ATE511320T1 - Verfahren zur herstellung und akustischen verbindung von strukturen auf einem substrat - Google Patents
Verfahren zur herstellung und akustischen verbindung von strukturen auf einem substratInfo
- Publication number
- ATE511320T1 ATE511320T1 AT04380017T AT04380017T ATE511320T1 AT E511320 T1 ATE511320 T1 AT E511320T1 AT 04380017 T AT04380017 T AT 04380017T AT 04380017 T AT04380017 T AT 04380017T AT E511320 T1 ATE511320 T1 AT E511320T1
- Authority
- AT
- Austria
- Prior art keywords
- chamber
- processes
- substrate
- cavity
- mesh
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
- B81C1/00158—Diaphragms, membranes
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61K—PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES
- A61K8/00—Cosmetics or similar toiletry preparations
- A61K8/02—Cosmetics or similar toiletry preparations characterised by special physical form
- A61K8/0208—Tissues; Wipes; Patches
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61K—PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES
- A61K2800/00—Properties of cosmetic compositions or active ingredients thereof or formulation aids used therein and process related aspects
- A61K2800/20—Chemical, physico-chemical or functional or structural properties of the composition as a whole
- A61K2800/30—Characterized by the absence of a particular group of ingredients
- A61K2800/33—Free of surfactant
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61K—PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES
- A61K2800/00—Properties of cosmetic compositions or active ingredients thereof or formulation aids used therein and process related aspects
- A61K2800/40—Chemical, physico-chemical or functional or structural properties of particular ingredients
- A61K2800/58—Metal complex; Coordination compounds
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61K—PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES
- A61K2800/00—Properties of cosmetic compositions or active ingredients thereof or formulation aids used therein and process related aspects
- A61K2800/70—Biological properties of the composition as a whole
- A61K2800/72—Hypo-allergenic
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61K—PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES
- A61K2800/00—Properties of cosmetic compositions or active ingredients thereof or formulation aids used therein and process related aspects
- A61K2800/74—Biological properties of particular ingredients
- A61K2800/75—Anti-irritant
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61K—PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES
- A61K2800/00—Properties of cosmetic compositions or active ingredients thereof or formulation aids used therein and process related aspects
- A61K2800/80—Process related aspects concerning the preparation of the cosmetic composition or the storage or application thereof
- A61K2800/94—Involves covalent bonding to the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0257—Microphones or microspeakers
Landscapes
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Animal Behavior & Ethology (AREA)
- Biomedical Technology (AREA)
- Birds (AREA)
- Epidemiology (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Health & Medical Sciences (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Micromachines (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/349,618 US7049051B2 (en) | 2003-01-23 | 2003-01-23 | Process for forming and acoustically connecting structures on a substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE511320T1 true ATE511320T1 (de) | 2011-06-15 |
Family
ID=32594932
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT04380017T ATE511320T1 (de) | 2003-01-23 | 2004-01-22 | Verfahren zur herstellung und akustischen verbindung von strukturen auf einem substrat |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US7049051B2 (de) |
| EP (1) | EP1441561B1 (de) |
| JP (1) | JP4672984B2 (de) |
| AT (1) | ATE511320T1 (de) |
Families Citing this family (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050095814A1 (en) * | 2003-11-05 | 2005-05-05 | Xu Zhu | Ultrathin form factor MEMS microphones and microspeakers |
| US7358151B2 (en) | 2004-12-21 | 2008-04-15 | Sony Corporation | Microelectromechanical system microphone fabrication including signal processing circuitry on common substrate |
| DE102005007540A1 (de) | 2005-02-18 | 2006-08-31 | Robert Bosch Gmbh | Mikromechanischer Membransensor mit Doppelmembran |
| US7439093B2 (en) | 2005-09-16 | 2008-10-21 | Dalsa Semiconductor Inc. | Method of making a MEMS device containing a cavity with isotropic etch followed by anisotropic etch |
| US8043950B2 (en) * | 2005-10-26 | 2011-10-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| DE102006002106B4 (de) * | 2006-01-17 | 2016-03-03 | Robert Bosch Gmbh | Mikromechanischer Sensor mit perforationsoptimierter Membran sowie ein geeignetes Hestellungsverfahren |
| DE102006022378A1 (de) | 2006-05-12 | 2007-11-22 | Robert Bosch Gmbh | Verfahren zur Herstellung eines mikromechanischen Bauelements und mikromechanisches Bauelement |
| KR20080005854A (ko) | 2006-07-10 | 2008-01-15 | 야마하 가부시키가이샤 | 압력 센서 및 그의 제조 방법 |
| DE102007019647A1 (de) * | 2007-04-26 | 2008-10-30 | Robert Bosch Gmbh | Verfahren zur Herstellung eines mikromechanischen Bauelements mit Auffüllschicht und Maskenschicht |
| TW200919593A (en) * | 2007-10-18 | 2009-05-01 | Asia Pacific Microsystems Inc | Elements and modules with micro caps and wafer level packaging method thereof |
| WO2009073692A1 (en) * | 2007-12-03 | 2009-06-11 | Kolo Technologies, Inc. | Packaging and connecting electrostatic transducer arrays |
| CN101874287B (zh) * | 2007-12-03 | 2012-08-29 | 科隆科技公司 | 静电换能器及阵列中的贯穿晶片互连 |
| US7795063B2 (en) * | 2007-12-31 | 2010-09-14 | Solid State System Co., Ltd. | Micro-electro-mechanical systems (MEMS) device and process for fabricating the same |
| US8258591B2 (en) * | 2008-01-16 | 2012-09-04 | Solid State System Co., Ltd. | Micro-electro-mechanical systems (MEMS) device |
| US8173471B2 (en) * | 2008-04-29 | 2012-05-08 | Solid State System Co., Ltd. | Method for fabricating micro-electro-mechanical system (MEMS) device |
| TWI380456B (en) | 2008-04-30 | 2012-12-21 | Pixart Imaging Inc | Micro-electro-mechanical device and method for making same |
| CN101580222B (zh) * | 2008-05-15 | 2011-11-16 | 原相科技股份有限公司 | 微机电元件与制作方法 |
| US8144906B2 (en) * | 2008-05-21 | 2012-03-27 | Akustica, Inc. | Wind immune microphone |
| US8345895B2 (en) | 2008-07-25 | 2013-01-01 | United Microelectronics Corp. | Diaphragm of MEMS electroacoustic transducer |
| US8280097B2 (en) * | 2008-08-21 | 2012-10-02 | United Microelectronics Corp. | Microelectromechanical system diaphragm and fabricating method thereof |
| US7951636B2 (en) * | 2008-09-22 | 2011-05-31 | Solid State System Co. Ltd. | Method for fabricating micro-electro-mechanical system (MEMS) device |
| US20100173437A1 (en) * | 2008-10-21 | 2010-07-08 | Wygant Ira O | Method of fabricating CMUTs that generate low-frequency and high-intensity ultrasound |
| TWI484594B (zh) * | 2009-10-07 | 2015-05-11 | United Microelectronics Corp | 具有微機電系統元件之積體電路及其製造方法 |
| US8445324B2 (en) * | 2009-12-16 | 2013-05-21 | Oakland University | Method of wafer-level fabrication of MEMS devices |
| US8030112B2 (en) * | 2010-01-22 | 2011-10-04 | Solid State System Co., Ltd. | Method for fabricating MEMS device |
| US8865500B2 (en) * | 2010-02-03 | 2014-10-21 | United Microelectronics Corp. | Method of fabricating a MEMS microphone with trenches serving as vent pattern |
| TWI430424B (zh) * | 2011-03-18 | 2014-03-11 | Pixart Imaging Inc | 微機電系統聲壓感測元件及其製作方法 |
| CN102752699B (zh) * | 2011-04-19 | 2014-09-17 | 原相科技股份有限公司 | 微机电系统麦克风装置及其制作方法 |
| US8643140B2 (en) | 2011-07-11 | 2014-02-04 | United Microelectronics Corp. | Suspended beam for use in MEMS device |
| US8525354B2 (en) | 2011-10-13 | 2013-09-03 | United Microelectronics Corporation | Bond pad structure and fabricating method thereof |
| WO2013097135A1 (en) * | 2011-12-29 | 2013-07-04 | Goertek Inc. | A silicon based mems microphone, a system and a package with the same |
| US9402138B2 (en) | 2012-10-12 | 2016-07-26 | Infineon Technologies Ag | MEMS device and method of manufacturing a MEMS device |
| WO2014092541A1 (en) * | 2012-12-10 | 2014-06-19 | Mimos Berhad | A method for releasing mems device |
| US8981501B2 (en) | 2013-04-25 | 2015-03-17 | United Microelectronics Corp. | Semiconductor device and method of forming the same |
| KR102126714B1 (ko) * | 2013-09-03 | 2020-06-26 | 삼성디스플레이 주식회사 | 표시 패널 및 이를 포함하는 유기 발광 표시 장치 |
| US9219185B2 (en) | 2013-12-19 | 2015-12-22 | Excelitas Technologies Singapore Pte. Ltd | CMOS integrated method for the fabrication of thermopile pixel with umbrella absorber on semiconductor substrate |
| US9373772B2 (en) * | 2014-01-15 | 2016-06-21 | Excelitas Technologies Singapore Pte. Ltd. | CMOS integrated method for the release of thermopile pixel on a substrate by using anisotropic and isotropic etching |
| CN106865485B (zh) * | 2015-12-10 | 2021-09-21 | 联华电子股份有限公司 | 微机电结构及其制作方法 |
| CN111741423B (zh) * | 2020-08-21 | 2020-11-20 | 中芯集成电路制造(绍兴)有限公司 | Mems麦克风的制造方法 |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
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| NL8303185A (nl) | 1983-09-15 | 1985-04-01 | Philips Nv | Hybried luidsprekersysteem eventueel met een of meer korrektieketens. |
| JP3172953B2 (ja) * | 1991-08-22 | 2001-06-04 | 株式会社山武 | 静電容量式圧力センサ |
| GB9205711D0 (en) | 1992-03-16 | 1992-04-29 | Lynxvale Ltd | Micromechanical sensor |
| AU6953994A (en) | 1993-06-04 | 1995-01-03 | Regents Of The University Of California, The | Microfabricated acoustic source and receiver |
| US5393647A (en) | 1993-07-16 | 1995-02-28 | Armand P. Neukermans | Method of making superhard tips for micro-probe microscopy and field emission |
| US5774252A (en) | 1994-01-07 | 1998-06-30 | Texas Instruments Incorporated | Membrane device with recessed electrodes and method of making |
| US5452268A (en) * | 1994-08-12 | 1995-09-19 | The Charles Stark Draper Laboratory, Inc. | Acoustic transducer with improved low frequency response |
| US5876187A (en) | 1995-03-09 | 1999-03-02 | University Of Washington | Micropumps with fixed valves |
| US5717631A (en) | 1995-07-21 | 1998-02-10 | Carnegie Mellon University | Microelectromechanical structure and process of making same |
| US5949892A (en) | 1995-12-07 | 1999-09-07 | Advanced Micro Devices, Inc. | Method of and apparatus for dynamically controlling operating characteristics of a microphone |
| IL116536A0 (en) | 1995-12-24 | 1996-03-31 | Harunian Dan | Direct integration of sensing mechanisms with single crystal based micro-electric-mechanics systems |
| US5751469A (en) | 1996-02-01 | 1998-05-12 | Lucent Technologies Inc. | Method and apparatus for an improved micromechanical modulator |
| US5936846A (en) * | 1997-01-16 | 1999-08-10 | Ford Global Technologies | Optimized solder joints and lifter pads for improving the solder joint life of surface mount chips |
| DE69731604D1 (de) | 1997-01-31 | 2004-12-23 | St Microelectronics Srl | Herstellungsverfahren für integrierte Halbleitervorrichtung mit einem chemoresistiven Gasmikrosensor |
| US5870482A (en) * | 1997-02-25 | 1999-02-09 | Knowles Electronics, Inc. | Miniature silicon condenser microphone |
| US5867302A (en) | 1997-08-07 | 1999-02-02 | Sandia Corporation | Bistable microelectromechanical actuator |
| US6181050B1 (en) | 1997-10-27 | 2001-01-30 | Hewlett Packard Company | Electrostatic micromotor with large in-plane force and no out-of-plane force |
| CA2340059C (en) * | 1998-08-11 | 2003-12-23 | Infineon Technologies Ag | Micromechanical sensor and method for producing same |
| US6255757B1 (en) | 1999-09-01 | 2001-07-03 | Jds Uniphase Inc. | Microactuators including a metal layer on distal portions of an arched beam |
| US6829131B1 (en) | 1999-09-13 | 2004-12-07 | Carnegie Mellon University | MEMS digital-to-acoustic transducer with error cancellation |
| US6262946B1 (en) | 1999-09-29 | 2001-07-17 | The Board Of Trustees Of The Leland Stanford Junior University | Capacitive micromachined ultrasonic transducer arrays with reduced cross-coupling |
| US6753638B2 (en) * | 2000-02-03 | 2004-06-22 | Calient Networks, Inc. | Electrostatic actuator for micromechanical systems |
| JP3873630B2 (ja) * | 2001-01-29 | 2007-01-24 | セイコーエプソン株式会社 | コンデンサマイクロホンの製造方法 |
| US6943448B2 (en) * | 2003-01-23 | 2005-09-13 | Akustica, Inc. | Multi-metal layer MEMS structure and process for making the same |
-
2003
- 2003-01-23 US US10/349,618 patent/US7049051B2/en not_active Expired - Lifetime
-
2004
- 2004-01-22 AT AT04380017T patent/ATE511320T1/de not_active IP Right Cessation
- 2004-01-22 EP EP04380017A patent/EP1441561B1/de not_active Expired - Lifetime
- 2004-01-23 JP JP2004015101A patent/JP4672984B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US20040146810A1 (en) | 2004-07-29 |
| EP1441561B1 (de) | 2011-05-25 |
| US7049051B2 (en) | 2006-05-23 |
| EP1441561A3 (de) | 2009-06-03 |
| JP4672984B2 (ja) | 2011-04-20 |
| JP2004223710A (ja) | 2004-08-12 |
| EP1441561A2 (de) | 2004-07-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |