ATE509144T1 - Bausatz zur herstellung eines prozessreaktors für die ausbildung metallischer schichten auf einem oder auf mehreren substraten - Google Patents

Bausatz zur herstellung eines prozessreaktors für die ausbildung metallischer schichten auf einem oder auf mehreren substraten

Info

Publication number
ATE509144T1
ATE509144T1 AT06027073T AT06027073T ATE509144T1 AT E509144 T1 ATE509144 T1 AT E509144T1 AT 06027073 T AT06027073 T AT 06027073T AT 06027073 T AT06027073 T AT 06027073T AT E509144 T1 ATE509144 T1 AT E509144T1
Authority
AT
Austria
Prior art keywords
kit
reactor
formation
producing
metallic layers
Prior art date
Application number
AT06027073T
Other languages
English (en)
Inventor
Dirk Habermann
Ernst Hartmannsgruber
Patrik Mueller
Original Assignee
Rena Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rena Gmbh filed Critical Rena Gmbh
Application granted granted Critical
Publication of ATE509144T1 publication Critical patent/ATE509144T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007—Current directing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/18—Regeneration of process solutions of electrolytes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Electrolytic Production Of Metals (AREA)
AT06027073T 2006-12-29 2006-12-29 Bausatz zur herstellung eines prozessreaktors für die ausbildung metallischer schichten auf einem oder auf mehreren substraten ATE509144T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP06027073A EP1939329B1 (de) 2006-12-29 2006-12-29 Bausatz zur Herstellung eines Prozessreaktors für die Ausbildung metallischer Schichten auf einem oder auf mehreren Substraten

Publications (1)

Publication Number Publication Date
ATE509144T1 true ATE509144T1 (de) 2011-05-15

Family

ID=38284079

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06027073T ATE509144T1 (de) 2006-12-29 2006-12-29 Bausatz zur herstellung eines prozessreaktors für die ausbildung metallischer schichten auf einem oder auf mehreren substraten

Country Status (6)

Country Link
EP (1) EP1939329B1 (de)
KR (1) KR101133085B1 (de)
CN (1) CN101448983B (de)
AT (1) ATE509144T1 (de)
TW (1) TWI378157B (de)
WO (1) WO2008080515A2 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5996563B2 (ja) 2011-03-03 2016-09-21 エンクロマ， インコーポレイテッド 多帯域色視フィルタおよびｌｐ最適化による方法
KR101643276B1 (ko) * 2015-05-12 2016-08-02 강구일 전기분해를 이용한 수소발생장치
KR102639119B1 (ko) 2018-12-31 2024-02-20 엘지디스플레이 주식회사 전기 도금 장치 및 이를 이용한 전기 도금 방법
KR20220053669A (ko) * 2019-09-03 2022-04-29 램 리써치 코포레이션 전기 도금 셀을 위한 저각도 멤브레인 프레임
JP7356401B2 (ja) * 2020-05-12 2023-10-04 株式会社荏原製作所 プレート、めっき装置、及びプレートの製造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5000827A (en) * 1990-01-02 1991-03-19 Motorola, Inc. Method and apparatus for adjusting plating solution flow characteristics at substrate cathode periphery to minimize edge effect
US6103085A (en) * 1998-12-04 2000-08-15 Advanced Micro Devices, Inc. Electroplating uniformity by diffuser design
US6261426B1 (en) * 1999-01-22 2001-07-17 International Business Machines Corporation Method and apparatus for enhancing the uniformity of electrodeposition or electroetching
EP1031647A3 (de) * 1999-02-19 2002-03-06 Solid State Equipment Corporation Vorrichtung und Verfahren zur Plattierung einer Wafer
JP3255145B2 (ja) * 1999-04-06 2002-02-12 日本電気株式会社 めっき装置
US20050284751A1 (en) * 2004-06-28 2005-12-29 Nicolay Kovarsky Electrochemical plating cell with a counter electrode in an isolated anolyte compartment
JP2002097598A (ja) * 2000-09-25 2002-04-02 Mitsubishi Electric Corp 電解メッキ装置
US6964792B1 (en) * 2000-11-03 2005-11-15 Novellus Systems, Inc. Methods and apparatus for controlling electrolyte flow for uniform plating
TWM240034U (en) * 2002-02-19 2004-08-01 Advanced Semiconductor Eng Electric field adjustment device of electroplating tank
JP2004068158A (ja) * 2002-08-08 2004-03-04 Texas Instruments Inc Ｅｃｄ反応器内の電流密度改善および機構充填制御方法並びに装置
TWI240766B (en) * 2003-09-09 2005-10-01 Ind Tech Res Inst Electroplating device having rectification and voltage detection function
US20060102467A1 (en) * 2004-11-15 2006-05-18 Harald Herchen Current collimation for thin seed and direct plating
US20060163058A1 (en) * 2005-01-26 2006-07-27 Kiyonori Watanabe Apparatus for plating a semiconductor wafer and plating solution bath used therein
TW200641189A (en) * 2005-02-25 2006-12-01 Applied Materials Inc Counter electrode encased in cation exchange membrane tube for electroplating cell

Also Published As

Publication number Publication date
TWI378157B (en) 2012-12-01
CN101448983B (zh) 2012-11-07
KR20080102266A (ko) 2008-11-24
WO2008080515A2 (de) 2008-07-10
CN101448983A (zh) 2009-06-03
TW200842210A (en) 2008-11-01
KR101133085B1 (ko) 2012-04-24
EP1939329A1 (de) 2008-07-02
EP1939329B1 (de) 2011-05-11
WO2008080515A3 (de) 2008-09-12

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