO2020031628A1 (ja) * 2018-08-10 2020-02-13 株式会社フジキン 流体制御機器、流体制御機器の異常検知方法、異常検知装置、及び異常検知システム
DE102018222749A1 (de) * 2018-12-21 2020-06-25 Robert Bosch Gmbh Verfahren zum Verschließen von Zugängen in einem MEMS-Element
CN109612642B (zh) * 2019-01-30 2020-10-30 江苏苏盐阀门机械有限公司 一种球阀密封性测试设备
ES2945799T3 (es) * 2019-03-06 2023-07-07 Linde Gmbh Contenedor de transporte y procedimiento
RU2756151C1 (ru) * 2020-12-28 2021-09-28 Акционерное общество "ОКБ-Планета" АО "ОКБ-Планета" Герметичный корпус для изделий электронной техники
CN113919150B (zh) * 2021-09-30 2025-02-11 电子科技大学 一种微纳传感器封装气密性失效时间的预测方法
CN114813628B (zh) * 2022-04-25 2025-03-18 四川启睿克科技有限公司 一种基于近红外光谱的酒曲质量调控方法
CN115060426A (zh) * 2022-08-16 2022-09-16 江苏东海半导体股份有限公司 一种igbt的密封性检测装置及检测方法
CN117429848B (zh) * 2023-12-18 2024-03-08 建诺为生物技术(江苏)有限公司 一种细胞培养瓶生产输送装置
EP4707958A1 (de) * 2024-09-04 2026-03-11 Association Suisse pour la Recherche Horlogère Verfahren zur charakterisierung von physikalischen schnittstellen einer verschachtelten vorrichtung

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US3479862A (en) * 1967-03-24 1969-11-25 Westinghouse Electric Corp Hermeticity test for packaged electrical components
US4224565A (en) * 1978-06-05 1980-09-23 Bell Telephone Laboratories, Incorporated Moisture level determination in sealed packages
US4282744A (en) * 1979-11-02 1981-08-11 Western Electric Co., Inc. Leak testing hermetically sealed electronic articles
US4920785A (en) * 1984-06-21 1990-05-01 Web Technology, Inc. Hermeticity testing method and system
DE3447396A1 (de) * 1984-12-24 1986-07-03 Robert Bosch Gmbh, 7000 Stuttgart Elektrischer druckgeber
US5082366A (en) * 1990-08-30 1992-01-21 Laser Technology, Inc. Apparatus and method for detecting leaks in packages
US5428988A (en) * 1993-12-13 1995-07-04 Trw Vehicle Safety Systems Inc. Leak detector for gas air bag inflator
US6969635B2 (en) * 2000-12-07 2005-11-29 Reflectivity, Inc. Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
CH691559A5 (fr) 1997-04-21 2001-08-15 Asulab Sa Micro-contacteur magnétique et son procédé de fabrication.
EP0874379B1 (de) * 1997-04-23 2002-07-31 Asulab S.A. Magnetischer Mikroschalter und Herstellungsverfahren
JPH11108790A (ja) * 1997-09-30 1999-04-23 Mitsumi Electric Co Ltd 圧電振動子モジュールのリーク検出方法
US6074891A (en) * 1998-06-16 2000-06-13 Delphi Technologies, Inc. Process for verifying a hermetic seal and semiconductor device therefor
US6223586B1 (en) * 1998-12-23 2001-05-01 Visteon Global Technologies, Inc. Micro-electromechanical device inspection
US20020096421A1 (en) * 2000-11-29 2002-07-25 Cohn Michael B. MEMS device with integral packaging
US6696296B2 (en) * 2001-03-05 2004-02-24 Oplink Communications, Inc. Leak detector for sealed optical devices
US7186381B2 (en) * 2001-07-20 2007-03-06 Regents Of The University Of California Hydrogen gas sensor
JP2003139645A (ja) * 2001-10-31 2003-05-14 Shimadzu Corp リークテスト用前処理装置
EP1310380A1 (de) * 2001-11-07 2003-05-14 SensoNor asa Eine mikro-mechanische Vorrichtung und Verfahren zu seiner Herstellung
JP2003304134A (ja) * 2002-04-10 2003-10-24 Toshiba Corp 弾性表面波装置及びその検査方法
US6763702B2 (en) * 2002-12-19 2004-07-20 Agilent Technologies, Inc. Method and apparatus for hermeticity determination and leak detection in semiconductor packaging
US20050079620A1 (en) * 2003-10-10 2005-04-14 Eberhard Douglas P. Leak testing of hermetic enclosures for implantable energy storage devices

Also Published As

Publication number Publication date
CA2546810A1 (fr) 2005-06-02
US20070196923A1 (en) 2007-08-23
US20100024525A1 (en) 2010-02-04
JP2011089997A (ja) 2011-05-06
DE602004032461D1 (de) 2011-06-09
JP4664306B2 (ja) 2011-04-06
EP1687237A1 (de) 2006-08-09
TWI359264B (en) 2012-03-01
KR20060100438A (ko) 2006-09-20
US7892839B2 (en) 2011-02-22
CN1894156A (zh) 2007-01-10
EP1687237B1 (de) 2011-04-27
TW200519366A (en) 2005-06-16
US7601537B2 (en) 2009-10-13
EP1533270A1 (de) 2005-05-25
US7833484B2 (en) 2010-11-16
CN1894156B (zh) 2011-06-08
WO2005049482A1 (fr) 2005-06-02
JP5421224B2 (ja) 2014-02-19
KR101070979B1 (ko) 2011-10-06
US20100064779A1 (en) 2010-03-18
JP2007511379A (ja) 2007-05-10

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