ATE514194T1 - System und verfahren zum herstellen eines solarzellen-arrays - Google Patents

System und verfahren zum herstellen eines solarzellen-arrays

Info

Publication number
ATE514194T1
ATE514194T1 AT06809889T AT06809889T ATE514194T1 AT E514194 T1 ATE514194 T1 AT E514194T1 AT 06809889 T AT06809889 T AT 06809889T AT 06809889 T AT06809889 T AT 06809889T AT E514194 T1 ATE514194 T1 AT E514194T1
Authority
AT
Austria
Prior art keywords
substantially large
contact surface
soldering material
terminal
area contact
Prior art date
Application number
AT06809889T
Other languages
English (en)
Inventor
Moshe Halfon
Jonathan Leibovitz
Shaya Ruzansky
Mor Shalom
Abraham Steinman
Original Assignee
Israel Aerospace Ind Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Israel Aerospace Ind Ltd filed Critical Israel Aerospace Ind Ltd
Application granted granted Critical
Publication of ATE514194T1 publication Critical patent/ATE514194T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3485—Application of solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/90—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers
    • H10F19/902—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers for series or parallel connection of photovoltaic cells
    • H10F19/908—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers for series or parallel connection of photovoltaic cells for back-contact photovoltaic cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H10F71/137—Batch treatment of the devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0545—Pattern for applying drops or paste; Applying a pattern made of drops or paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1178—Means for venting or for letting gases escape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating processes for reflow soldering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Photovoltaic Devices (AREA)
  • Die Bonding (AREA)
AT06809889T 2005-11-25 2006-11-21 System und verfahren zum herstellen eines solarzellen-arrays ATE514194T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US73986805P 2005-11-25 2005-11-25
PCT/IL2006/001340 WO2007060657A1 (en) 2005-11-25 2006-11-21 System and method for producing a solar cell array

Publications (1)

Publication Number Publication Date
ATE514194T1 true ATE514194T1 (de) 2011-07-15

Family

ID=37833576

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06809889T ATE514194T1 (de) 2005-11-25 2006-11-21 System und verfahren zum herstellen eines solarzellen-arrays

Country Status (6)

Country Link
US (1) US20090242023A1 (de)
EP (1) EP2005487B1 (de)
KR (1) KR101367773B1 (de)
AT (1) ATE514194T1 (de)
ES (1) ES2366922T3 (de)
WO (1) WO2007060657A1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101055558B1 (ko) * 2010-01-11 2011-08-08 삼성전기주식회사 방열기판 및 그 제조방법
EP2362432B1 (de) * 2010-02-25 2017-06-07 Saint-Augustin Canada Electric Inc. Solarzellenanordnung
EP2362431B1 (de) * 2010-02-25 2018-01-10 Saint-Augustin Canada Electric Inc. Solarzellenanordnung
JP2016528738A (ja) * 2013-08-21 2016-09-15 ジーティーエイティー・コーポレーション 金属片を太陽電池へ連結するためのアクティブはんだの使用
AT516750B1 (de) 2014-12-18 2016-08-15 Zizala Lichtsysteme Gmbh Verfahren zur Voidreduktion in Lötstellen
EP3297410A1 (de) * 2016-09-19 2018-03-21 ZF Friedrichshafen AG Lötschablone und verfahren zur herstellung einer leitrplattenanordnung
KR102704418B1 (ko) * 2022-08-31 2024-09-06 한화솔루션 주식회사 태양전지 모듈 제조용 태빙 장치

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4836861A (en) * 1987-04-24 1989-06-06 Tactical Fabs, Inc. Solar cell and cell mount
JP2795788B2 (ja) * 1993-02-18 1998-09-10 シャープ株式会社 半導体チップの実装方法
US5410449A (en) * 1993-05-24 1995-04-25 Delco Electronics Corp. Heatsink conductor solder pad
US5460659A (en) * 1993-12-10 1995-10-24 Spectrolab, Inc. Concentrating photovoltaic module and fabrication method
JP3054056B2 (ja) * 1995-04-24 2000-06-19 株式会社日立製作所 はんだ付け方法
EP0831533A1 (de) * 1996-09-16 1998-03-25 Rockwell International Corporation Verbundstruktur in einer Bildebene-Matrix zum Kompensieren der Verformung
EP1025587A4 (de) * 1997-07-21 2000-10-04 Aguila Technologies Inc Halbleiter-flipchippackung und herstellungsverfahren dafür
JP3965795B2 (ja) * 1998-08-24 2007-08-29 株式会社デンソー 電子部品の半田付け方法
US6048656A (en) * 1999-05-11 2000-04-11 Micron Technology, Inc. Void-free underfill of surface mounted chips
EP1182709A1 (de) * 2000-08-14 2002-02-27 IPU, Instituttet For Produktudvikling Verfahren zur Abscheidung von Metallkontakten auf einer Solarzelle mit vergrabenem Gitter und so hergestellte Solarzelle
US6395972B1 (en) * 2000-11-09 2002-05-28 Trw Inc. Method of solar cell external interconnection and solar cell panel made thereby
US6476314B2 (en) * 2001-03-20 2002-11-05 The Boeing Company Solar tile and associated method for fabricating the same
US6803514B2 (en) * 2001-03-23 2004-10-12 Canon Kabushiki Kaisha Mounting structure and mounting method of a photovoltaic element, mounting substrate for mounting a semiconductor element thereon and method for mounting a semiconductor element on said mounting substrate
JP2003234433A (ja) * 2001-10-01 2003-08-22 Matsushita Electric Ind Co Ltd 半導体装置、半導体装置の実装方法、ならびに実装体およびその製造方法
US6821878B2 (en) * 2003-02-27 2004-11-23 Freescale Semiconductor, Inc. Area-array device assembly with pre-applied underfill layers on printed wiring board

Also Published As

Publication number Publication date
EP2005487B1 (de) 2011-06-22
KR101367773B1 (ko) 2014-02-27
US20090242023A1 (en) 2009-10-01
KR20080100334A (ko) 2008-11-17
EP2005487A1 (de) 2008-12-24
ES2366922T3 (es) 2011-10-26
WO2007060657A1 (en) 2007-05-31

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties