ATE516674T1 - Mikrophonbauelement und seine erstellungsmethode - Google Patents

Mikrophonbauelement und seine erstellungsmethode

Info

Publication number
ATE516674T1
ATE516674T1 AT04762878T AT04762878T ATE516674T1 AT E516674 T1 ATE516674 T1 AT E516674T1 AT 04762878 T AT04762878 T AT 04762878T AT 04762878 T AT04762878 T AT 04762878T AT E516674 T1 ATE516674 T1 AT E516674T1
Authority
AT
Austria
Prior art keywords
microphone component
microphone
creation method
elements
piezoelectric transflexural
Prior art date
Application number
AT04762878T
Other languages
English (en)
Inventor
Bjorn Andersen
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Application granted granted Critical
Publication of ATE516674T1 publication Critical patent/ATE516674T1/de

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00—Piezoelectric transducers; Electrostrictive transducers
    • H04R17/02—Microphones
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49005—Acoustic transducer

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
AT04762878T 2003-09-29 2004-09-29 Mikrophonbauelement und seine erstellungsmethode ATE516674T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DKPA200301412 2003-09-29
PCT/DK2004/000658 WO2005032212A1 (en) 2003-09-29 2004-09-29 A microphone component and a method for its manufacture

Publications (1)

Publication Number Publication Date
ATE516674T1 true ATE516674T1 (de) 2011-07-15

Family

ID=34384506

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04762878T ATE516674T1 (de) 2003-09-29 2004-09-29 Mikrophonbauelement und seine erstellungsmethode

Country Status (7)

Country Link
US (1) US8369544B2 (de)
EP (1) EP1673963B1 (de)
JP (1) JP4851331B2 (de)
KR (1) KR101127711B1 (de)
CN (1) CN1860823B (de)
AT (1) ATE516674T1 (de)
WO (1) WO2005032212A1 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101652101B (zh) 2007-03-23 2012-08-01 3M创新有限公司 采用多个传感器信号特征检测的用于医学感测装置的功率管理
US20090030285A1 (en) * 2007-07-25 2009-01-29 Andersen Bjorn K Monitoring of use status and automatic power management in medical devices
US8145242B2 (en) * 2007-08-31 2012-03-27 At&T Intellectual Property I, L.P. Determining geographic zone
US8379888B2 (en) * 2008-01-18 2013-02-19 National Taiwan University Flexible piezoelectric sound-generating devices
KR100963296B1 (ko) * 2008-07-11 2010-06-11 주식회사 비에스이 가변 지향성 마이크로폰 조립체 및 그 제조방법
DE102010005654A1 (de) * 2010-01-19 2011-07-21 E.G.O. Elektro-Gerätebau GmbH, 75038 Signalgebeeinrichtung mit einem elektrischen akustischen Signalgeber
US9516426B2 (en) 2011-09-30 2016-12-06 Clean Energy Labs, Llc Electrostatic membrane pump/transducer and methods to make and use same
WO2013049794A1 (en) * 2011-09-30 2013-04-04 Clean Energy Labs, Llc Electrically conductive membrane transducer and methods to make and use same
KR101293056B1 (ko) * 2011-12-05 2013-08-05 주식회사 비에스이 이어셋 기능을 갖는 마이크로폰 조립체 및 그 제조방법
WO2014045645A1 (ja) * 2012-09-21 2014-03-27 京セラ株式会社 音響発生器、音響発生装置及び電子機器
US10306352B2 (en) * 2013-09-27 2019-05-28 3M Innovative Properties Company Microphone having closed cell foam body
CN106415228B (zh) * 2014-03-27 2019-11-12 西铁城精密器件株式会社 压力检测装置
GB2539631A (en) * 2015-04-09 2016-12-28 Continental automotive systems inc Symmetrical piezoresistive pressure sensor with stacking ICs
US10354102B2 (en) * 2015-06-26 2019-07-16 Clean Energy Labs, Llc Ultrasonic identification devices and methods of making and using same
US10412503B2 (en) * 2016-08-12 2019-09-10 Shure Acquisition Holdings, Inc. Microphone and methods of assembling microphones
JP2018152736A (ja) * 2017-03-13 2018-09-27 ヤマハ株式会社 センサーユニット
CN107797787A (zh) * 2017-09-15 2018-03-13 周连惠 一种可切换语种的语音输入装置
JP7351792B2 (ja) * 2020-04-30 2023-09-27 ホシデン株式会社 収音装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5830394Y2 (ja) 1978-11-15 1983-07-04 日本特殊陶業株式会社 圧電マイクロフオン
JPS5574198A (en) * 1978-11-29 1980-06-04 Matsushita Electric Industrial Co Ltd Throughhhole plating process
US4417170A (en) 1981-11-23 1983-11-22 Imperial Clevite Inc. Flexible circuit interconnect for piezoelectric element
FR2542552B1 (fr) * 1983-03-07 1986-04-11 Thomson Csf Transducteur electroacoustique a diaphragme piezo-electrique
JPH0731664Y2 (ja) 1985-07-12 1995-07-19 ソニー株式会社 スピーカ装置
JPS6214897A (ja) * 1985-07-12 1987-01-23 松下電器産業株式会社 熱風供給装置
JP3162467B2 (ja) 1992-03-30 2001-04-25 ローム株式会社 圧電ブザー
US6414397B1 (en) * 1998-12-02 2002-07-02 Seiko Epson Corporation Anisotropic conductive film, method of mounting semiconductor chip, and semiconductor device
WO2000045430A1 (en) * 1999-01-29 2000-08-03 Matsushita Electric Industrial Co., Ltd. Electronic parts mounting method and device therefor
US20030020377A1 (en) * 2001-07-30 2003-01-30 Ngk Insulators, Ltd. Piezoelectric/electrostrictive element and piezoelectric/electrostrictive device and production method thereof
US7239714B2 (en) 2001-10-09 2007-07-03 Sonion Nederland B.V. Microphone having a flexible printed circuit board for mounting components

Also Published As

Publication number Publication date
US8369544B2 (en) 2013-02-05
CN1860823B (zh) 2012-12-19
US20090052699A1 (en) 2009-02-26
JP4851331B2 (ja) 2012-01-11
CN1860823A (zh) 2006-11-08
EP1673963B1 (de) 2011-07-13
WO2005032212A1 (en) 2005-04-07
KR101127711B1 (ko) 2012-03-23
JP2007507188A (ja) 2007-03-22
KR20060069516A (ko) 2006-06-21
EP1673963A1 (de) 2006-06-28

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Legal Events

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