ATE521915T1 - Verfahren zur erzeugung einer strukturierten schicht auf einem substrat - Google Patents
Verfahren zur erzeugung einer strukturierten schicht auf einem substratInfo
- Publication number
- ATE521915T1 ATE521915T1 AT06819306T AT06819306T ATE521915T1 AT E521915 T1 ATE521915 T1 AT E521915T1 AT 06819306 T AT06819306 T AT 06819306T AT 06819306 T AT06819306 T AT 06819306T AT E521915 T1 ATE521915 T1 AT E521915T1
- Authority
- AT
- Austria
- Prior art keywords
- producing
- substrate
- stepper
- tools
- structured layer
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2035—Exposure; Apparatus therefor simultaneous coating and exposure; using a belt mask, e.g. endless
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0035—Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2037—Exposure with X-ray radiation or corpuscular radiation, through a mask with a pattern opaque to that radiation
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Chemical Vapour Deposition (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/164,684 US7871933B2 (en) | 2005-12-01 | 2005-12-01 | Combined stepper and deposition tool |
| PCT/EP2006/068188 WO2007062962A1 (en) | 2005-12-01 | 2006-11-07 | Combined stepper and deposition tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE521915T1 true ATE521915T1 (de) | 2011-09-15 |
Family
ID=37698226
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT06819306T ATE521915T1 (de) | 2005-12-01 | 2006-11-07 | Verfahren zur erzeugung einer strukturierten schicht auf einem substrat |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7871933B2 (de) |
| EP (1) | EP1955113B1 (de) |
| JP (1) | JP2009517872A (de) |
| KR (1) | KR101063715B1 (de) |
| CN (1) | CN101313250B (de) |
| AT (1) | ATE521915T1 (de) |
| WO (1) | WO2007062962A1 (de) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7867904B2 (en) * | 2006-07-19 | 2011-01-11 | Intermolecular, Inc. | Method and system for isolated and discretized process sequence integration |
| US8017183B2 (en) * | 2007-09-26 | 2011-09-13 | Eastman Kodak Company | Organosiloxane materials for selective area deposition of inorganic materials |
| JP5438750B2 (ja) * | 2008-03-24 | 2014-03-12 | 本田技研工業株式会社 | 原子間力顕微鏡を利用したナノ構造の堆積のための装置 |
| US20090238990A1 (en) * | 2008-03-24 | 2009-09-24 | Neil Dasgupta | SAM oxidative removal for controlled nanofabrication |
Family Cites Families (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55129345A (en) * | 1979-03-29 | 1980-10-07 | Ulvac Corp | Electron beam plate making method by vapor phase film formation and vapor phase development |
| US4588801A (en) | 1984-04-05 | 1986-05-13 | The United States Of America As Represented By The United States Department Of Energy | Polysilane positive photoresist materials and methods for their use |
| US5310624A (en) * | 1988-01-29 | 1994-05-10 | Massachusetts Institute Of Technology | Integrated circuit micro-fabrication using dry lithographic processes |
| DE69132523D1 (de) * | 1990-05-09 | 2001-03-08 | Canon Kk | Erzeugung von Mustern und Herstellungsverfahren für Halbleiteranordnungen mit diesem Muster |
| JP2849458B2 (ja) * | 1990-07-03 | 1999-01-20 | キヤノン株式会社 | 半導体装置の製造方法および製造装置 |
| JPH0437029A (ja) * | 1990-05-31 | 1992-02-07 | Canon Inc | 半導体装置の配線形成方法 |
| US5618379A (en) * | 1991-04-01 | 1997-04-08 | International Business Machines Corporation | Selective deposition process |
| JPH07254556A (ja) | 1993-09-03 | 1995-10-03 | Hitachi Ltd | パターン形成方法および形成装置 |
| JP3817749B2 (ja) | 1994-03-17 | 2006-09-06 | 日産化学工業株式会社 | 紫外線照射によるシリカ含有無機酸化物被膜のパターン形成用コーティング剤及びパターン形成方法 |
| JP3272610B2 (ja) * | 1996-09-09 | 2002-04-08 | 三洋電機株式会社 | 金属薄膜の形成方法 |
| JPH11191539A (ja) * | 1997-10-22 | 1999-07-13 | Sanyo Electric Co Ltd | 金属配線の形成方法 |
| JP4099278B2 (ja) | 1998-11-25 | 2008-06-11 | ジーイー横河メディカルシステム株式会社 | 導電パターン形成方法および装置、超音波トランスデューサ並びに超音波撮像装置 |
| JP4260396B2 (ja) * | 2000-03-09 | 2009-04-30 | 富士通マイクロエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
| JP3921917B2 (ja) * | 2000-03-31 | 2007-05-30 | セイコーエプソン株式会社 | 微細構造体の製造方法 |
| TW490997B (en) * | 2000-03-31 | 2002-06-11 | Seiko Epson Corp | Method of manufacturing organic EL element, and organic EL element |
| WO2001099166A1 (en) * | 2000-06-08 | 2001-12-27 | Genitech Inc. | Thin film forming method |
| JP4138312B2 (ja) * | 2000-12-28 | 2008-08-27 | セイコーエプソン株式会社 | 薄膜形成方法、および電子機器 |
| TW471024B (en) * | 2001-01-20 | 2002-01-01 | United Microelectronics Corp | Lithography etching method |
| JP4366920B2 (ja) * | 2002-11-07 | 2009-11-18 | ソニー株式会社 | 平面型表示装置及びその製造方法 |
| US6969690B2 (en) * | 2003-03-21 | 2005-11-29 | The University Of North Carolina At Chapel Hill | Methods and apparatus for patterned deposition of nanostructure-containing materials by self-assembly and related articles |
| JP2004351305A (ja) * | 2003-05-28 | 2004-12-16 | Seiko Epson Corp | 薄膜パターン形成方法、デバイスとその製造方法及び電気光学装置並びに電子機器 |
| US7071022B2 (en) | 2003-07-18 | 2006-07-04 | Corning Incorporated | Silicon crystallization using self-assembled monolayers |
| US20050017624A1 (en) * | 2003-07-23 | 2005-01-27 | Thomas Novet | Electron emitter with epitaxial layers |
| JPWO2005024807A1 (ja) * | 2003-09-08 | 2006-11-09 | 松下電器産業株式会社 | ディスク原盤の製造方法、ディスク原盤の製造装置、ディスク原盤の移動距離差検出方法、およびディスク原盤の移動距離差検出装置 |
| JP2005135975A (ja) * | 2003-10-28 | 2005-05-26 | Seiko Epson Corp | 電極の形成方法、並びに圧電体デバイス、強誘電体デバイス、及び電子機器 |
| GB0326904D0 (en) | 2003-11-19 | 2003-12-24 | Koninkl Philips Electronics Nv | Formation of self-assembled monolayers |
| US7208094B2 (en) * | 2003-12-17 | 2007-04-24 | Hewlett-Packard Development Company, L.P. | Methods of bridging lateral nanowires and device using same |
| US7589822B2 (en) * | 2004-02-02 | 2009-09-15 | Nikon Corporation | Stage drive method and stage unit, exposure apparatus, and device manufacturing method |
| JP2007522524A (ja) * | 2004-02-11 | 2007-08-09 | インターナショナル・ビジネス・マシーンズ・コーポレーション | クロム基板又は感応性基板上のパターン形成されたレジスト・プロファイルを向上させるための混合基の使用 |
| US7030001B2 (en) * | 2004-04-19 | 2006-04-18 | Freescale Semiconductor, Inc. | Method for forming a gate electrode having a metal |
| US7268074B2 (en) * | 2004-06-14 | 2007-09-11 | Enthone, Inc. | Capping of metal interconnects in integrated circuit electronic devices |
| US7138067B2 (en) * | 2004-09-27 | 2006-11-21 | Lam Research Corporation | Methods and apparatus for tuning a set of plasma processing steps |
| US7367110B2 (en) * | 2004-09-27 | 2008-05-06 | Hitachi Global Storage Technologies Netherlands B.V. | Method of fabricating a read head having shaped read sensor-biasing layer junctions using partial milling |
| JP4776247B2 (ja) * | 2005-02-09 | 2011-09-21 | 富士通株式会社 | 配線基板及びその製造方法 |
| KR100724102B1 (ko) * | 2005-02-14 | 2007-06-04 | 한국표준과학연구원 | 나노판을 이용한 나노부품, 그 제조방법 및 나노기계의 제작방법 |
| US7279085B2 (en) * | 2005-07-19 | 2007-10-09 | General Electric Company | Gated nanorod field emitter structures and associated methods of fabrication |
-
2005
- 2005-12-01 US US11/164,684 patent/US7871933B2/en not_active Expired - Fee Related
-
2006
- 2006-11-07 JP JP2008542697A patent/JP2009517872A/ja active Pending
- 2006-11-07 EP EP06819306A patent/EP1955113B1/de not_active Not-in-force
- 2006-11-07 KR KR1020087014072A patent/KR101063715B1/ko not_active Expired - Fee Related
- 2006-11-07 WO PCT/EP2006/068188 patent/WO2007062962A1/en not_active Ceased
- 2006-11-07 AT AT06819306T patent/ATE521915T1/de not_active IP Right Cessation
- 2006-11-07 CN CN2006800437784A patent/CN101313250B/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP1955113B1 (de) | 2011-08-24 |
| CN101313250B (zh) | 2011-06-29 |
| KR101063715B1 (ko) | 2011-09-07 |
| US20070128859A1 (en) | 2007-06-07 |
| KR20080071597A (ko) | 2008-08-04 |
| CN101313250A (zh) | 2008-11-26 |
| US7871933B2 (en) | 2011-01-18 |
| JP2009517872A (ja) | 2009-04-30 |
| WO2007062962A1 (en) | 2007-06-07 |
| EP1955113A1 (de) | 2008-08-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |