ATE511206T1 - Ladungsträgerteilchenstrahlsystem - Google Patents
LadungsträgerteilchenstrahlsystemInfo
- Publication number
- ATE511206T1 ATE511206T1 AT05075600T AT05075600T ATE511206T1 AT E511206 T1 ATE511206 T1 AT E511206T1 AT 05075600 T AT05075600 T AT 05075600T AT 05075600 T AT05075600 T AT 05075600T AT E511206 T1 ATE511206 T1 AT E511206T1
- Authority
- AT
- Austria
- Prior art keywords
- ion generator
- beam system
- particle beam
- chamber
- charge carrier
- Prior art date
Links
- 239000002245 particle Substances 0.000 title abstract 2
- 150000002500 ions Chemical class 0.000 abstract 5
- 238000000034 method Methods 0.000 abstract 2
- 230000005591 charge neutralization Effects 0.000 abstract 1
- 238000001514 detection method Methods 0.000 abstract 1
- 230000009977 dual effect Effects 0.000 abstract 1
- 238000000206 photolithography Methods 0.000 abstract 1
- 239000011163 secondary particle Substances 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
- G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/244—Detectors; Associated components or circuits therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/004—Charge control of objects or beams
- H01J2237/0041—Neutralising arrangements
- H01J2237/0044—Neutralising arrangements of objects being observed or treated
- H01J2237/0045—Neutralising arrangements of objects being observed or treated using secondary electrons
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/26—Electron or ion microscopes
- H01J2237/28—Scanning microscopes
- H01J2237/2813—Scanning microscopes characterised by the application
- H01J2237/2817—Pattern inspection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/317—Processing objects on a microscale
- H01J2237/31735—Direct-write microstructures
- H01J2237/31737—Direct-write microstructures using ions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/317—Processing objects on a microscale
- H01J2237/3174—Etching microareas
- H01J2237/31742—Etching microareas for repairing masks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/317—Processing objects on a microscale
- H01J2237/3175—Lithography
- H01J2237/31793—Problems associated with lithography
- H01J2237/31798—Problems associated with lithography detecting pattern defects
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- General Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Biochemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Electron Beam Exposure (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/801,981 US6979822B1 (en) | 2002-09-18 | 2004-03-16 | Charged particle beam system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE511206T1 true ATE511206T1 (de) | 2011-06-15 |
Family
ID=34838899
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT05075600T ATE511206T1 (de) | 2004-03-16 | 2005-03-11 | Ladungsträgerteilchenstrahlsystem |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US6979822B1 (de) |
| EP (1) | EP1577927B1 (de) |
| JP (1) | JP5586118B2 (de) |
| AT (1) | ATE511206T1 (de) |
Families Citing this family (52)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI323783B (en) * | 2003-01-27 | 2010-04-21 | Ebara Corp | Mapping projection type electron beam apparatus for sample inspection by electron emitted from the sample,sample evaluation method and semiconductor device manufacturing using same |
| PL207238B1 (pl) * | 2003-10-14 | 2010-11-30 | Politechnika Wroclawska | Układ detekcyjny elektronów wtórnych i wstecznie rozproszonych do skaningowego mikroskopu elektronowego |
| GB2411763B (en) * | 2004-03-05 | 2009-02-18 | Thermo Electron Corp | Flood gun for charge neutralization |
| US7232997B2 (en) * | 2004-04-15 | 2007-06-19 | Nawotec Gmbh | Apparatus and method for investigating or modifying a surface with a beam of charged particles |
| JP5078232B2 (ja) * | 2005-04-26 | 2012-11-21 | エスアイアイ・ナノテクノロジー株式会社 | 複合荷電粒子ビーム装置及びそれにおける照射位置決め方法 |
| WO2007067296A2 (en) * | 2005-12-02 | 2007-06-14 | Alis Corporation | Ion sources, systems and methods |
| JP4801996B2 (ja) * | 2006-01-05 | 2011-10-26 | 株式会社ニューフレアテクノロジー | 試料移動機構及び荷電粒子ビーム描画装置 |
| JP2007212398A (ja) * | 2006-02-13 | 2007-08-23 | Toshiba Corp | 基板検査装置および基板検査方法 |
| DE602006015768D1 (de) | 2006-02-23 | 2010-09-09 | Integrated Circuit Testing | Teilchenstrahlgerät mit Ozon-Quelle |
| EP2002459B1 (de) * | 2006-03-31 | 2014-11-26 | Fei Company | Verbesserter detektor für instrumente mit geladenem teilchenstrahl |
| TWI311328B (en) * | 2006-05-11 | 2009-06-21 | Nat Central Universit | Electron microscopy , methods to determine the contact point and the contact of the probe |
| EP2054938A2 (de) * | 2006-07-07 | 2009-05-06 | Sri International | Flüssigmetallbenetzung mikrohergestellter emissionsstrukturen für geladene teilchen |
| JP4988308B2 (ja) * | 2006-11-07 | 2012-08-01 | 株式会社日立ハイテクノロジーズ | ガス増幅形検出器およびそれを用いた電子線応用装置 |
| EP2109873B1 (de) * | 2007-02-06 | 2017-04-05 | FEI Company | Geladenes teilchenstrahlsystem unter hochdruck |
| JP4691529B2 (ja) * | 2007-07-20 | 2011-06-01 | 株式会社日立ハイテクノロジーズ | 荷電粒子線装置、及び試料加工観察方法 |
| JP5102580B2 (ja) * | 2007-10-18 | 2012-12-19 | 株式会社日立ハイテクノロジーズ | 荷電粒子線応用装置 |
| US7791020B2 (en) * | 2008-03-31 | 2010-09-07 | Fei Company | Multistage gas cascade amplifier |
| JP5246916B2 (ja) * | 2008-04-16 | 2013-07-24 | ギガフォトン株式会社 | Euv光発生装置におけるイオン回収装置および方法 |
| JP5179253B2 (ja) * | 2008-05-16 | 2013-04-10 | 株式会社日立ハイテクノロジーズ | 電極ユニット、及び荷電粒子線装置 |
| CN102149509B (zh) * | 2008-07-09 | 2014-08-20 | Fei公司 | 用于激光加工的方法和设备 |
| DE102008040426B4 (de) * | 2008-07-15 | 2015-12-24 | Carl Zeiss Microscopy Gmbh | Verfahren zur Untersuchung einer Oberfläche eines Objekts |
| DE102008064856B3 (de) * | 2008-07-15 | 2017-07-13 | Carl Zeiss Microscopy Gmbh | Vorrichtung zur Untersuchung einer Oberfläche eines Objekts |
| DE102008041815A1 (de) | 2008-09-04 | 2010-04-15 | Carl Zeiss Nts Gmbh | Verfahren zur Analyse einer Probe |
| US8299432B2 (en) * | 2008-11-04 | 2012-10-30 | Fei Company | Scanning transmission electron microscope using gas amplification |
| JP5352262B2 (ja) | 2009-02-06 | 2013-11-27 | 株式会社日立ハイテクノロジーズ | 荷電粒子線装置 |
| US9265136B2 (en) | 2010-02-19 | 2016-02-16 | Gigaphoton Inc. | System and method for generating extreme ultraviolet light |
| US9113540B2 (en) | 2010-02-19 | 2015-08-18 | Gigaphoton Inc. | System and method for generating extreme ultraviolet light |
| JP2012009497A (ja) * | 2010-06-22 | 2012-01-12 | Nippon Telegr & Teleph Corp <Ntt> | 微小構造体の製造方法 |
| US9679741B2 (en) | 2010-11-09 | 2017-06-13 | Fei Company | Environmental cell for charged particle beam system |
| US9159530B2 (en) | 2011-03-04 | 2015-10-13 | Hitachi High-Technologies Corporation | Electron microscope sample holder and sample observation method |
| US8476004B2 (en) | 2011-06-27 | 2013-07-02 | United Microelectronics Corp. | Method for forming photoresist patterns |
| WO2014022429A1 (en) * | 2012-07-30 | 2014-02-06 | Fei Company | Environmental sem gas injection system |
| US8701052B1 (en) | 2013-01-23 | 2014-04-15 | United Microelectronics Corp. | Method of optical proximity correction in combination with double patterning technique |
| US8627242B1 (en) | 2013-01-30 | 2014-01-07 | United Microelectronics Corp. | Method for making photomask layout |
| US9230812B2 (en) | 2013-05-22 | 2016-01-05 | United Microelectronics Corp. | Method for forming semiconductor structure having opening |
| US9478390B2 (en) | 2014-06-30 | 2016-10-25 | Fei Company | Integrated light optics and gas delivery in a charged particle lens |
| US9715724B2 (en) | 2014-07-29 | 2017-07-25 | Applied Materials Israel Ltd. | Registration of CAD data with SEM images |
| EP3249676B1 (de) | 2016-05-27 | 2018-10-03 | FEI Company | Ladungsträgerteilchenmikroskop mit zwei geladenen teilchenstrahlen und in situ-abscheidungsfunktionalität |
| JP7094752B2 (ja) * | 2018-03-29 | 2022-07-04 | 株式会社ニューフレアテクノロジー | 荷電粒子ビーム照射装置 |
| CN111103316B (zh) * | 2018-10-25 | 2021-05-25 | 中国科学院上海硅酸盐研究所 | 一种非导体陶瓷材料无荷电平衡电压的计算方法 |
| US11995512B2 (en) | 2018-11-13 | 2024-05-28 | Atom Computing Inc. | Scalable neutral atom based quantum computing |
| US10504033B1 (en) | 2018-11-13 | 2019-12-10 | Atom Computing Inc. | Scalable neutral atom based quantum computing |
| US11580435B2 (en) | 2018-11-13 | 2023-02-14 | Atom Computing Inc. | Scalable neutral atom based quantum computing |
| CN110505742B (zh) * | 2019-08-22 | 2023-04-07 | 上海华力微电子有限公司 | 晶圆表面电荷消除装置及方法 |
| CA3174448A1 (en) | 2020-03-02 | 2021-09-10 | Atom Computing Inc. | Scalable neutral atom based quantum computing |
| JP7732994B2 (ja) | 2020-03-02 | 2025-09-02 | アトム コンピューティング インク. | スケーラブルな中性原子ベースの量子コンピューティング |
| WO2022094599A1 (en) * | 2020-10-30 | 2022-05-05 | Saint-Gobain Performance Plastics Corporation | Apparatus for welding |
| EP4526813A1 (de) | 2022-05-19 | 2025-03-26 | Atom Computing Inc. | Vorrichtungen und verfahren für hohlraumbasierte berechnung |
| JP2023183505A (ja) * | 2022-06-16 | 2023-12-28 | 株式会社日立ハイテク | 荷電粒子線装置 |
| US12308207B2 (en) * | 2022-08-18 | 2025-05-20 | Applied Materials Israel Ltd. | Enhanced deposition rate by thermal isolation cover for GIS manipulator |
| US20240105421A1 (en) * | 2022-09-22 | 2024-03-28 | Applied Materials Israel Ltd. | Enhanced deposition rate by applying a negative voltage to a gas injection nozzle in fib systems |
| CN117219482B (zh) * | 2023-11-07 | 2024-01-26 | 国仪量子(合肥)技术有限公司 | 电流检测装置和扫描电子显微镜 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4249077A (en) | 1978-08-04 | 1981-02-03 | Crawford Charles K | Ion charge neutralization for electron beam devices |
| US4601211A (en) * | 1984-12-12 | 1986-07-22 | The Perkin-Elmer Corporation | Multi-port valve in a gas collection system and method of using same |
| JP2811073B2 (ja) * | 1988-11-01 | 1998-10-15 | セイコーインスツルメンツ株式会社 | 断面加工観察装置 |
| JPH02236939A (ja) * | 1989-03-09 | 1990-09-19 | Nikon Corp | 走査型電子顕微鏡 |
| JPH03194838A (ja) * | 1989-12-22 | 1991-08-26 | Sumitomo Metal Ind Ltd | 帯電防止方法及び該方法に使用する帯電防止装置 |
| JP3038901B2 (ja) * | 1990-11-26 | 2000-05-08 | 株式会社ニコン | 環境制御型走査電子顕微鏡 |
| JPH05174768A (ja) | 1991-02-26 | 1993-07-13 | Nikon Corp | 環境制御型走査電子顕微鏡 |
| JP3730263B2 (ja) | 1992-05-27 | 2005-12-21 | ケーエルエー・インストルメンツ・コーポレーション | 荷電粒子ビームを用いた自動基板検査の装置及び方法 |
| US5396067A (en) * | 1992-06-11 | 1995-03-07 | Nikon Corporation | Scan type electron microscope |
| DE29507225U1 (de) * | 1995-04-29 | 1995-07-13 | Grünewald, Wolfgang, Dr.rer.nat., 09122 Chemnitz | Ionenstrahlpräparationsvorrichtung für die Elektronenmikroskopie |
| JPH0963525A (ja) * | 1995-08-22 | 1997-03-07 | Nikon Corp | 走査型電子顕微鏡 |
| US6172363B1 (en) | 1996-03-05 | 2001-01-09 | Hitachi, Ltd. | Method and apparatus for inspecting integrated circuit pattern |
| JP3547143B2 (ja) | 1997-07-22 | 2004-07-28 | 株式会社日立製作所 | 試料作製方法 |
| WO1999030345A1 (en) * | 1997-12-08 | 1999-06-17 | Philips Electron Optics B.V. | Environmental sem with a magnetic field for improved secondary electron detection |
| JP4084427B2 (ja) * | 1997-12-08 | 2008-04-30 | エフ イー アイ カンパニ | 改善された2次電子検出のための多極界を用いた環境制御型sem |
| WO1999046797A1 (de) * | 1998-03-10 | 1999-09-16 | Erik Essers | Rasterelektronenmikroskop |
| US6525317B1 (en) | 1998-12-30 | 2003-02-25 | Micron Technology Inc. | Reduction of charging effect and carbon deposition caused by electron beam devices |
| CZ304599B6 (cs) * | 1999-11-29 | 2014-07-30 | Leo Elektronenmikroskopie Gmbh | Rastrovací elektronový mikroskop a detektor sekundárních elektronů v rastrovacím elektronovém mikroskopu |
| JP5143990B2 (ja) * | 2000-07-07 | 2013-02-13 | カール・ツァイス・エヌティーエス・ゲーエムベーハー | 変化する圧力領域のための検出器、およびこのような検出器を備える電子顕微鏡 |
| GB2367686B (en) | 2000-08-10 | 2002-12-11 | Leo Electron Microscopy Ltd | Improvements in or relating to particle detectors |
| CZ20022105A3 (cs) * | 2002-06-17 | 2004-02-18 | Tescan, S. R. O. | Detektor sekundárních elektronů, zejména v rastrovacím elektronovém mikroskopu |
| JP2004031207A (ja) * | 2002-06-27 | 2004-01-29 | Canon Inc | 電子線照射装置および走査型電子顕微鏡装置 |
-
2004
- 2004-03-16 US US10/801,981 patent/US6979822B1/en not_active Expired - Lifetime
-
2005
- 2005-03-11 EP EP05075600A patent/EP1577927B1/de not_active Revoked
- 2005-03-11 AT AT05075600T patent/ATE511206T1/de not_active IP Right Cessation
- 2005-03-16 JP JP2005076014A patent/JP5586118B2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| EP1577927A3 (de) | 2008-11-26 |
| US20050279934A1 (en) | 2005-12-22 |
| EP1577927B1 (de) | 2011-05-25 |
| US6979822B1 (en) | 2005-12-27 |
| JP2005268224A (ja) | 2005-09-29 |
| JP5586118B2 (ja) | 2014-09-10 |
| EP1577927A2 (de) | 2005-09-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |