ATE520291T1 - Technik zum herstellen von einer umgossenen elektronischen baugruppe - Google Patents

Technik zum herstellen von einer umgossenen elektronischen baugruppe

Info

Publication number
ATE520291T1
ATE520291T1 AT06076163T AT06076163T ATE520291T1 AT E520291 T1 ATE520291 T1 AT E520291T1 AT 06076163 T AT06076163 T AT 06076163T AT 06076163 T AT06076163 T AT 06076163T AT E520291 T1 ATE520291 T1 AT E520291T1
Authority
AT
Austria
Prior art keywords
die
substrate
backplate
cavity
electronic assembly
Prior art date
Application number
AT06076163T
Other languages
English (en)
Inventor
Scott D Brandenburg
David A Laudick
Original Assignee
Delphi Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delphi Tech Inc filed Critical Delphi Tech Inc
Application granted granted Critical
Publication of ATE520291T1 publication Critical patent/ATE520291T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0034—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having an overmolded housing covering the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1056—Metal over component, i.e. metal plate over component mounted on or embedded in PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/923—Bond pads having multiple stacked layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
AT06076163T 2005-06-13 2006-06-02 Technik zum herstellen von einer umgossenen elektronischen baugruppe ATE520291T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/150,997 US7473585B2 (en) 2005-06-13 2005-06-13 Technique for manufacturing an overmolded electronic assembly

Publications (1)

Publication Number Publication Date
ATE520291T1 true ATE520291T1 (de) 2011-08-15

Family

ID=37124401

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06076163T ATE520291T1 (de) 2005-06-13 2006-06-02 Technik zum herstellen von einer umgossenen elektronischen baugruppe

Country Status (3)

Country Link
US (1) US7473585B2 (de)
EP (1) EP1734800B1 (de)
AT (1) ATE520291T1 (de)

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* Cited by examiner, † Cited by third party
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US7268429B2 (en) * 2005-06-27 2007-09-11 Delphi Technologies, Inc. Technique for manufacturing an overmolded electronic assembly
US7440282B2 (en) * 2006-05-16 2008-10-21 Delphi Technologies, Inc. Heat sink electronic package having compliant pedestal
US20090091889A1 (en) * 2007-10-09 2009-04-09 Oman Todd P Power electronic module having improved heat dissipation capability
DE102008008386A1 (de) * 2008-02-09 2009-08-13 Airbus Deutschland Gmbh Verfahren zur Herstellung eines FVW-Bauteils
US8234034B2 (en) 2009-06-26 2012-07-31 Autoliv Asp, Inc. Enhanced electronic assembly
JP2011100718A (ja) * 2009-10-05 2011-05-19 Yazaki Corp コネクタ
US8228682B1 (en) 2010-08-20 2012-07-24 Xilinx, Inc. Electronic assembly with trenches for underfill material
US8914183B2 (en) 2010-09-20 2014-12-16 Joshua Forwerck Enhanced electronic assembly
DE102011088969A1 (de) * 2011-12-19 2013-06-20 Robert Bosch Gmbh Getriebesteuermodul
US9552977B2 (en) * 2012-12-10 2017-01-24 Intel Corporation Landside stiffening capacitors to enable ultrathin and other low-Z products
US9623591B2 (en) 2013-01-15 2017-04-18 Basf Se Method of encapsulating an electronic component
KR101449271B1 (ko) * 2013-04-19 2014-10-08 현대오트론 주식회사 오버몰딩을 이용한 차량의 전자 제어 장치 및 그 제조 방법
KR101428933B1 (ko) * 2013-07-05 2014-08-08 현대오트론 주식회사 방열판을 이용한 차량의 전자 제어 장치 및 그 제조 방법
DE102013215368B4 (de) * 2013-08-05 2025-06-05 Zf Friedrichshafen Ag Elektronische Einheit mit Leiterplatte
US9579511B2 (en) 2014-12-15 2017-02-28 Medtronic, Inc. Medical device with surface mounted lead connector
JP6479995B2 (ja) * 2015-01-15 2019-03-06 ピアーブルグ パンプ テクノロジー ゲゼルシャフト ミット ベシュレンクテル ハフツングＰｉｅｒｂｕｒｇ Ｐｕｍｐ Ｔｅｃｈｎｏｌｏｇｙ ＧｍｂＨ 電子式自動車用補助アセンブリ
DE102015207867A1 (de) * 2015-04-29 2016-11-03 Robert Bosch Gmbh Elektronische Baugruppe, insbesondere für ein Getriebesteuermodul
JP6591234B2 (ja) * 2015-08-21 2019-10-16 ルネサスエレクトロニクス株式会社 半導体装置
US9780077B2 (en) * 2015-09-10 2017-10-03 Nxp Usa, Inc. System-in-packages containing preassembled surface mount device modules and methods for the production thereof
JP6561129B2 (ja) * 2015-09-29 2019-08-14 日立オートモティブシステムズ株式会社 電子制御装置またはその製造方法
KR101937794B1 (ko) * 2015-11-06 2019-01-11 택토텍 오와이 다층 구조체 및 관련 전자 소자의 제조 방법
US10390455B2 (en) * 2017-03-27 2019-08-20 Raytheon Company Thermal isolation of cryo-cooled components from circuit boards or other structures
DE102017207682A1 (de) * 2017-05-08 2018-11-08 Robert Bosch Gmbh Elektronikmodul und Fertigungsverfahren
DE102017210176A1 (de) * 2017-06-19 2018-12-20 Robert Bosch Gmbh Elektronikmodul
CN114342567B (zh) * 2019-09-11 2025-03-25 纬湃科技德国有限责任公司 用于机动车辆的控制设备
CN114402701B (zh) * 2019-09-11 2025-04-18 纬湃科技德国有限责任公司 机动车辆的控制设备和用于制造和测量控制设备的密封性的方法
DE102019213962A1 (de) * 2019-09-13 2021-03-18 Vitesco Technologies Germany Gmbh Getriebesteuergerät, Kraftfahrzeug und Verfahren zur Umspritzung einer Leiterplatte eines Getriebesteuergeräts
DE102021213703A1 (de) 2021-12-02 2023-06-07 Zf Friedrichshafen Ag Verfahren zur Herstellung einer Baugruppe
US11991869B2 (en) * 2022-10-11 2024-05-21 Lunar Energy, Inc. Thermal management system including an overmolded layer and a conductive layer over a circuit board

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Also Published As

Publication number Publication date
US20060281230A1 (en) 2006-12-14
EP1734800A2 (de) 2006-12-20
US7473585B2 (en) 2009-01-06
EP1734800A3 (de) 2009-01-21
EP1734800B1 (de) 2011-08-10

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