ATE516519T1 - Lichtempfindliche harzzusammensetzung - Google Patents

Lichtempfindliche harzzusammensetzung

Info

Publication number
ATE516519T1
ATE516519T1 AT08738789T AT08738789T ATE516519T1 AT E516519 T1 ATE516519 T1 AT E516519T1 AT 08738789 T AT08738789 T AT 08738789T AT 08738789 T AT08738789 T AT 08738789T AT E516519 T1 ATE516519 T1 AT E516519T1
Authority
AT
Austria
Prior art keywords
resin composition
photosensitive resin
photosensitive
cured
relief pattern
Prior art date
Application number
AT08738789T
Other languages
English (en)
Inventor
Tomohiro Yorisue
Original Assignee
Asahi Kasei E Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei E Materials Corp filed Critical Asahi Kasei E Materials Corp
Application granted granted Critical
Publication of ATE516519T1 publication Critical patent/ATE516519T1/de

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/075Silicon-containing compounds
    • G03F7/0757Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14Polymers provided for in subclass C08G
    • C08F290/148Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • C08F299/08Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/20Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/58Metal-containing linkages
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/14Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041Photolithographic processes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70Siloxanes defined by use of the MDTQ nomenclature
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Silicon Polymers (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
AT08738789T 2007-04-04 2008-03-25 Lichtempfindliche harzzusammensetzung ATE516519T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007098088 2007-04-04
PCT/JP2008/055480 WO2008123210A1 (ja) 2007-04-04 2008-03-25 感光性樹脂組成物

Publications (1)

Publication Number Publication Date
ATE516519T1 true ATE516519T1 (de) 2011-07-15

Family

ID=39830705

Family Applications (1)

Application Number Title Priority Date Filing Date
AT08738789T ATE516519T1 (de) 2007-04-04 2008-03-25 Lichtempfindliche harzzusammensetzung

Country Status (8)

Country Link
US (1) US8557498B2 (de)
EP (1) EP2133744B1 (de)
JP (1) JP5144646B2 (de)
KR (1) KR101121936B1 (de)
CN (1) CN101646978B (de)
AT (1) ATE516519T1 (de)
TW (1) TW200905400A (de)
WO (1) WO2008123210A1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5525821B2 (ja) * 2007-12-14 2014-06-18 旭化成イーマテリアルズ株式会社 感光性樹脂組成物
JP5576622B2 (ja) * 2008-07-01 2014-08-20 旭化成イーマテリアルズ株式会社 感光性樹脂組成物
JP5607898B2 (ja) * 2008-07-01 2014-10-15 旭化成イーマテリアルズ株式会社 感光性樹脂組成物
JP5386314B2 (ja) * 2009-01-13 2014-01-15 コリア アドバンスト インスティテュート オブ サイエンス アンド テクノロジー 透明複合体組成物
JP5636869B2 (ja) * 2010-10-20 2014-12-10 Jsr株式会社 感放射線性組成物、硬化膜、及びそれらの形成方法
KR101822042B1 (ko) * 2011-01-21 2018-01-25 프라운호퍼-게젤샤프트 츄어 푀르더룽 데어 안게반텐 포르슝에.파우. 중합가능한 조성물, 이에 의해 수득된 경화물, 및 그 물질의 용도
KR102232349B1 (ko) 2013-05-31 2021-03-26 롬엔드하스전자재료코리아유한회사 고내열성 네거티브형 감광성 수지 조성물 및 이로부터 제조된 경화막
KR102396005B1 (ko) * 2013-10-21 2022-05-10 닛산 가가쿠 가부시키가이샤 광도파로의 제조방법
JP6603115B2 (ja) * 2015-11-27 2019-11-06 信越化学工業株式会社 ケイ素含有縮合物、ケイ素含有レジスト下層膜形成用組成物、及びパターン形成方法
EP3243845A1 (de) * 2016-05-13 2017-11-15 Ricoh Company, Ltd. Mit aktiver strahlung härtbare zusammensetzung, gehärtetes produkt, zusammensetzungs-lagerbehälter, vorrichtung zur erzeugung zwei- oder dreidimensionaler bilder, vorrichtung und verfahren zur erzeugung zwei- oder dreidimensionaler bilder
CN110221731B (zh) * 2018-03-02 2023-03-28 宸鸿光电科技股份有限公司 触控面板的直接图案化方法及其触控面板
KR20250001148A (ko) 2023-06-28 2025-01-06 주식회사 창발켐텍 새로운 글리시딜옥시프로필 유기 실록산 공중합체 및 이의 제조방법

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6167263A (ja) * 1984-09-10 1986-04-07 Semiconductor Energy Lab Co Ltd 半導体装置作製方法
DE59107840D1 (de) * 1990-11-21 1996-06-27 Ciba Geigy Ag Silylierte Acylphosphinoxide
JPH04198270A (ja) * 1990-11-27 1992-07-17 Toshiba Silicone Co Ltd 光硬化型シリコーン組成物及びその接着剤組成物
JPH05202146A (ja) 1991-12-27 1993-08-10 I C I Japan Kk 光硬化性樹脂組成物
US5861235A (en) * 1996-06-26 1999-01-19 Dow Corning Asia, Ltd. Ultraviolet-curable composition and method for patterning the cured product therefrom
JPH1083080A (ja) 1996-06-26 1998-03-31 Dow Corning Asia Kk 紫外線硬化性組成物およびこれを用いた硬化物パターンの形成方法
JPH1010741A (ja) * 1996-06-27 1998-01-16 Dow Corning Asia Kk 紫外線硬化性ポリシロキサン組成物およびこれを用いた硬化物パターンの製造方法
CN1142217C (zh) * 1998-12-16 2004-03-17 旭化成株式会社 具有改进的熔体流动性的阻燃聚碳酸酯树脂组合物
DE19932629A1 (de) * 1999-07-13 2001-01-18 Fraunhofer Ges Forschung Organisch modifizierte, lagerstabile, UV-härtbare, NIR-durchlässige und in Schichtdicken von 1 bis 150 mum fotostrukturierbare Kieselsäurepolykondensate, deren Herstellung und deren Verwendung
WO2002083764A1 (en) * 2001-04-09 2002-10-24 Sekisui Chemical Co., Ltd. Photoreactive composition
US6627672B1 (en) * 2001-05-16 2003-09-30 Henkel Loctite Corporation UV/moisture dual cure silicone potting compound with improved depth of cure
DE10148894A1 (de) * 2001-10-04 2003-04-30 Fraunhofer Ges Forschung Photochemisch und/oder thermisch strukturierbare Harze auf Silanbasis, einstufiges Verfahren zu deren Herstellung, dabei einzetzbare Ausgangsverbindungen und Herstellungsverfahren für diese
KR100614976B1 (ko) * 2004-04-12 2006-08-25 한국과학기술원 광소자 또는 디스플레이에 이용되는 무기/유기혼성올리고머, 나노혼성고분자 및 그 제조방법
JP4517229B2 (ja) 2004-08-03 2010-08-04 ナガセケムテックス株式会社 シルセスキオキサン含有化合物及びその製造方法
US20090029287A1 (en) * 2006-01-24 2009-01-29 Asahi Kasei Emd Corporation Photosensitive resin composition
JP4912058B2 (ja) * 2006-06-29 2012-04-04 旭化成イーマテリアルズ株式会社 ハイブリッド感光性樹脂組成物

Also Published As

Publication number Publication date
TWI375125B (de) 2012-10-21
CN101646978A (zh) 2010-02-10
KR101121936B1 (ko) 2012-03-09
EP2133744A1 (de) 2009-12-16
JP5144646B2 (ja) 2013-02-13
US8557498B2 (en) 2013-10-15
US20100104827A1 (en) 2010-04-29
EP2133744A4 (de) 2010-06-16
EP2133744B1 (de) 2011-07-13
KR20100009536A (ko) 2010-01-27
CN101646978B (zh) 2011-11-02
JPWO2008123210A1 (ja) 2010-07-15
TW200905400A (en) 2009-02-01
WO2008123210A1 (ja) 2008-10-16

Similar Documents

Publication Publication Date Title
ATE516519T1 (de) Lichtempfindliche harzzusammensetzung
JP2014066711A5 (de)
BRPI0917927A2 (pt) composição adesiva fotossensível e um filme adesivo, folha adesiva, padrão de adesivo, wafer semicondutor com camada adesiva e dispositivo semicondutor que utiliza a composição adesiva fotossensível
TW200605338A (en) Manufacturing method of semiconductor wafer having lid part and manufacturing method of semiconductor device
BRPI0917383A2 (pt) composicao adesiva fotossensivel, adesivo em pelicula fotossensevel, padrao adesivo, wafer semicondutor com adesivo, dispositivo semicondutor e componente eletronico
WO2008149625A1 (ja) 感光性接着剤組成物、フィルム状接着剤、接着シート、接着剤パターンの形成方法、接着剤層付半導体ウェハ、半導体装置、及び、半導体装置の製造方法
TW200634947A (en) Cavity structure for semiconductor structure
MY142524A (en) Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor device
EP4006073A4 (de) Negative lichtempfindliche harzzusammensetzung, herstellungsverfahren für polyimid, herstellungsverfahren für ein gehärtetes reliefmuster und halbleiterbauelement
SG11201808375SA (en) Method for manufacturing semiconductor device
TW200710580A (en) Resist underlayer coating forming composition for forming photocrosslinking curable resist underlayer coating
EP2154205A4 (de) Harzzusammensetzung, harzdistanzfolie und halbleiterbauelement
EP2357671A4 (de) Siliciumcarbid-halbleiterbauelement und herstellungsverfahren dafür
MY199471A (en) Photosensitive resin composition
WO2008123224A1 (ja) 感光性樹脂組成物
EP4036144A4 (de) Harzzusammensetzung, film aus der harzzusammensetzung, gehärteter film, hohle struktur damit und halbleiterbauelement
PH12018502073A1 (en) Method for manufacturing semiconductor device
WO2013012587A3 (en) Semiconductor package resin composition and usage method thereof
EP2715451A4 (de) Strukturformungsverfahren, gegen aktinische strahlung empfindliche oder strahlungsempfindliche harzzusammensetzung, lackschicht, verfahren zur herstellung einer elektronischen vorrichtung und elektronische vorrichtung
EP2864839A4 (de) Strukturformungsverfahren, gegenüber aktinischen strahlen oder strahlung empfindliche harzzusammensetzung, fotolackschicht, verfahren zur herstellung einer elektronischen vorrichtung und elektronische vorrichtung
TW200801816A (en) Photosensitive resin composition
EP3978544C0 (de) Lichtempfindliche harzzusammensetzung, lichtempfindliche harzfolie, leiterplatte, halbleitergehäuse und verfahren zur herstellung einer leiterplatte
KR102207286B9 (ko) 스피로피란 구조를 포함하는 고불소화 고분자 포토레지스트 및 이를 이용한 유기전자소자의 제조방법
EP1953181A4 (de) Harzzusammensetzung, lack, harzfilm und halbleitervorrichtung
EP4317287A4 (de) Negative lichtempfindliche harzzusammensetzung, gehärtetes produkt, laminat, verfahren zur herstellung des gehärteten produkts und halbleiterbauelement

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties