ATE509133T1 - Rohrförmiges sputtertarget mit verbesserter steifigkeit - Google Patents

Rohrförmiges sputtertarget mit verbesserter steifigkeit

Info

Publication number
ATE509133T1
ATE509133T1 AT07101310T AT07101310T ATE509133T1 AT E509133 T1 ATE509133 T1 AT E509133T1 AT 07101310 T AT07101310 T AT 07101310T AT 07101310 T AT07101310 T AT 07101310T AT E509133 T1 ATE509133 T1 AT E509133T1
Authority
AT
Austria
Prior art keywords
target
openings
coolant
supporting structure
improved stiffness
Prior art date
Application number
AT07101310T
Other languages
English (en)
Inventor
Bosscher Wilmert De
De Putte Ivan Van
Original Assignee
Bekaert Advanced Coatings Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bekaert Advanced Coatings Nv filed Critical Bekaert Advanced Coatings Nv
Application granted granted Critical
Publication of ATE509133T1 publication Critical patent/ATE509133T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/342—Hollow targets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3497—Temperature of target

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)
AT07101310T 2006-01-31 2007-01-29 Rohrförmiges sputtertarget mit verbesserter steifigkeit ATE509133T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP06101089 2006-01-31

Publications (1)

Publication Number Publication Date
ATE509133T1 true ATE509133T1 (de) 2011-05-15

Family

ID=36384377

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07101310T ATE509133T1 (de) 2006-01-31 2007-01-29 Rohrförmiges sputtertarget mit verbesserter steifigkeit

Country Status (4)

Country Link
EP (1) EP1813695B8 (de)
AT (1) ATE509133T1 (de)
ES (1) ES2366547T3 (de)
PL (1) PL1813695T3 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009100985A1 (en) * 2008-02-15 2009-08-20 Bekaert Advanced Coatings Nv Multiple grooved vacuum coupling
EP2365515A1 (de) * 2010-03-09 2011-09-14 Applied Materials, Inc. Drehbares Target, Stützrohr, Sputter-Installation und Verfahren zur Herstellung eines drehbaren Targets
US9334563B2 (en) 2010-07-12 2016-05-10 Materion Corporation Direct cooled rotary sputtering target
JP5576562B2 (ja) 2010-07-12 2014-08-20 マテリオン アドバンスト マテリアルズ テクノロジーズ アンド サービシーズ インコーポレイティド 回転式ターゲット裏当て管結合用組立
US20130140173A1 (en) * 2011-06-10 2013-06-06 Séverin Stéphane Gérard Tierce Rotary sputter target assembly
KR101988391B1 (ko) 2011-06-27 2019-06-12 솔레라스 리미티드 스퍼터링 타겟
DE102012204425A1 (de) * 2012-03-20 2013-09-26 Von Ardenne Anlagentechnik Gmbh Sputterverfahren und Sputtervorrichtung
WO2014022288A1 (en) * 2012-08-01 2014-02-06 Materion Advanced Materials Technologies And Services Inc. Direct cooled rotary sputtering target
DE102015104307B4 (de) * 2015-03-23 2018-11-08 Solayer Gmbh Sputtervorrichtung zur Beschichtung eines Substrats
CZ306541B6 (cs) * 2015-11-27 2017-03-01 Shm, S. R. O. Cylindrická katoda pro nanášení vrstev metodou PVD
WO2020250587A1 (ja) * 2019-06-10 2020-12-17 株式会社アルバック スパッタリングターゲット及びスパッタリングターゲットの製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6488824B1 (en) * 1998-11-06 2002-12-03 Raycom Technologies, Inc. Sputtering apparatus and process for high rate coatings
DE10102493B4 (de) * 2001-01-19 2007-07-12 W.C. Heraeus Gmbh Rohrförmiges Target und Verfahren zur Herstellung eines solchen Targets

Also Published As

Publication number Publication date
EP1813695B8 (de) 2011-09-28
PL1813695T3 (pl) 2013-04-30
ES2366547T3 (es) 2011-10-21
EP1813695A1 (de) 2007-08-01
EP1813695B1 (de) 2011-05-11

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Legal Events

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