ATE519807T1 - Transparenter verbundwerkstoff - Google Patents

Transparenter verbundwerkstoff

Info

Publication number
ATE519807T1
ATE519807T1 AT09705360T AT09705360T ATE519807T1 AT E519807 T1 ATE519807 T1 AT E519807T1 AT 09705360 T AT09705360 T AT 09705360T AT 09705360 T AT09705360 T AT 09705360T AT E519807 T1 ATE519807 T1 AT E519807T1
Authority
AT
Austria
Prior art keywords
composite material
transparent composite
composition
cured
mass
Prior art date
Application number
AT09705360T
Other languages
English (en)
Inventor
Ryoji Toita
Kenji Shimamura
Original Assignee
Showa Denko Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko Kk filed Critical Showa Denko Kk
Application granted granted Critical
Publication of ATE519807T1 publication Critical patent/ATE519807T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/10—Semiconductor bodies
    • H10F77/16—Material structures, e.g. crystalline structures, film structures or crystal plane orientations
    • H10F77/169—Thin semiconductor films on metallic or insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/10—Semiconductor bodies
    • H10F77/16—Material structures, e.g. crystalline structures, film structures or crystal plane orientations
    • H10F77/169—Thin semiconductor films on metallic or insulating substrates
    • H10F77/1698—Thin semiconductor films on metallic or insulating substrates the metallic or insulating substrates being flexible
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Electroluminescent Light Sources (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Liquid Crystal (AREA)
  • Polymerisation Methods In General (AREA)
  • Epoxy Resins (AREA)
AT09705360T 2008-01-30 2009-01-30 Transparenter verbundwerkstoff ATE519807T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008019331 2008-01-30
PCT/JP2009/052012 WO2009096607A1 (en) 2008-01-30 2009-01-30 Transparent composite material

Publications (1)

Publication Number Publication Date
ATE519807T1 true ATE519807T1 (de) 2011-08-15

Family

ID=40521338

Family Applications (1)

Application Number Title Priority Date Filing Date
AT09705360T ATE519807T1 (de) 2008-01-30 2009-01-30 Transparenter verbundwerkstoff

Country Status (8)

Country Link
US (1) US20100292378A1 (de)
EP (1) EP2247656B1 (de)
JP (1) JP5075849B2 (de)
KR (1) KR20100106955A (de)
CN (1) CN101932641B (de)
AT (1) ATE519807T1 (de)
TW (1) TW200940639A (de)
WO (1) WO2009096607A1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102365307A (zh) * 2009-03-27 2012-02-29 昭和电工株式会社 透明复合材料
CN102181587A (zh) * 2011-03-31 2011-09-14 四川大学 THP盐-Laponite结合鞣制皮革的方法
US9416294B2 (en) * 2012-04-30 2016-08-16 H.B. Fuller Company Curable epoxide containing formaldehyde-free compositions, articles including the same, and methods of using the same
CN102816461B (zh) * 2012-08-27 2014-10-29 暨南大学 含季铵阳离子和季鏻阳离子的改性粘土及其制备与应用
CN103409420B (zh) * 2013-08-31 2015-04-15 西南大学 尼罗罗非鱼y染色体特异分子标记与基于该分子标记的遗传性别鉴定方法和超雄鱼生产方法
EP2863443B1 (de) * 2013-10-17 2016-04-27 DAS Energy GmbH Photovoltaik-Paneel und Verfahren zu dessen Herstellung
CN108376717B (zh) * 2016-10-31 2020-05-12 上迈(镇江)新能源科技有限公司 光伏组件层压结构的制备方法以及层压结构、光伏组件

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3327016A (en) * 1964-07-09 1967-06-20 Epoxylite Corp Epoxide compositions cured with 1, 4-bis (aminomethyl) cyclohexane
JPS63245416A (ja) * 1987-04-01 1988-10-12 Kao Corp 熱硬化性樹脂組成物
JPS63245417A (ja) * 1987-04-01 1988-10-12 Kao Corp ビニルエステル樹脂組成物
US6287992B1 (en) * 1998-04-20 2001-09-11 The Dow Chemical Company Polymer composite and a method for its preparation
EP1642914B1 (de) * 2002-11-14 2007-11-14 Rohm and Haas Company Haertbare Tonzusammensetzung, Verfahren und Anwendungen derselben
JP4387772B2 (ja) * 2002-11-21 2009-12-24 積水化学工業株式会社 光通信用透明樹脂組成物
US7250477B2 (en) * 2002-12-20 2007-07-31 General Electric Company Thermoset composite composition, method, and article
JP5092401B2 (ja) * 2004-07-15 2012-12-05 東レ株式会社 熱可塑性樹脂組成物
WO2007034775A1 (ja) * 2005-09-22 2007-03-29 Tomoegawa Co., Ltd. 粘土薄膜基板、電極付き粘土薄膜基板、及びそれらを用いた表示素子
CN101495410B (zh) * 2006-07-21 2011-12-28 昭和电工株式会社 透明复合材料
JP2009001727A (ja) * 2007-06-25 2009-01-08 Akebono Brake Ind Co Ltd 熱硬化性樹脂複合材料の製造方法、その方法で得られた熱硬化性樹脂複合材料およびそれを用いた摩擦材

Also Published As

Publication number Publication date
EP2247656B1 (de) 2011-08-10
TW200940639A (en) 2009-10-01
US20100292378A1 (en) 2010-11-18
KR20100106955A (ko) 2010-10-04
WO2009096607A1 (en) 2009-08-06
EP2247656A1 (de) 2010-11-10
CN101932641A (zh) 2010-12-29
CN101932641B (zh) 2012-09-19
JP5075849B2 (ja) 2012-11-21
JP2009203469A (ja) 2009-09-10

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Legal Events

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