ATE519359T1 - Übertragungsleitung - Google Patents

Übertragungsleitung

Info

Publication number
ATE519359T1
ATE519359T1 AT06755787T AT06755787T ATE519359T1 AT E519359 T1 ATE519359 T1 AT E519359T1 AT 06755787 T AT06755787 T AT 06755787T AT 06755787 T AT06755787 T AT 06755787T AT E519359 T1 ATE519359 T1 AT E519359T1
Authority
AT
Austria
Prior art keywords
transmission line
circuit board
conductors
line conductors
permit
Prior art date
Application number
AT06755787T
Other languages
English (en)
Inventor
Robert Greed
Original Assignee
Bae Systems Plc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB0512118A external-priority patent/GB0512118D0/en
Application filed by Bae Systems Plc filed Critical Bae Systems Plc
Application granted granted Critical
Publication of ATE519359T1 publication Critical patent/ATE519359T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems ; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/007—Interconnections between the MEMS and external electrical signals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/10—Wire waveguides, i.e. with a single solid longitudinal conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Micromachines (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Waveguides (AREA)
AT06755787T 2005-06-15 2006-06-14 Übertragungsleitung ATE519359T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB0512118A GB0512118D0 (en) 2005-06-15 2005-06-15 Transmission line
EP05270022 2005-06-15
PCT/GB2006/050153 WO2006134399A1 (en) 2005-06-15 2006-06-14 Transmission line

Publications (1)

Publication Number Publication Date
ATE519359T1 true ATE519359T1 (de) 2011-08-15

Family

ID=36922234

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06755787T ATE519359T1 (de) 2005-06-15 2006-06-14 Übertragungsleitung

Country Status (4)

Country Link
US (1) US7852175B2 (de)
EP (1) EP1894454B1 (de)
AT (1) ATE519359T1 (de)
WO (1) WO2006134399A1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008141481A1 (en) * 2007-05-24 2008-11-27 Princo Corp. A structure and manufacturing method of metal wiring on multilayered board
TWI354523B (en) 2007-05-25 2011-12-11 Princo Corp Method for manufacturing metal lines in multi-laye
US8815333B2 (en) 2007-12-05 2014-08-26 Princo Middle East Fze Manufacturing method of metal structure in multi-layer substrate
US8023269B2 (en) * 2008-08-15 2011-09-20 Siemens Energy, Inc. Wireless telemetry electronic circuit board for high temperature environments
WO2012002446A1 (ja) * 2010-07-02 2012-01-05 独立行政法人産業技術総合研究所 微小機械システム
WO2016028451A1 (en) * 2014-08-20 2016-02-25 Halliburton Energy Services, Inc. Printed circuit board assemblies
GB202002393D0 (en) * 2020-02-20 2020-04-08 Convatec Ltd An astomy appliance coupling assembly

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3771070A (en) 1972-12-22 1973-11-06 Us Air Force Stripline-to-two-conductor balun
US5227742A (en) * 1982-07-02 1993-07-13 Junkosha Co., Ltd. Stripline cable having a porous dielectric tape with openings disposed therethrough
US4575700A (en) * 1984-05-17 1986-03-11 Cornell Research Foundation, Inc. Parallel plate transmission lines integrated with coplanar waveguides or slot lines and method of making same
JP3361556B2 (ja) 1992-09-25 2003-01-07 日本メクトロン株式会社 回路配線パタ−ンの形成法
JPH08125412A (ja) * 1994-10-19 1996-05-17 Mitsubishi Electric Corp 伝送線路，及びその製造方法
JPH10163710A (ja) 1996-11-27 1998-06-19 Kyocera Corp 高周波用伝送線路
JP3219067B2 (ja) 1999-01-08 2001-10-15 日本電気株式会社 集積回路
US6525623B2 (en) 2000-06-09 2003-02-25 Synergy Microwave Corporation Multi-layer microwave circuits and methods of manufacture
US6621384B1 (en) 2000-12-28 2003-09-16 Nortel Networks Limited Technology implementation of suspended stripline within multi-layer substrate used to vary time delay and to maximize the reach of signals with high data rates or high frequencies
JP2002299918A (ja) * 2001-01-29 2002-10-11 Murata Mfg Co Ltd マイクロストリップ線路及びそれを用いた共振素子、フィルタ、高周波回路並びにそれらを用いた電子回路、回路モジュール及び通信装置
JP4215495B2 (ja) 2002-01-10 2009-01-28 三洋電機株式会社 配線構造およびその製造方法ならびに配線構造を備えた半導体装置と配線基板
US6809617B2 (en) * 2002-12-17 2004-10-26 Intel Corporation Edge plated transmission line and switch integrally formed therewith
US6888427B2 (en) * 2003-01-13 2005-05-03 Xandex, Inc. Flex-circuit-based high speed transmission line

Also Published As

Publication number Publication date
WO2006134399A1 (en) 2006-12-21
US7852175B2 (en) 2010-12-14
EP1894454B1 (de) 2011-08-03
EP1894454A1 (de) 2008-03-05
US20090033443A1 (en) 2009-02-05

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties