ATE514184T1 - Verfahren zur herstellung eines elektrischen anschlusses auf der basis von nanoröhrchen sowie mit luftisolation - Google Patents

Verfahren zur herstellung eines elektrischen anschlusses auf der basis von nanoröhrchen sowie mit luftisolation

Info

Publication number
ATE514184T1
ATE514184T1 AT08354046T AT08354046T ATE514184T1 AT E514184 T1 ATE514184 T1 AT E514184T1 AT 08354046 T AT08354046 T AT 08354046T AT 08354046 T AT08354046 T AT 08354046T AT E514184 T1 ATE514184 T1 AT E514184T1
Authority
AT
Austria
Prior art keywords
layer
nanotube
producing
electrical connection
connection based
Prior art date
Application number
AT08354046T
Other languages
English (en)
Inventor
Frederic-Xavier Gaillard
Jean-Christophe Coiffic
Original Assignee
Commissariat Energie Atomique
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat Energie Atomique filed Critical Commissariat Energie Atomique
Application granted granted Critical
Publication of ATE514184T1 publication Critical patent/ATE514184T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/071—Manufacture or treatment of dielectric parts thereof
    • H10W20/072—Manufacture or treatment of dielectric parts thereof of dielectric parts comprising air gaps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/42—Vias, e.g. via plugs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/44—Conductive materials thereof
    • H10W20/4462—Carbon or carbon-containing materials, e.g. graphene
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/45—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their insulating parts
    • H10W20/46—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their insulating parts comprising air gaps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/0554—Manufacture or treatment of conductive parts of the interconnections of nanotubes or nanowires
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49162—Manufacturing circuit on or in base by using wire as conductive path

Landscapes

  • Carbon And Carbon Compounds (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Chemical Or Physical Treatment Of Fibers (AREA)
  • Insulated Conductors (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Micro-Capsules (AREA)
AT08354046T 2007-07-17 2008-06-25 Verfahren zur herstellung eines elektrischen anschlusses auf der basis von nanoröhrchen sowie mit luftisolation ATE514184T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0705153A FR2919111B1 (fr) 2007-07-17 2007-07-17 Procede de fabrication d'une connexion electrique a base de nanotubes et ayant des cavites d'air

Publications (1)

Publication Number Publication Date
ATE514184T1 true ATE514184T1 (de) 2011-07-15

Family

ID=39099618

Family Applications (1)

Application Number Title Priority Date Filing Date
AT08354046T ATE514184T1 (de) 2007-07-17 2008-06-25 Verfahren zur herstellung eines elektrischen anschlusses auf der basis von nanoröhrchen sowie mit luftisolation

Country Status (4)

Country Link
US (1) US8011091B2 (de)
EP (1) EP2017885B1 (de)
AT (1) ATE514184T1 (de)
FR (1) FR2919111B1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011233714A (ja) * 2010-04-27 2011-11-17 Canon Inc 半導体素子
US10278920B1 (en) * 2014-05-12 2019-05-07 Gholam A. Peyman Drug delivery implant and a method using the same
US10177029B1 (en) * 2017-10-23 2019-01-08 Globalfoundries Inc. Integration of air gaps with back-end-of-line structures

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6297063B1 (en) * 1999-10-25 2001-10-02 Agere Systems Guardian Corp. In-situ nano-interconnected circuit devices and method for making the same
DE10006964C2 (de) 2000-02-16 2002-01-31 Infineon Technologies Ag Elektronisches Bauelement mit einer leitenden Verbindung zwischen zwei leitenden Schichten und Verfahren zum Herstellen eines elektronischen Bauelements
US20030211724A1 (en) * 2002-05-10 2003-11-13 Texas Instruments Incorporated Providing electrical conductivity between an active region and a conductive layer in a semiconductor device using carbon nanotubes
FR2851373B1 (fr) 2003-02-18 2006-01-13 St Microelectronics Sa Procede de fabrication d'un circuit electronique integre incorporant des cavites
EP1521301A1 (de) * 2003-09-30 2005-04-06 Interuniversitaire Microelectronica Centrum vzw ( IMEC) Herstellung von luftgefüllten Lücken um Verbindungsleitung herum
JP4735314B2 (ja) * 2006-02-14 2011-07-27 ソニー株式会社 半導体装置およびその製造方法
FR2916303B1 (fr) * 2007-05-15 2009-07-31 Commissariat Energie Atomique Procede de fabrication de cavites d'air utilisant des nanotubes

Also Published As

Publication number Publication date
US8011091B2 (en) 2011-09-06
FR2919111A1 (fr) 2009-01-23
FR2919111B1 (fr) 2009-10-09
EP2017885B1 (de) 2011-06-22
US20090019690A1 (en) 2009-01-22
EP2017885A3 (de) 2010-01-20
EP2017885A2 (de) 2009-01-21

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