ATE507582T1 - Eine substrattransfervorrichtung - Google Patents

Eine substrattransfervorrichtung

Info

Publication number
ATE507582T1
ATE507582T1 AT06251194T AT06251194T ATE507582T1 AT E507582 T1 ATE507582 T1 AT E507582T1 AT 06251194 T AT06251194 T AT 06251194T AT 06251194 T AT06251194 T AT 06251194T AT E507582 T1 ATE507582 T1 AT E507582T1
Authority
AT
Austria
Prior art keywords
transfer device
substrate transfer
system unit
substrate
transfer system
Prior art date
Application number
AT06251194T
Other languages
English (en)
Inventor
Yasuhiko Hashimoto
Original Assignee
Kawasaki Heavy Ind Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kawasaki Heavy Ind Ltd filed Critical Kawasaki Heavy Ind Ltd
Application granted granted Critical
Publication of ATE507582T1 publication Critical patent/ATE507582T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3408—Docking arrangements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Automatic Assembly (AREA)
  • Supply And Installment Of Electrical Components (AREA)
AT06251194T 2005-03-07 2006-03-07 Eine substrattransfervorrichtung ATE507582T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005062827A JP4579723B2 (ja) 2005-03-07 2005-03-07 搬送系ユニットおよび分割体

Publications (1)

Publication Number Publication Date
ATE507582T1 true ATE507582T1 (de) 2011-05-15

Family

ID=36601168

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06251194T ATE507582T1 (de) 2005-03-07 2006-03-07 Eine substrattransfervorrichtung

Country Status (6)

Country Link
US (2) US20060245850A1 (de)
EP (1) EP1701378B1 (de)
JP (1) JP4579723B2 (de)
KR (1) KR100815640B1 (de)
AT (1) ATE507582T1 (de)
DE (1) DE602006021499D1 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4606388B2 (ja) 2006-06-12 2011-01-05 川崎重工業株式会社 基板移載装置の搬送系ユニット
JP4098338B2 (ja) 2006-07-20 2008-06-11 川崎重工業株式会社 ウェハ移載装置および基板移載装置
KR100929817B1 (ko) 2007-10-23 2009-12-07 세메스 주식회사 기판 처리 장치 및 기판 처리 장치의 제조 방법
WO2009066573A1 (ja) * 2007-11-21 2009-05-28 Kabushiki Kaisha Yaskawa Denki 搬送ロボット、それを備えた局所クリーン化された筐体、及びそれを備えた半導体製造装置
USD652395S1 (en) * 2010-06-01 2012-01-17 Hitachi Kokusai Electric Inc. Semiconductor manufacturing equipment
TWD143036S1 (zh) * 2010-06-01 2011-10-01 日立國際電氣股份有限公司 半導體製造機
JP2011161629A (ja) * 2011-06-03 2011-08-25 Kawasaki Heavy Ind Ltd 基板搬送ロボット
JP2012035408A (ja) * 2011-11-09 2012-02-23 Kawasaki Heavy Ind Ltd 基板搬送ロボット
JP5880573B2 (ja) * 2011-11-28 2016-03-09 株式会社安川電機 基板処理装置
US9293355B2 (en) 2012-11-09 2016-03-22 Kabushiki Kaisha Yaskawa Denki Substrate transfer system and substrate processing system
IT201700077497A1 (it) * 2017-07-10 2017-10-10 Acs Dobfar Spa Unita' mobile di manipolazione
US11456197B2 (en) * 2019-12-17 2022-09-27 Applied Materials, Inc. Systems and methods for providing maintenance access to electronic device manufacturing tools
US12159802B2 (en) * 2021-03-04 2024-12-03 Applied Materials, Inc. Shortened load port for factory interface
KR102925796B1 (ko) * 2022-02-07 2026-02-09 삼성전자 주식회사 충전 기능을 포함하는 기판 이송 시스템
EP4383320A1 (de) 2022-12-09 2024-06-12 Siltronic AG Verfahren und vorrichtung zum sortieren und ausrichten von halbleiterscheiben
KR102638655B1 (ko) * 2023-08-07 2024-02-20 에이피티씨 주식회사 멀티 층 efem을 포함하는 기판 이송 장치

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US2581816A (en) * 1948-08-17 1952-01-08 Simmons Fastener Corp Fastener for butt joints
JPH081923B2 (ja) * 1991-06-24 1996-01-10 ティーディーケイ株式会社 クリーン搬送方法及び装置
US5244710A (en) * 1992-05-22 1993-09-14 Lydon-Bricher Manufacturing Company Table pad swing lock
DE4425208C2 (de) * 1994-07-16 1996-05-09 Jenoptik Technologie Gmbh Einrichtung zur Kopplung von Be- und Entladegeräten mit Halbleiterbearbeitungsmaschinen
US5984610A (en) * 1995-03-07 1999-11-16 Fortrend Engineering Corporation Pod loader interface
US5783834A (en) * 1997-02-20 1998-07-21 Modular Process Technology Method and process for automatic training of precise spatial locations to a robot
US6138721A (en) * 1997-09-03 2000-10-31 Asyst Technologies, Inc. Tilt and go load port interface alignment system
US6883770B1 (en) * 1999-05-18 2005-04-26 Tdk Corporation Load port mounting mechanism
JP4049949B2 (ja) * 1999-07-14 2008-02-20 東京エレクトロン株式会社 着脱式ロードポート装置
US6520727B1 (en) * 2000-04-12 2003-02-18 Asyt Technologies, Inc. Modular sorter
JP3581310B2 (ja) * 2000-08-31 2004-10-27 Ｔｄｋ株式会社 防塵機能を備えた半導体ウェーハ処理装置
JP2005520321A (ja) * 2001-07-16 2005-07-07 アシスト テクノロジーズ インコーポレイテッド ツールのフロントエンド加工物処理のための統合システム
JP3880343B2 (ja) 2001-08-01 2007-02-14 株式会社ルネサステクノロジ ロードポート、基板処理装置および雰囲気置換方法
US7100340B2 (en) * 2001-08-31 2006-09-05 Asyst Technologies, Inc. Unified frame for semiconductor material handling system
JP2003243481A (ja) * 2002-02-21 2003-08-29 Asm Japan Kk 半導体製造装置及びメンテナンス方法
WO2004059699A2 (en) * 2002-12-20 2004-07-15 Brooks Automation, Inc. System and method for on-the-fly eccentricity recognition
GB2417090A (en) 2003-04-28 2006-02-15 Stephen James Crampton CMM arm with exoskeleton
JP2005081445A (ja) * 2003-09-04 2005-03-31 Fanuc Ltd ロボットの干渉領域確認装置
US7607879B2 (en) * 2004-06-15 2009-10-27 Brooks Automation, Inc. Substrate processing apparatus with removable component module

Also Published As

Publication number Publication date
EP1701378B1 (de) 2011-04-27
KR20060096918A (ko) 2006-09-13
DE602006021499D1 (de) 2011-06-09
US20110123300A1 (en) 2011-05-26
EP1701378A2 (de) 2006-09-13
EP1701378A3 (de) 2006-11-08
JP4579723B2 (ja) 2010-11-10
JP2006245508A (ja) 2006-09-14
US8210789B2 (en) 2012-07-03
US20060245850A1 (en) 2006-11-02
KR100815640B1 (ko) 2008-03-20

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Legal Events

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