ATE511639T1 - Plasmabearbeitungsvorrichtung mit integriertem vollwellenlängen-spektrometer für waferbearbeitung - Google Patents

Plasmabearbeitungsvorrichtung mit integriertem vollwellenlängen-spektrometer für waferbearbeitung

Info

Publication number
ATE511639T1
ATE511639T1 AT01926386T AT01926386T ATE511639T1 AT E511639 T1 ATE511639 T1 AT E511639T1 AT 01926386 T AT01926386 T AT 01926386T AT 01926386 T AT01926386 T AT 01926386T AT E511639 T1 ATE511639 T1 AT E511639T1
Authority
AT
Austria
Prior art keywords
spectrometers
computer system
full wavelength
processing device
integrated full
Prior art date
Application number
AT01926386T
Other languages
English (en)
Inventor
Ni Tuqiang
Tuan Ngo
Chung-Ho Huang
Andrew Lui
Farro Kaveh
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Application granted granted Critical
Publication of ATE511639T1 publication Critical patent/ATE511639T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J49/00—Particle spectrometers or separator tubes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/20—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by using diffraction of the radiation by the materials, e.g. for investigating crystal structure; by using scattering of the radiation by the materials, e.g. for investigating non-crystalline materials; by using reflection of the radiation by the materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H01J37/32972—Spectral analysis

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • General Physics & Mathematics (AREA)
  • Pathology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Immunology (AREA)
  • Health & Medical Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
  • Spectrometry And Color Measurement (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
AT01926386T 2000-03-30 2001-03-16 Plasmabearbeitungsvorrichtung mit integriertem vollwellenlängen-spektrometer für waferbearbeitung ATE511639T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/539,312 US6526355B1 (en) 2000-03-30 2000-03-30 Integrated full wavelength spectrometer for wafer processing
PCT/US2001/008667 WO2001075934A2 (en) 2000-03-30 2001-03-16 Integrated full wavelength spectrometer for wafer processing

Publications (1)

Publication Number Publication Date
ATE511639T1 true ATE511639T1 (de) 2011-06-15

Family

ID=24150690

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01926386T ATE511639T1 (de) 2000-03-30 2001-03-16 Plasmabearbeitungsvorrichtung mit integriertem vollwellenlängen-spektrometer für waferbearbeitung

Country Status (8)

Country Link
US (1) US6526355B1 (de)
EP (1) EP1269165B1 (de)
KR (1) KR100808431B1 (de)
CN (1) CN1214334C (de)
AT (1) ATE511639T1 (de)
AU (1) AU2001252927A1 (de)
TW (1) TW591684B (de)
WO (1) WO2001075934A2 (de)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7672747B2 (en) 2000-03-30 2010-03-02 Lam Research Corporation Recipe-and-component control module and methods thereof
EP1205962A1 (de) * 2000-11-10 2002-05-15 Jobin Yvon S.A. Verfahren zur Plasmazustandsüberwachung und -kontrolle in einem Plasmaspektrometer sowie Spektrometer zur Durchführung dieses Verfahrens
JP4024053B2 (ja) * 2002-02-08 2007-12-19 キヤノンアネルバ株式会社 高周波プラズマ処理方法及び高周波プラズマ処理装置
US20070221634A1 (en) * 2004-03-31 2007-09-27 Gbc Scientific Equipment Pty Ltd Plasma Torch Spectrometer
US10687166B2 (en) 2004-09-30 2020-06-16 Uber Technologies, Inc. Obtaining user assistance
US10514816B2 (en) 2004-12-01 2019-12-24 Uber Technologies, Inc. Enhanced user assistance
US20060089754A1 (en) * 2004-10-27 2006-04-27 Andrew Mortenson An installed Vehicle Personal Computing (VPC) system with touch interaction, voice interaction or sensor interaction(s) that provides access to multiple information sources and software applications such as internet connected data applications, dynamic traffic-aware navigational routing, vehicle tracking, emergency accident dispatching, business applications, office applications, music and video player(s), personal info portal, vehicle monitoring, alarm and camera security and recording.
TWM282314U (en) * 2004-10-29 2005-12-01 Instr Technology Res Ct Rotational hoister of non-coaxial transmission substrate applied in the epitaxy film-coating machine to carry out high-temperature growth
FR2880470B1 (fr) 2004-12-31 2007-04-20 Cit Alcatel Dispositif et procede pour le controle de la profondeur de gravure lors de la gravure alternee par plasma de substrats semi-conducteurs
US8358976B2 (en) 2006-03-24 2013-01-22 The Invention Science Fund I, Llc Wireless device with an aggregate user interface for controlling other devices
US7565220B2 (en) * 2006-09-28 2009-07-21 Lam Research Corporation Targeted data collection architecture
US7814046B2 (en) * 2006-09-29 2010-10-12 Lam Research Corporation Dynamic component-tracking system and methods therefor
US9299541B2 (en) * 2012-03-30 2016-03-29 Lam Research Corporation Methods and apparatuses for effectively reducing gas residence time in a plasma processing chamber
US11905983B2 (en) 2020-01-23 2024-02-20 Deep Science, Llc Systems and methods for active control of surface drag using electrodes
US12065236B2 (en) 2020-01-23 2024-08-20 Enterprise Science Fund, Llc Systems and methods for active control of surface drag using intermittent or variable actuation
WO2022177960A1 (en) 2021-02-17 2022-08-25 Deep Science, Llc In-plane transverse momentum injection to disrupt large-scale eddies in a turbulent boundary layer

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GB2020009B (en) 1978-04-08 1982-12-01 Bodenseewerk Perkin Elmer Co Apparatus for determining the concentration of components of a sample
US4365303A (en) 1980-02-07 1982-12-21 The Perkin-Elmer Corporation Method and apparatus for determining the nature of an unknown chemical substance
US4490806A (en) * 1982-06-04 1984-12-25 Research Corporation High repetition rate transient recorder with automatic integration
KR930019861A (ko) * 1991-12-12 1993-10-19 완다 케이. 덴슨-로우 조밀상 기체를 이용한 코팅 방법
US5347460A (en) 1992-08-25 1994-09-13 International Business Machines Corporation Method and system employing optical emission spectroscopy for monitoring and controlling semiconductor fabrication
US5664066A (en) * 1992-11-09 1997-09-02 The United States Of America As Represented By The United States Department Of Energy Intelligent system for automatic feature detection and selection or identification
US5450205A (en) * 1993-05-28 1995-09-12 Massachusetts Institute Of Technology Apparatus and method for real-time measurement of thin film layer thickness and changes thereof
US5546322A (en) * 1994-04-12 1996-08-13 International Business Machines Corporation Method and system for analyzing plasma data
US5846373A (en) 1996-06-28 1998-12-08 Lam Research Corporation Method for monitoring process endpoints in a plasma chamber and a process monitoring arrangement in a plasma chamber
US5715051A (en) * 1996-10-21 1998-02-03 Medar, Inc. Method and system for detecting defects in optically transmissive coatings formed on optical media substrates
US5757483A (en) * 1997-08-06 1998-05-26 Stellarnet, Inc. Dual beam optical spectrograph
US6091749A (en) * 1998-02-26 2000-07-18 Trw Inc. Laser system controller
US6157867A (en) 1998-02-27 2000-12-05 Taiwan Semiconductor Manufacturing Company Method and system for on-line monitoring plasma chamber condition by comparing intensity of certain wavelength
US6243738B1 (en) * 1998-04-06 2001-06-05 National Instruments Corporation Data acquisition system which includes remote access to data acquisition devices
US6090302A (en) 1998-04-23 2000-07-18 Sandia Method and apparatus for monitoring plasma processing operations
US6077386A (en) 1998-04-23 2000-06-20 Sandia Corporation Method and apparatus for monitoring plasma processing operations
US6265831B1 (en) * 1999-03-31 2001-07-24 Lam Research Corporation Plasma processing method and apparatus with control of rf bias

Also Published As

Publication number Publication date
AU2001252927A1 (en) 2001-10-15
KR100808431B1 (ko) 2008-02-29
TW591684B (en) 2004-06-11
WO2001075934A3 (en) 2002-05-02
CN1214334C (zh) 2005-08-10
KR20020087447A (ko) 2002-11-22
EP1269165B1 (de) 2011-06-01
WO2001075934A2 (en) 2001-10-11
CN1447915A (zh) 2003-10-08
EP1269165A2 (de) 2003-01-02
US6526355B1 (en) 2003-02-25

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