ATE511216T1 - Auflegevorrichtung - Google Patents

Auflegevorrichtung

Info

Publication number
ATE511216T1
ATE511216T1 AT09001244T AT09001244T ATE511216T1 AT E511216 T1 ATE511216 T1 AT E511216T1 AT 09001244 T AT09001244 T AT 09001244T AT 09001244 T AT09001244 T AT 09001244T AT E511216 T1 ATE511216 T1 AT E511216T1
Authority
AT
Austria
Prior art keywords
strips
tape
electrode
laying
cut
Prior art date
Application number
AT09001244T
Other languages
English (en)
Inventor
Kasahara Masato
Momota Yutaka
Original Assignee
Nisshin Spinning
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nisshin Spinning filed Critical Nisshin Spinning
Application granted granted Critical
Publication of ATE511216T1 publication Critical patent/ATE511216T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H35/00—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers
    • B65H35/0006—Article or web delivery apparatus incorporating cutting or line-perforating devices
    • B65H35/006—Article or web delivery apparatus incorporating cutting or line-perforating devices with means for delivering a predetermined length of tape
    • B65H35/0066—Article or web delivery apparatus incorporating cutting or line-perforating devices with means for delivering a predetermined length of tape this length being adjustable
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H35/00—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers
    • B65H35/0006—Article or web delivery apparatus incorporating cutting or line-perforating devices
    • B65H35/002—Hand-held or table apparatus
    • B65H35/0026—Hand-held or table apparatus for delivering pressure-sensitive adhesive tape
    • B65H35/0033—Hand-held or table apparatus for delivering pressure-sensitive adhesive tape and affixing it to a surface
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F10/00—Individual photovoltaic cells, e.g. solar cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H10F71/137—Batch treatment of the devices
    • H10F71/1375—Apparatus for automatic interconnection of photovoltaic cells in a module
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1084—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing of continuous or running length bonded web
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/1092—All laminae planar and face to face
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
    • Y10T156/125—Plural severing means each acting on a different work piece
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
    • Y10T156/13—Severing followed by associating with part from same source
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
    • Y10T156/1317—Means feeding plural workpieces to be joined
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
    • Y10T156/1317—Means feeding plural workpieces to be joined
    • Y10T156/1322—Severing before bonding or assembling of parts
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
    • Y10T156/1348—Work traversing type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702—For plural parts or plural areas of single part
    • Y10T156/1705—Lamina transferred to base from adhered flexible web or sheet type carrier

Landscapes

  • Photovoltaic Devices (AREA)
  • Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
AT09001244T 2008-01-30 2009-01-29 Auflegevorrichtung ATE511216T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008018422A JP4870100B2 (ja) 2008-01-30 2008-01-30 テープ状体の配設装置

Publications (1)

Publication Number Publication Date
ATE511216T1 true ATE511216T1 (de) 2011-06-15

Family

ID=40584797

Family Applications (1)

Application Number Title Priority Date Filing Date
AT09001244T ATE511216T1 (de) 2008-01-30 2009-01-29 Auflegevorrichtung

Country Status (8)

Country Link
US (2) US8146643B2 (de)
EP (1) EP2086025B1 (de)
JP (1) JP4870100B2 (de)
KR (1) KR20090083865A (de)
CN (1) CN101499500A (de)
AT (1) ATE511216T1 (de)
ES (1) ES2365655T3 (de)
TW (1) TW200941735A (de)

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JP2011066305A (ja) * 2009-09-18 2011-03-31 Nagano Japan Radio Co シート状線材による電極の製造方法及び装置
US8978905B2 (en) * 2010-07-02 2015-03-17 Liko Research & Development Ab Lift systems with continuous in-rail charging
US8789568B2 (en) 2010-08-06 2014-07-29 First Solar, Inc. Tape detection system
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JP6021138B2 (ja) 2011-05-27 2016-11-09 デクセリアルズ株式会社 太陽電池モジュール、太陽電池モジュールの製造方法、及び薄膜太陽電池用タブ線
US9812592B2 (en) 2012-12-21 2017-11-07 Sunpower Corporation Metal-foil-assisted fabrication of thin-silicon solar cell
NZ713535A (en) * 2013-04-09 2018-04-27 Cryovac Inc Apparatus and process for packaging a product
US9437756B2 (en) 2013-09-27 2016-09-06 Sunpower Corporation Metallization of solar cells using metal foils
US9653638B2 (en) 2013-12-20 2017-05-16 Sunpower Corporation Contacts for solar cells formed by directing a laser beam with a particular shape on a metal foil over a dielectric region
US9178104B2 (en) 2013-12-20 2015-11-03 Sunpower Corporation Single-step metal bond and contact formation for solar cells
US9231129B2 (en) 2014-03-28 2016-01-05 Sunpower Corporation Foil-based metallization of solar cells
US9947812B2 (en) 2014-03-28 2018-04-17 Sunpower Corporation Metallization of solar cells
US9257575B1 (en) 2014-09-18 2016-02-09 Sunpower Corporation Foil trim approaches for foil-based metallization of solar cells
WO2016068490A1 (ko) * 2014-10-27 2016-05-06 주식회사 제우스 태빙장치의 와이어 셋팅장치 및 이를 이용한 와이어 셋팅방법
US9620661B2 (en) 2014-12-19 2017-04-11 Sunpower Corporation Laser beam shaping for foil-based metallization of solar cells
US20160380127A1 (en) 2015-06-26 2016-12-29 Richard Hamilton SEWELL Leave-In Etch Mask for Foil-Based Metallization of Solar Cells
KR101661859B1 (ko) 2015-09-09 2016-09-30 엘지전자 주식회사 태양 전지 모듈 및 그 제조 방법
US9620655B1 (en) 2015-10-29 2017-04-11 Sunpower Corporation Laser foil trim approaches for foil-based metallization for solar cells
US11424373B2 (en) 2016-04-01 2022-08-23 Sunpower Corporation Thermocompression bonding approaches for foil-based metallization of non-metal surfaces of solar cells
US10290763B2 (en) 2016-05-13 2019-05-14 Sunpower Corporation Roll-to-roll metallization of solar cells
TW201811518A (zh) * 2016-06-21 2018-04-01 美商3M新設資產公司 材料條之轉換及施加
US9882071B2 (en) 2016-07-01 2018-01-30 Sunpower Corporation Laser techniques for foil-based metallization of solar cells
US10115855B2 (en) 2016-09-30 2018-10-30 Sunpower Corporation Conductive foil based metallization of solar cells
US11908958B2 (en) 2016-12-30 2024-02-20 Maxeon Solar Pte. Ltd. Metallization structures for solar cells
EP3477806B1 (de) * 2017-10-30 2022-03-02 Komax Holding Ag Verfahren zum verbinden eines ersten kabels mit einem zweiten kabel, kabelanordnung und kabelverbindungsvorrichtung zum verbinden eines ersten kabels mit einem zweiten kabel
CN207668383U (zh) * 2017-12-19 2018-07-31 米亚索乐装备集成（福建）有限公司 绕线机
KR101899768B1 (ko) * 2018-03-09 2018-09-20 김명기 라미네이팅 장치
JP2021521633A (ja) 2018-04-06 2021-08-26 サンパワー コーポレイション 太陽電池ストリングのレーザー支援メタライゼーションプロセス
US11646387B2 (en) 2018-04-06 2023-05-09 Maxeon Solar Pte. Ltd. Laser assisted metallization process for solar cell circuit formation
KR102729996B1 (ko) 2018-04-06 2024-11-14 맥시온 솔라 피티이. 엘티디. 레이저 빔을 이용하는 반도체 기판을 위한 국소 금속화
WO2019195806A2 (en) 2018-04-06 2019-10-10 Sunpower Corporation Local patterning and metallization of semiconductor structures using a laser beam
WO2019195803A1 (en) 2018-04-06 2019-10-10 Sunpower Corporation Laser assisted metallization process for solar cell fabrication
JP7165510B2 (ja) * 2018-05-25 2022-11-04 株式会社ディスコ 搬送用治具及び交換方法
CN115692542B (zh) * 2021-07-27 2025-01-28 环晟新能源(江苏)有限公司 一种太阳能电池组件叠片定位方法
CN114283998B (zh) * 2021-12-28 2024-04-12 苏州光汇新能源科技有限公司 导线网生产装置、太阳能电池互联系统及其方法
CN116331887B (zh) * 2023-03-29 2025-12-05 苏州智慧谷激光智能装备有限公司 物料铺设装置及物料铺设方法
KR20250165077A (ko) * 2024-05-17 2025-11-25 한화솔루션 주식회사 태양전지 모듈용 테이프 컷팅 장치, 태양전지 모듈 제조 장치 및 제조 방법

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Also Published As

Publication number Publication date
JP4870100B2 (ja) 2012-02-08
US20090188628A1 (en) 2009-07-30
EP2086025B1 (de) 2011-05-25
US8146643B2 (en) 2012-04-03
EP2086025A1 (de) 2009-08-05
KR20090083865A (ko) 2009-08-04
CN101499500A (zh) 2009-08-05
ES2365655T3 (es) 2011-10-07
TW200941735A (en) 2009-10-01
US20120061019A1 (en) 2012-03-15
JP2009182066A (ja) 2009-08-13

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