ATE511938T1 - Drahtverbindungs-kapillarwerkzeug mit mehreren äusseren absätzen - Google Patents

Drahtverbindungs-kapillarwerkzeug mit mehreren äusseren absätzen

Info

Publication number
ATE511938T1
ATE511938T1 AT07794234T AT07794234T ATE511938T1 AT E511938 T1 ATE511938 T1 AT E511938T1 AT 07794234 T AT07794234 T AT 07794234T AT 07794234 T AT07794234 T AT 07794234T AT E511938 T1 ATE511938 T1 AT E511938T1
Authority
AT
Austria
Prior art keywords
cylindrical portion
wire connection
multiple outer
capillary tool
tip
Prior art date
Application number
AT07794234T
Other languages
English (en)
Inventor
Jaime Castaneda
Kay Soon Goh
Original Assignee
Small Prec Tools Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Small Prec Tools Inc filed Critical Small Prec Tools Inc
Application granted granted Critical
Publication of ATE511938T1 publication Critical patent/ATE511938T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/923—Bond pads having multiple stacked layers
    • H10W72/9232—Bond pads having multiple stacked layers with additional elements interposed between layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
AT07794234T 2007-07-24 2007-07-24 Drahtverbindungs-kapillarwerkzeug mit mehreren äusseren absätzen ATE511938T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/SG2007/000220 WO2009014494A1 (en) 2007-07-24 2007-07-24 Wire bonding capillary tool having multiple outer steps

Publications (1)

Publication Number Publication Date
ATE511938T1 true ATE511938T1 (de) 2011-06-15

Family

ID=39268002

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07794234T ATE511938T1 (de) 2007-07-24 2007-07-24 Drahtverbindungs-kapillarwerkzeug mit mehreren äusseren absätzen

Country Status (5)

Country Link
EP (1) EP2167269B1 (de)
KR (1) KR101221928B1 (de)
CN (1) CN101730605A (de)
AT (1) ATE511938T1 (de)
WO (1) WO2009014494A1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101295948B1 (ko) * 2011-11-30 2013-08-13 김선희 초음파 용착기의 공구혼
TWI511826B (zh) * 2013-01-25 2015-12-11 Ｔｏｔｏ股份有限公司 Welding needle
CN103909185B (zh) * 2014-03-28 2015-06-10 木林森股份有限公司 一种铜线焊接设备及焊接铜线的工艺
US9931709B2 (en) 2016-01-26 2018-04-03 Orthodyne Electronics Corporation Wedge bonding tools, wedge bonding systems, and related methods
CN109860067B (zh) * 2019-02-03 2020-12-08 潮州三环（集团）股份有限公司 一种焊接陶瓷劈刀

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2727970B2 (ja) * 1993-10-07 1998-03-18 日本電気株式会社 ボンディングツール
GB2285943B (en) * 1994-01-28 1996-09-11 Hewlett Packard Co Bonding tool for electronic device
JP3086158B2 (ja) * 1995-07-26 2000-09-11 株式会社日立製作所 超音波ボンディング方法
US6497356B2 (en) * 2000-04-28 2002-12-24 Kulicke & Soffa Investments, Inc. Controlled attenuation capillary with planar surface
KR20030066348A (ko) * 2002-02-01 2003-08-09 에섹 트레이딩 에스에이 와이어본더의 보정을 위한 방법
JP2004221257A (ja) 2003-01-14 2004-08-05 Seiko Epson Corp ワイヤボンディング方法及びワイヤボンディング装置
US7320425B2 (en) * 2004-05-12 2008-01-22 Kulicke And Soffa Industries, Inc. Low-profile capillary for wire bonding
US20050275073A1 (en) * 2004-06-09 2005-12-15 Texas Instruments Incorporated Method and system for improved wire bonding

Also Published As

Publication number Publication date
EP2167269B1 (de) 2011-06-08
EP2167269A1 (de) 2010-03-31
KR20100044733A (ko) 2010-04-30
CN101730605A (zh) 2010-06-09
KR101221928B1 (ko) 2013-01-14
WO2009014494A1 (en) 2009-01-29

Similar Documents

Publication Publication Date Title
EP4427687A3 (de) Verfahren zur befestigung eines netzes an einem beschichteten schlaufenelement einer chirurgischen schlingenvorrichtung
EP3150142A3 (de) Implantierbarer zusatz mit gebundenen schichten
EA201100842A1 (ru) Устройство для всасывания порошкового или гранулированного материала и капсула для этого
MY171823A (en) Screwdriving tool and tool holder for such a screwdriving tool
RU2015129100A (ru) Соединительное средство для системы охлаждения в металлорежущем инструменте и резец
WO2009058705A3 (en) Elongate medical device with a shapeable tip
CA3011748A1 (en) Ultrasonic tip assembly
GB2471823A (en) Matrix bit bodies with multiple matrix materials
EP3109908A3 (de) Lichtemittierende vorrichtung und herstellungsverfahren dafür
WO2012037248A3 (en) Casing friendly, shearable hardbands and systems and methods for shearing same
ATE552428T1 (de) Aus einer stranganordnung bestehender dübel
CL2008002446A1 (es) Metodo para insertar simultaneamente un cable y otro elemento en un conducto alargado, que comprende los pasos de introducir el cable en un extremo del conducto en sentido descendente respecto del extremo introducir el elemento y conectarlo al cable; y sistema para insertar simultaneamente un cable y otro elemento en un conducto alargado.
EA201290896A1 (ru) Узел уплотнения и способ изготовления узла уплотнения
RU2014135035A (ru) Устройство электрода для плазменных резаков
CR20150564A (es) Punta de material reducido para catéter y método de formación de la misma
DE60332342D1 (de) Führungsdraht mit gekapselter markierung
SE0800927L (sv) Borrstång, borrkrona och borrverktyg
JP2014004629A5 (de)
PE20131208A1 (es) Miembro de higiene interdental y metodo de fabricacion del mismo
DE60121520D1 (de) Effiziente energieübertragende kapillare
DE502007002882D1 (de) Mehrkanalelektrode für cochlea-implantate mit einer mehrzahl von über die länge der elektrode verteilten kontakten
MY144821A (en) Wire bonding capillary tool having multiple outer steps
CL2008000938A1 (es) Inserto de boquilla para lanceta refractaria para alimentar un alambre con aditivo debajo de la superficie de metal fundido,que comprende una entrada,una salida,y un pasaje para el alambr con aditivo,donde el inserto esta hecho de un material que comprende oxido de xirconio estabilizado y grafito;y lanceta.
EP2541626A4 (de) Nitrid-halbleiter-lichtemissionselement und verfahren zu seiner herstellung
ATE399926T1 (de) Bohrspitze

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties