ATE508481T1 - Wärmeableitunseinrichtung und led beleuchtungs- und/oder signalvorrichtung mit einer solchen einrichtung - Google Patents

Wärmeableitunseinrichtung und led beleuchtungs- und/oder signalvorrichtung mit einer solchen einrichtung

Info

Publication number
ATE508481T1
ATE508481T1 AT07290621T AT07290621T ATE508481T1 AT E508481 T1 ATE508481 T1 AT E508481T1 AT 07290621 T AT07290621 T AT 07290621T AT 07290621 T AT07290621 T AT 07290621T AT E508481 T1 ATE508481 T1 AT E508481T1
Authority
AT
Austria
Prior art keywords
heatsink
heat dissipation
led
led lighting
signaling
Prior art date
Application number
AT07290621T
Other languages
English (en)
Inventor
Jean-Claude Gasquet
Alcina Tanghe
Original Assignee
Valeo Vision
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valeo Vision filed Critical Valeo Vision
Application granted granted Critical
Publication of ATE508481T1 publication Critical patent/ATE508481T1/de

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/16—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
    • F21S43/13—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
    • F21S43/14—Light emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/10—Light sources with three-dimensionally disposed light-generating elements on concave supports or substrates, e.g. on the inner side of bowl-shaped supports
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/50—Light sources with three-dimensionally disposed light-generating elements on planar substrates or supports, but arranged in different planes or with differing orientation, e.g. on plate-shaped supports with steps on which light-generating elements are mounted
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0382—Continuously deformed conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09054—Raised area or protrusion of metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)
  • Circuit Arrangement For Electric Light Sources In General (AREA)
  • Led Devices (AREA)
  • Thermotherapy And Cooling Therapy Devices (AREA)
AT07290621T 2006-05-22 2007-05-15 Wärmeableitunseinrichtung und led beleuchtungs- und/oder signalvorrichtung mit einer solchen einrichtung ATE508481T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0604575A FR2901347B1 (fr) 2006-05-22 2006-05-22 Composant de dissipation thermique et dispositif d'eclairage et/ou de signalisation a diode equipe d'un tel composant

Publications (1)

Publication Number Publication Date
ATE508481T1 true ATE508481T1 (de) 2011-05-15

Family

ID=36759036

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07290621T ATE508481T1 (de) 2006-05-22 2007-05-15 Wärmeableitunseinrichtung und led beleuchtungs- und/oder signalvorrichtung mit einer solchen einrichtung

Country Status (7)

Country Link
US (1) US7780315B2 (de)
EP (1) EP1860707B1 (de)
JP (1) JP2007318139A (de)
CN (1) CN101105286A (de)
AT (1) ATE508481T1 (de)
DE (1) DE602007014288D1 (de)
FR (1) FR2901347B1 (de)

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7806574B2 (en) * 2006-04-16 2010-10-05 Albeo Technologies, Inc. Thermal management of LED-based lighting systems
US8425085B2 (en) * 2006-04-16 2013-04-23 Albeo Technologies, Inc. Thermal management of LED-based lighting systems
FR2914984B1 (fr) * 2007-04-13 2013-11-08 Valeo Vision Support electronique flexible equipe, supportant au moins une diode electroluminescente, et procede de fabrication associe.
CN101162816B (zh) * 2007-09-13 2010-09-01 番禺得意精密电子工业有限公司 电连接装置
CN101400210B (zh) * 2007-09-27 2010-06-02 北京京东方光电科技有限公司 设有发光二极管的印刷电路板
JP2011505702A (ja) * 2007-12-07 2011-02-24 オスラム ゲゼルシャフト ミット ベシュレンクテル ハフツング ヒートシンク、およびヒートシンクを含む点灯装置
KR101253821B1 (ko) * 2007-12-07 2013-04-12 오스람 게엠베하 히트싱크와 히트싱크를 포함하는 조명장치
DE102008016458A1 (de) * 2008-03-31 2009-10-01 Osram Gesellschaft mit beschränkter Haftung Leiterplatte
US20100027281A1 (en) * 2008-07-31 2010-02-04 Waters Stanley E LED Anti-Collision Light for Commercial Aircraft
US8981629B2 (en) 2008-08-26 2015-03-17 Albeo Technologies, Inc. Methods of integrating LED chips with heat sinks, and LED-based lighting assemblies made thereby
US9076951B2 (en) 2008-08-26 2015-07-07 Albeo Technologies, Inc. Methods of integrating LED chips with heat sinks, and LED-based lighting assemblies made thereby
US8058659B2 (en) 2008-08-26 2011-11-15 Albeo Technologies, Inc. LED chip-based lighting products and methods of building
CN101739898A (zh) * 2008-11-05 2010-06-16 富士迈半导体精密工业（上海）有限公司 显示看板
US20100226139A1 (en) 2008-12-05 2010-09-09 Permlight Products, Inc. Led-based light engine
US8337030B2 (en) * 2009-05-13 2012-12-25 Cree, Inc. Solid state lighting devices having remote luminescent material-containing element, and lighting methods
JP5442317B2 (ja) * 2009-05-14 2014-03-12 株式会社小糸製作所 車両用灯具
US20100321893A1 (en) * 2009-06-20 2010-12-23 Peter Scott Andrews Heat Dissipation Packaging for Electrical Components
US20110249406A1 (en) * 2009-06-20 2011-10-13 LEDAdventures LLC Heat dissipation system for electrical components
KR100963083B1 (ko) * 2009-08-27 2010-06-10 윤인숙 엘이디 형광등
KR20110039080A (ko) * 2009-10-09 2011-04-15 알티반도체 주식회사 백라이트 유닛 및 그 제조 방법
TW201123410A (en) * 2009-12-25 2011-07-01 Bright Led Electronics Corp LED light-emitting module and its manufacturing method thereof.
JP5381729B2 (ja) * 2010-01-12 2014-01-08 セイコーエプソン株式会社 電気光学装置
US20110267821A1 (en) * 2010-02-12 2011-11-03 Cree, Inc. Lighting device with heat dissipation elements
CN105282892A (zh) * 2010-05-04 2016-01-27 吉可多公司 具有用于发送关联信息的通信端口的led照明装置
US8391009B2 (en) * 2010-06-18 2013-03-05 Sunonwealth Electric Machine Industry Co., Ltd. Heat dissipating assembly
DE102011076765A1 (de) * 2011-05-31 2012-12-06 Osram Ag Beleuchtungseinrichtung
KR101847042B1 (ko) 2011-08-11 2018-04-09 엘지이노텍 주식회사 조명 장치
KR101911762B1 (ko) 2011-08-09 2018-10-26 엘지이노텍 주식회사 조명 장치
TWI435026B (zh) * 2011-11-07 2014-04-21 訊凱國際股份有限公司 發光裝置及其燈具之製作方法
US10591124B2 (en) 2012-08-30 2020-03-17 Sabic Global Technologies B.V. Heat dissipating system for a light, headlamp assembly comprising the same, and method of dissipating heat
US8926133B2 (en) 2012-09-13 2015-01-06 Lumastream, Inc. System, method, and apparatus for dissipating heat from a LED
CN102997098A (zh) * 2012-11-27 2013-03-27 南通贝思特科技咨询有限公司 球面或四侧发光的led灯
KR102024291B1 (ko) 2012-12-18 2019-09-23 엘지이노텍 주식회사 램프 유닛 및 그를 이용한 차량 램프 장치
AT514403B1 (de) * 2013-05-29 2015-06-15 Zizala Lichtsysteme Gmbh Beleuchtungsvorrichtung für einen Fahrzeugscheinwerfer sowie Fahrzeugscheinwerfer
DE102014103379A1 (de) * 2014-03-13 2015-09-17 Hella Kgaa Hueck & Co. Lichtmodul mit einer verbesserten Positionierung einer optischen Einheit zu einem Leuchtmittel
FR3022975B1 (fr) * 2014-06-30 2020-06-19 Valeo Vision Module d'eclairage pour projecteur automobile avec positionnement entre plieuse et radiateur
FR3022976B1 (fr) * 2014-06-30 2018-08-31 Valeo Vision Module d'eclairage pour projecteur automobile avec positionnement entre reflecteur et source lumineuse
CN107076387B (zh) 2014-11-20 2021-05-18 亮锐控股有限公司 具有单独可寻址的led模块的led设备
KR102423383B1 (ko) 2014-12-29 2022-07-22 엘지이노텍 주식회사 조명 장치
FR3046656B1 (fr) * 2016-01-11 2019-11-29 Valeo Iluminacion Module lumineux pour vehicule automobile comprenant deux types de sources lumineuses
DE102016101999A1 (de) * 2016-02-04 2017-08-10 Automotive Lighting Reutlingen Gmbh Lichtmodul für eine Kraftfahrzeugbeleuchtungseinrichtung
JP6695165B2 (ja) 2016-02-23 2020-05-20 株式会社小糸製作所 車両用灯具ユニット
CZ307188B6 (cs) 2016-08-30 2018-03-07 Varroc Lighting Systems, s.r.o. Chladič, zejména pro signalizační nebo osvětlovací zařízení motorových vozidel, a způsob jeho výroby
WO2020151813A1 (en) 2019-01-23 2020-07-30 HELLA GmbH & Co. KGaA Illumination device for a vehicle with positioning means
US10697625B1 (en) * 2019-10-27 2020-06-30 Richard Redpath Illumination apparatus having thermally isolated heat sinks and dual light sources
FR3113629B1 (fr) * 2020-09-01 2022-08-26 Valeo Vision Module d'éclairage pour un véhicule automobile
CN114415449B (zh) * 2022-01-24 2024-05-24 深圳颂威科技有限公司 灯板和聚光灯
FR3137439B1 (fr) * 2022-06-30 2024-10-18 Valeo Vision Dispositif de signalisation de véhicule automobile
CA3184321C (en) * 2022-12-16 2024-01-23 Sws Warning Lights Inc. Light system using flexible printed circuit boards

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5357536A (en) * 1993-05-07 1994-10-18 Xerox Corporation Method and apparatus for the positioning of laser diodes
JP3347279B2 (ja) * 1997-12-19 2002-11-20 三菱電機株式会社 半導体装置およびその製造方法
US6208517B1 (en) * 1999-09-10 2001-03-27 Legerity, Inc. Heat sink
US6428189B1 (en) * 2000-03-31 2002-08-06 Relume Corporation L.E.D. thermal management
ITMI20012579A1 (it) * 2001-12-06 2003-06-06 Fraen Corp Srl Modulo illuminante ad elevata dissipazione di calore
JP2003198071A (ja) * 2001-12-21 2003-07-11 Sanritsu Shoji Kk 放熱板付きプリント配線板およびその製造方法
US7170151B2 (en) * 2003-01-16 2007-01-30 Philips Lumileds Lighting Company, Llc Accurate alignment of an LED assembly
FR2853200B1 (fr) 2003-03-27 2005-10-07 Valeo Vision Procede de fixation d'une diode electroluminescente de puissance sur un radiateur, et dispositif de signalisation comportant une telle diode.
JP4102240B2 (ja) * 2003-04-08 2008-06-18 株式会社小糸製作所 車両用前照灯
EP1627437B1 (de) * 2003-05-26 2016-03-30 Panasonic Intellectual Property Management Co., Ltd. Licht emittierendes bauelement
EP1642346A1 (de) * 2003-06-30 2006-04-05 Koninklijke Philips Electronics N.V. Wärme regulierendes system für leuchtdioden
WO2005025932A2 (en) * 2003-09-08 2005-03-24 Schefenacker Vision Systems Usa Inc. Apparatus and method for mounting and adjusting led headlamps
US7198387B1 (en) * 2003-12-18 2007-04-03 B/E Aerospace, Inc. Light fixture for an LED-based aircraft lighting system
US7321161B2 (en) * 2003-12-19 2008-01-22 Philips Lumileds Lighting Company, Llc LED package assembly with datum reference feature
JP4433875B2 (ja) * 2004-05-14 2010-03-17 オムロン株式会社 発熱部品の放熱構造と、この放熱構造における放熱部材の製造方法
JP2006127963A (ja) * 2004-10-29 2006-05-18 Hitachi Ltd 配光制御デバイス
DE102005002812B4 (de) * 2005-01-20 2013-07-18 Infineon Technologies Ag Kühlkörper für oberflächenmontierte Halbleiterbauteile und Montageverfahren
TWI256454B (en) * 2005-06-03 2006-06-11 Au Optronics Corp Light module
US7404655B2 (en) * 2006-05-10 2008-07-29 Gentex Corporation Vehicle rearview assembly including a map light

Also Published As

Publication number Publication date
FR2901347A1 (fr) 2007-11-23
EP1860707A1 (de) 2007-11-28
CN101105286A (zh) 2008-01-16
FR2901347B1 (fr) 2008-07-18
US7780315B2 (en) 2010-08-24
DE602007014288D1 (de) 2011-06-16
EP1860707B1 (de) 2011-05-04
US20070268703A1 (en) 2007-11-22
JP2007318139A (ja) 2007-12-06

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