ATE510307T1 - Durchsichtige beschichtung für leuchtdioden und fluoreszierende lichtquelle - Google Patents
Durchsichtige beschichtung für leuchtdioden und fluoreszierende lichtquelleInfo
- Publication number
- ATE510307T1 ATE510307T1 AT06021272T AT06021272T ATE510307T1 AT E510307 T1 ATE510307 T1 AT E510307T1 AT 06021272 T AT06021272 T AT 06021272T AT 06021272 T AT06021272 T AT 06021272T AT E510307 T1 ATE510307 T1 AT E510307T1
- Authority
- AT
- Austria
- Prior art keywords
- fluorescent
- transparent coating
- light source
- substance
- fluorescent light
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8515—Wavelength conversion means not being in contact with the bodies
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/04—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages the fastening being onto or by the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
- F21Y2115/15—Organic light-emitting diodes [OLED]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0361—Manufacture or treatment of packages of wavelength conversion means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
- H10H20/8512—Wavelength conversion materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Luminescent Compositions (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18103597 | 1997-07-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE510307T1 true ATE510307T1 (de) | 2011-06-15 |
Family
ID=16093633
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT98112602T ATE343853T1 (de) | 1997-07-07 | 1998-07-07 | Durchsichtige beschichtung für leuchtdioden und fluoreszierende lichtquellen |
| AT06021272T ATE510307T1 (de) | 1997-07-07 | 1998-07-07 | Durchsichtige beschichtung für leuchtdioden und fluoreszierende lichtquelle |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT98112602T ATE343853T1 (de) | 1997-07-07 | 1998-07-07 | Durchsichtige beschichtung für leuchtdioden und fluoreszierende lichtquellen |
Country Status (4)
| Country | Link |
|---|---|
| EP (3) | EP1753037B1 (de) |
| JP (4) | JP4271747B2 (de) |
| AT (2) | ATE343853T1 (de) |
| DE (1) | DE69836245T2 (de) |
Families Citing this family (55)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW383508B (en) * | 1996-07-29 | 2000-03-01 | Nichia Kagaku Kogyo Kk | Light emitting device and display |
| US6351069B1 (en) | 1999-02-18 | 2002-02-26 | Lumileds Lighting, U.S., Llc | Red-deficiency-compensating phosphor LED |
| US6680569B2 (en) | 1999-02-18 | 2004-01-20 | Lumileds Lighting U.S. Llc | Red-deficiency compensating phosphor light emitting device |
| JP4606530B2 (ja) * | 1999-05-14 | 2011-01-05 | 株式会社朝日ラバー | シート部材およびそれを用いた発光装置 |
| EP1107321A4 (de) | 1999-06-23 | 2006-08-30 | Citizen Electronics | Lichtemittierende diode |
| US6504301B1 (en) * | 1999-09-03 | 2003-01-07 | Lumileds Lighting, U.S., Llc | Non-incandescent lightbulb package using light emitting diodes |
| JP4542656B2 (ja) * | 2000-02-15 | 2010-09-15 | 株式会社朝日ラバー | 発光ダイオードの包装装置 |
| JP3609709B2 (ja) * | 2000-09-29 | 2005-01-12 | 株式会社シチズン電子 | 発光ダイオード |
| JP2002133925A (ja) * | 2000-10-25 | 2002-05-10 | Sanken Electric Co Ltd | 蛍光カバー及び半導体発光装置 |
| JP4101468B2 (ja) | 2001-04-09 | 2008-06-18 | 豊田合成株式会社 | 発光装置の製造方法 |
| JP2003152227A (ja) | 2001-11-14 | 2003-05-23 | Citizen Electronics Co Ltd | Ledの色補正手段および色補正方法 |
| JP4360788B2 (ja) * | 2002-08-29 | 2009-11-11 | シチズン電子株式会社 | 液晶表示板用のバックライト及びそれに用いる発光ダイオードの製造方法 |
| US7029935B2 (en) * | 2003-09-09 | 2006-04-18 | Cree, Inc. | Transmissive optical elements including transparent plastic shell having a phosphor dispersed therein, and methods of fabricating same |
| DE10347541B4 (de) * | 2003-10-09 | 2012-02-16 | Odelo Led Gmbh | Verfahren zum Herstellen eines lichtleitenden LED-Körpers in mindestens zwei Fertigungsstufen |
| JP2005327841A (ja) * | 2004-05-13 | 2005-11-24 | Asahi Rubber:Kk | 発光ダイオード用キャップ及び発光ダイオード装置 |
| JP2005333014A (ja) * | 2004-05-20 | 2005-12-02 | Koha Co Ltd | Ledランプ |
| JP2007035802A (ja) * | 2005-07-25 | 2007-02-08 | Matsushita Electric Works Ltd | 発光装置 |
| KR20080064854A (ko) * | 2005-10-05 | 2008-07-09 | 코닌클리즈케 필립스 일렉트로닉스 엔.브이. | 흡수 필터를 갖는 인광체-변환 전계발광 소자 |
| US7344952B2 (en) | 2005-10-28 | 2008-03-18 | Philips Lumileds Lighting Company, Llc | Laminating encapsulant film containing phosphor over LEDs |
| JP2007173673A (ja) * | 2005-12-26 | 2007-07-05 | Okaya Electric Ind Co Ltd | カラー発光ダイオード |
| EP3540794B1 (de) | 2006-03-10 | 2022-03-30 | Nichia Corporation | Lichtemittierende vorrichtung |
| JP4980640B2 (ja) * | 2006-03-31 | 2012-07-18 | 三洋電機株式会社 | 照明装置 |
| US20080035942A1 (en) | 2006-08-08 | 2008-02-14 | Lg Electronics Inc. | Light emitting device package and method for manufacturing the same |
| US7942556B2 (en) | 2007-06-18 | 2011-05-17 | Xicato, Inc. | Solid state illumination device |
| JP4807522B2 (ja) * | 2007-09-18 | 2011-11-02 | 株式会社朝日ラバー | 半導体光学素子部品のはんだ付け方法及び半導体光学素子部品 |
| JP5128888B2 (ja) * | 2007-10-01 | 2013-01-23 | 株式会社朝日ラバー | 発光デバイス及びそれを用いた照明装置 |
| US7984999B2 (en) | 2007-10-17 | 2011-07-26 | Xicato, Inc. | Illumination device with light emitting diodes and moveable light adjustment member |
| US9086213B2 (en) | 2007-10-17 | 2015-07-21 | Xicato, Inc. | Illumination device with light emitting diodes |
| JP5111286B2 (ja) * | 2008-08-08 | 2013-01-09 | シャープ株式会社 | Ledランプ駆動方法及びledランプ装置 |
| JP2010050585A (ja) | 2008-08-20 | 2010-03-04 | Funai Electric Co Ltd | 操作キーユニットの取付構造 |
| US8220971B2 (en) | 2008-11-21 | 2012-07-17 | Xicato, Inc. | Light emitting diode module with three part color matching |
| KR101102237B1 (ko) * | 2008-12-23 | 2012-01-03 | (주) 아모엘이디 | 엘이디 패키지, 엘이디 패키지의 제조방법, 및 백라이트 유니트와 조명장치 |
| JP2010171342A (ja) | 2009-01-26 | 2010-08-05 | Sony Corp | 色変換部材およびその製造方法、発光装置、表示装置 |
| JP2011205051A (ja) | 2009-06-26 | 2011-10-13 | Fujifilm Corp | 光反射基板およびその製造方法 |
| JP5342368B2 (ja) * | 2009-08-06 | 2013-11-13 | 株式会社朝日ラバー | 発光ダイオード |
| FR2949165B1 (fr) * | 2009-08-11 | 2011-10-07 | Oberthur Technologies | Carte a microcircuit comprenant une diode electroluminescente |
| RU2436196C1 (ru) * | 2010-06-11 | 2011-12-10 | Владимир Семенович Абрамов | Светодиодный источник излучения для систем управления транспортом |
| CN102666940A (zh) | 2009-12-25 | 2012-09-12 | 富士胶片株式会社 | 绝缘基板、绝缘基板制备方法、配线形成方法、配线基板、和发光器件 |
| EP2362207A1 (de) * | 2010-01-28 | 2011-08-31 | F. Hoffmann-La Roche AG | Messsystem und Messverfahren insbesondere zur Blutzuckerbestimmung |
| US8104908B2 (en) | 2010-03-04 | 2012-01-31 | Xicato, Inc. | Efficient LED-based illumination module with high color rendering index |
| JP5706631B2 (ja) * | 2010-05-07 | 2015-04-22 | 株式会社八洲測器 | 対面調光ledデバイス |
| US20120051045A1 (en) | 2010-08-27 | 2012-03-01 | Xicato, Inc. | Led Based Illumination Module Color Matched To An Arbitrary Light Source |
| JP5292368B2 (ja) * | 2010-08-27 | 2013-09-18 | 株式会社朝日ラバー | 発光色変換シートおよびそれを用いた発光装置 |
| JP2012079763A (ja) * | 2010-09-30 | 2012-04-19 | Keii Kagi Kofun Yugenkoshi | 発光ダイオードのモールド製造プロセス、及び前記製造プロセスで製造したカバー構造 |
| JP5355640B2 (ja) * | 2011-08-24 | 2013-11-27 | シャープ株式会社 | Ledランプ駆動方法 |
| KR101404911B1 (ko) | 2011-11-29 | 2014-06-09 | 샤프 가부시키가이샤 | 발광 디바이스의 제조 방법 |
| JP2012199589A (ja) * | 2012-06-19 | 2012-10-18 | Sharp Corp | Ledランプ装置および表示装置 |
| CA2919622C (en) | 2013-10-22 | 2019-04-16 | Daisho Denki Inc. | Illumination device |
| DE102014100837A1 (de) * | 2014-01-24 | 2015-07-30 | Osram Opto Semiconductors Gmbh | Lichtemittierendes Bauelement und Verfahren zur Herstellung eines lichtemittierenden Bauelements |
| US9590148B2 (en) | 2014-03-18 | 2017-03-07 | GE Lighting Solutions, LLC | Encapsulant modification in heavily phosphor loaded LED packages for improved stability |
| US9680067B2 (en) | 2014-03-18 | 2017-06-13 | GE Lighting Solutions, LLC | Heavily phosphor loaded LED packages having higher stability |
| JP7361291B2 (ja) | 2018-01-15 | 2023-10-16 | 株式会社朝日ラバー | Led装置及び発光表示構造 |
| WO2020144882A1 (ja) * | 2019-01-11 | 2020-07-16 | 株式会社朝日ラバー | 光源、led装置及び発光表示構造 |
| KR102334956B1 (ko) * | 2018-11-01 | 2021-12-02 | 주식회사 엘지화학 | 차량용 램프 및 이의 제조 방법 |
| JP7429423B2 (ja) * | 2020-01-10 | 2024-02-08 | 内山工業株式会社 | 密封部材用ゴム組成物及びその製造方法 |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3593055A (en) * | 1969-04-16 | 1971-07-13 | Bell Telephone Labor Inc | Electro-luminescent device |
| US3932881A (en) * | 1972-09-05 | 1976-01-13 | Nippon Electric Co., Inc. | Electroluminescent device including dichroic and infrared reflecting components |
| JPS5079379A (de) * | 1973-11-13 | 1975-06-27 | ||
| JPS5079379U (de) * | 1973-11-24 | 1975-07-09 | ||
| US3959655A (en) * | 1975-02-06 | 1976-05-25 | Eastman Kodak Company | Light source for optical sound recording and reproduction apparatus |
| JPS5330783U (de) * | 1976-08-24 | 1978-03-16 | ||
| JPS5330783A (en) * | 1976-09-02 | 1978-03-23 | Tokyo Shibaura Electric Co | Dc breaker |
| US4599537A (en) * | 1982-04-30 | 1986-07-08 | Shigeaki Yamashita | IR light emitting apparatus with visible detection means |
| JPS58196067A (ja) * | 1982-05-11 | 1983-11-15 | Colpo Co Ltd | 発光ダイオ−ドを光源とする発光体 |
| GB2153256B (en) * | 1984-01-20 | 1987-07-15 | Pa Consulting Services | Improved toothstick and methods of production |
| JPS60179056U (ja) * | 1984-05-07 | 1985-11-28 | 日本デンヨ−株式会社 | Ledランプのレンズキャップ装置 |
| JPS61185980A (ja) * | 1985-02-13 | 1986-08-19 | Stanley Electric Co Ltd | 発光ダイオ−ド |
| JPS61187384A (ja) * | 1985-02-15 | 1986-08-21 | Stanley Electric Co Ltd | 発光ダイオ−ド |
| JPS63280467A (ja) * | 1987-05-12 | 1988-11-17 | Toshiba Corp | 光半導体素子 |
| DE3804293A1 (de) * | 1988-02-12 | 1989-08-24 | Philips Patentverwaltung | Anordnung mit einer elektrolumineszenz- oder laserdiode |
| JPH01260707A (ja) * | 1988-04-11 | 1989-10-18 | Idec Izumi Corp | 白色発光装置 |
| JPH04226095A (ja) * | 1990-04-27 | 1992-08-14 | Omron Corp | 半導体発光装置 |
| US5208462A (en) * | 1991-12-19 | 1993-05-04 | Allied-Signal Inc. | Wide bandwidth solid state optical source |
| JP3199483B2 (ja) * | 1992-08-21 | 2001-08-20 | アルパイン株式会社 | 照光装置 |
| JPH06104491A (ja) * | 1992-09-17 | 1994-04-15 | Rohm Co Ltd | 発光ダイオードランプ |
| JPH07193281A (ja) * | 1993-12-27 | 1995-07-28 | Mitsubishi Materials Corp | 指向性の少ない赤外可視変換発光ダイオード |
| JPH0864860A (ja) * | 1994-08-17 | 1996-03-08 | Mitsubishi Materials Corp | 色純度の高い赤外可視変換青色発光ダイオード |
| JP3419116B2 (ja) * | 1994-10-18 | 2003-06-23 | 株式会社島津製作所 | X線ct装置 |
| JPH08279627A (ja) * | 1995-04-07 | 1996-10-22 | Showa Denko Kk | 発光素子 |
| JPH0927642A (ja) * | 1995-07-13 | 1997-01-28 | Clarion Co Ltd | 照明装置 |
| EP2282354B1 (de) * | 1996-06-26 | 2013-09-11 | OSRAM Opto Semiconductors GmbH | Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement |
| JP3434658B2 (ja) * | 1997-01-14 | 2003-08-11 | サンケン電気株式会社 | 半導体発光装置 |
| US6274890B1 (en) * | 1997-01-15 | 2001-08-14 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device and its manufacturing method |
| JP3167641B2 (ja) * | 1997-03-31 | 2001-05-21 | 和泉電気株式会社 | Led球 |
| EP0883195A1 (de) * | 1997-06-03 | 1998-12-09 | BARR & STROUD LIMITED | Kopfnachführsystem, das eine LED mit fluoreszierender Beschichtung aufweist |
-
1998
- 1998-06-12 JP JP16559898A patent/JP4271747B2/ja not_active Expired - Fee Related
- 1998-07-07 AT AT98112602T patent/ATE343853T1/de not_active IP Right Cessation
- 1998-07-07 AT AT06021272T patent/ATE510307T1/de not_active IP Right Cessation
- 1998-07-07 EP EP06021272A patent/EP1753037B1/de not_active Expired - Lifetime
- 1998-07-07 DE DE69836245T patent/DE69836245T2/de not_active Expired - Lifetime
- 1998-07-07 EP EP10011258A patent/EP2270885A3/de not_active Withdrawn
- 1998-07-07 EP EP98112602A patent/EP0890996B1/de not_active Expired - Lifetime
-
2008
- 2008-06-09 JP JP2008150586A patent/JP4937964B2/ja not_active Expired - Fee Related
- 2008-06-09 JP JP2008150588A patent/JP4937966B2/ja not_active Expired - Fee Related
- 2008-06-09 JP JP2008150587A patent/JP4937965B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| HK1099963A1 (en) | 2007-08-31 |
| JPH1187784A (ja) | 1999-03-30 |
| JP2008270831A (ja) | 2008-11-06 |
| JP2008211262A (ja) | 2008-09-11 |
| EP0890996A3 (de) | 2000-05-10 |
| DE69836245T2 (de) | 2007-04-19 |
| ATE343853T1 (de) | 2006-11-15 |
| JP2008252119A (ja) | 2008-10-16 |
| EP2270885A2 (de) | 2011-01-05 |
| EP1753037A1 (de) | 2007-02-14 |
| JP4937964B2 (ja) | 2012-05-23 |
| DE69836245D1 (de) | 2006-12-07 |
| JP4937966B2 (ja) | 2012-05-23 |
| EP1753037B1 (de) | 2011-05-18 |
| JP4937965B2 (ja) | 2012-05-23 |
| EP0890996A2 (de) | 1999-01-13 |
| EP0890996B1 (de) | 2006-10-25 |
| EP2270885A3 (de) | 2012-12-12 |
| JP4271747B2 (ja) | 2009-06-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |