ATE520140T1 - Geschaltete kapazität - Google Patents

Geschaltete kapazität

Info

Publication number
ATE520140T1
ATE520140T1 AT03020159T AT03020159T ATE520140T1 AT E520140 T1 ATE520140 T1 AT E520140T1 AT 03020159 T AT03020159 T AT 03020159T AT 03020159 T AT03020159 T AT 03020159T AT E520140 T1 ATE520140 T1 AT E520140T1
Authority
AT
Austria
Prior art keywords
electrode
bottom electrode
overlap
floating electrode
switched capacity
Prior art date
Application number
AT03020159T
Other languages
English (en)
Inventor
Xavier Rottenberg
Henri Jansen
Hendrikus Tilmans
Raedt Walter De
Original Assignee
Imec
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Imec filed Critical Imec
Application granted granted Critical
Publication of ATE520140T1 publication Critical patent/ATE520140T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H59/00—Electrostatic relays; Electro-adhesion relays
    • H01H59/0009—Electrostatic relays; Electro-adhesion relays making use of micromechanics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0002—Arrangements for avoiding sticking of the flexible or moving parts
    • B81B3/001—Structures having a reduced contact area, e.g. with bumps or with a textured surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G5/00—Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaft; Processes of their manufacture
    • H01G5/16—Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaft; Processes of their manufacture using variation of distance between electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G5/00—Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaft; Processes of their manufacture
    • H01G5/16—Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaft; Processes of their manufacture using variation of distance between electrodes
    • H01G5/18—Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaft; Processes of their manufacture using variation of distance between electrodes due to change in inclination, e.g. by flexing, by spiral wrapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/01—Switches
    • B81B2201/012—Switches characterised by the shape
    • B81B2201/016—Switches characterised by the shape having a bridge fixed on two ends and connected to one or more dimples
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/11—Treatments for avoiding stiction of elastic or moving parts of MEMS
    • B81C2201/115—Roughening a surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Micromachines (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Contacts (AREA)
AT03020159T 2002-09-16 2003-09-05 Geschaltete kapazität ATE520140T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US41095402P 2002-09-16 2002-09-16

Publications (1)

Publication Number Publication Date
ATE520140T1 true ATE520140T1 (de) 2011-08-15

Family

ID=31888414

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03020159T ATE520140T1 (de) 2002-09-16 2003-09-05 Geschaltete kapazität

Country Status (3)

Country Link
US (1) US7002439B2 (de)
EP (1) EP1398811B1 (de)
AT (1) ATE520140T1 (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1295728C (zh) * 2004-09-20 2007-01-17 东南大学 低阈值直交流可分的微电子机械开关及其制造方法
CN1312718C (zh) * 2004-09-21 2007-04-25 清华大学 一种多谐振点的微机械开关
EP1722386A1 (de) 2005-05-10 2006-11-15 Interuniversitair Microelektronica Centrum Vzw Mikroelektromechanische Vorrichtung mit verringerter Selbstbetätigung
JP4405427B2 (ja) 2005-05-10 2010-01-27 株式会社東芝 スイッチング素子
EP1733999A1 (de) 2005-06-15 2006-12-20 Interuniversitair Microelektronica Centrum Vzw Mikroelektromechanisches Bauteil mit Spannungs- und Spannungsgradientenausgleich
JP4684856B2 (ja) * 2005-11-08 2011-05-18 富士通株式会社 電子部品
US8003537B2 (en) * 2006-07-18 2011-08-23 Imec Method for the production of planar structures
US8450902B2 (en) * 2006-08-28 2013-05-28 Xerox Corporation Electrostatic actuator device having multiple gap heights
US7688167B2 (en) * 2006-10-12 2010-03-30 Innovative Micro Technology Contact electrode for microdevices and etch method of manufacture
WO2008064216A2 (en) * 2006-11-20 2008-05-29 Massachusetts Institute Of Technology Micro-electro mechanical tunneling switch
EP2168239A2 (de) * 2007-06-13 2010-03-31 Nxp B.V. Einstellbarer mems-kondensator
JP4956312B2 (ja) * 2007-07-20 2012-06-20 株式会社アドバンテスト 遅延線
US8269344B2 (en) * 2008-03-28 2012-09-18 Broadcom Corporation Method and system for inter-chip communication via integrated circuit package waveguides
EP2107038B1 (de) * 2008-03-31 2012-05-16 Imec Elektrostatisch betätigbare MEMS-Vorrichtung mit verringerter Substrataufladung
US8274147B2 (en) * 2008-06-19 2012-09-25 Broadcom Corporation Method and system for intra-printed circuit board communication via waveguides
US8450846B2 (en) * 2008-06-19 2013-05-28 Broadcom Corporation Method and system for communicating via flip-chip die and package waveguides
KR101104537B1 (ko) * 2010-05-28 2012-01-11 한국과학기술원 가변 캐패시터 및 그의 구동 방법
US8709264B2 (en) 2010-06-25 2014-04-29 International Business Machines Corporation Planar cavity MEMS and related structures, methods of manufacture and design structures
US9045328B2 (en) * 2011-12-20 2015-06-02 Analog Devices, Inc. Method for wafer-level surface micromachining to reduce stiction
JP6434491B2 (ja) 2013-04-04 2018-12-05 キャベンディッシュ・キネティックス・インコーポレイテッドＣａｖｅｎｄｉｓｈ Ｋｉｎｅｔｉｃｓ， Ｉｎｃ． 高い線形性を有するｍｅｍｓ可変デジタルキャパシタデザイン
CN105229764B (zh) * 2013-04-29 2018-03-20 卡文迪什动力有限公司 用于改进mems dvc器件线性度的控制电极屏蔽
US9136165B2 (en) * 2013-06-04 2015-09-15 Invensense, Inc. Methods for stiction reduction in MEMS sensors
FR3030476B1 (fr) * 2014-12-23 2020-09-25 Thales Sa Mems rf capacitif destines a des applications de forte puissance
GR1010742B (el) * 2023-06-26 2024-08-27 Ιδρυμα Τεχνολογιας Και Ερευνας, Μικροηλεκτρομηχανικος διακοπτης με πλωτα ηλεκτροδια σε δομη που ελαχιστοποιει τα φαινομενα εκπομπης λογω ηλεκτρικου πεδιου

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4211488A (en) * 1978-10-03 1980-07-08 Rca Corporation Optical testing of a semiconductor
US6232847B1 (en) * 1997-04-28 2001-05-15 Rockwell Science Center, Llc Trimmable singleband and tunable multiband integrated oscillator using micro-electromechanical system (MEMS) technology
US6160230A (en) * 1999-03-01 2000-12-12 Raytheon Company Method and apparatus for an improved single pole double throw micro-electrical mechanical switch
US6323951B1 (en) * 1999-03-22 2001-11-27 Boxer Cross Incorporated Apparatus and method for determining the active dopant profile in a semiconductor wafer
US6307452B1 (en) * 1999-09-16 2001-10-23 Motorola, Inc. Folded spring based micro electromechanical (MEM) RF switch
US6362018B1 (en) * 2000-02-02 2002-03-26 Motorola, Inc. Method for fabricating MEMS variable capacitor with stabilized electrostatic drive
AU2001268742A1 (en) * 2000-06-28 2002-01-08 The Regents Of The University Of California Capacitive microelectromechanical switches
US6472962B1 (en) * 2001-05-17 2002-10-29 Institute Of Microelectronics Inductor-capacitor resonant RF switch

Also Published As

Publication number Publication date
EP1398811A2 (de) 2004-03-17
US20040124497A1 (en) 2004-07-01
US7002439B2 (en) 2006-02-21
EP1398811A3 (de) 2005-10-05
EP1398811B1 (de) 2011-08-10

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties