ATE524823T1 - Verfahren und vorrichtung zur kontrolle der verunreinigung von wafersubstraten - Google Patents

Verfahren und vorrichtung zur kontrolle der verunreinigung von wafersubstraten

Info

Publication number
ATE524823T1
ATE524823T1 AT06300207T AT06300207T ATE524823T1 AT E524823 T1 ATE524823 T1 AT E524823T1 AT 06300207 T AT06300207 T AT 06300207T AT 06300207 T AT06300207 T AT 06300207T AT E524823 T1 ATE524823 T1 AT E524823T1
Authority
AT
Austria
Prior art keywords
gas
analyzer
ionizing
enclosure
pipe
Prior art date
Application number
AT06300207T
Other languages
English (en)
Inventor
Arnaud Favre
Remi Thollot
Xavier Metais
Jean-Pierre Desbiolles
Original Assignee
Alcatel Lucent
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcatel Lucent filed Critical Alcatel Lucent
Application granted granted Critical
Publication of ATE524823T1 publication Critical patent/ATE524823T1/de

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F12/00—Use of energy recovery systems in air conditioning, ventilation or screening
    • F24F12/001—Use of energy recovery systems in air conditioning, ventilation or screening with heat-exchange between supplied and exhausted air
    • F24F12/002—Use of energy recovery systems in air conditioning, ventilation or screening with heat-exchange between supplied and exhausted air using an intermediate heat-transfer fluid
    • F24F12/003—Use of energy recovery systems in air conditioning, ventilation or screening with heat-exchange between supplied and exhausted air using an intermediate heat-transfer fluid using a heat pump
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
    • F24F13/28—Arrangement or mounting of filters
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
    • F24F13/30—Arrangement or mounting of heat-exchangers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F7/00—Ventilation
    • F24F7/04—Ventilation with ducting systems, e.g. by double walls; with natural circulation
    • F24F7/06—Ventilation with ducting systems, e.g. by double walls; with natural circulation with forced air circulation, e.g. by fan positioning of a ventilator in or against a conduit
    • F24F7/08—Ventilation with ducting systems, e.g. by double walls; with natural circulation with forced air circulation, e.g. by fan positioning of a ventilator in or against a conduit with separate ducts for supplied and exhausted air with provisions for reversal of the input and output systems
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1924—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Sampling And Sample Adjustment (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Other Investigation Or Analysis Of Materials By Electrical Means (AREA)
AT06300207T 2005-03-18 2006-03-07 Verfahren und vorrichtung zur kontrolle der verunreinigung von wafersubstraten ATE524823T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0550703A FR2883412B1 (fr) 2005-03-18 2005-03-18 Procede et dispositif pour le controle de la contamination des plaquettes de substrat

Publications (1)

Publication Number Publication Date
ATE524823T1 true ATE524823T1 (de) 2011-09-15

Family

ID=34979859

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06300207T ATE524823T1 (de) 2005-03-18 2006-03-07 Verfahren und vorrichtung zur kontrolle der verunreinigung von wafersubstraten

Country Status (7)

Country Link
US (1) US7790479B2 (de)
EP (1) EP1703547B8 (de)
JP (1) JP5068466B2 (de)
KR (1) KR101125913B1 (de)
CN (1) CN100543468C (de)
AT (1) ATE524823T1 (de)
FR (1) FR2883412B1 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2915831B1 (fr) * 2007-05-04 2009-09-25 Alcatel Lucent Sas Interface d'enceinte de transport
JP5015705B2 (ja) * 2007-09-18 2012-08-29 ルネサスエレクトロニクス株式会社 層間絶縁膜形成方法、層間絶縁膜、半導体デバイス、および半導体製造装置
FR2930675B1 (fr) * 2008-04-24 2010-08-20 Alcatel Lucent Station de mesure de la contamination en particules d'une enceinte de transport pour le convoyage et le stockage atmospherique de substrats semi-conducteurs et procede de mesure correspondant
FR2946754B1 (fr) * 2009-06-12 2012-05-18 Alcatel Lucent Dispositif et procede d'analyse de gaz,et station de mesure associee
FR2954583B1 (fr) * 2009-12-18 2017-11-24 Alcatel Lucent Procede et dispositif de pilotage de fabrication de semi conducteurs par mesure de contamination
CN102194730B (zh) 2010-03-15 2015-08-05 三星电子株式会社 衬底转移容器、气体净化监视工具及具有其的半导体制造设备
KR101780789B1 (ko) 2010-03-15 2017-09-22 삼성전자주식회사 기판 이송 용기, 가스 퍼지 모니터링 툴, 그리고 이들을 구비한 반도체 제조 설비
FR2961946B1 (fr) 2010-06-29 2012-08-03 Alcatel Lucent Dispositif de traitement pour boites de transport et de stockage
JP5617708B2 (ja) * 2011-03-16 2014-11-05 東京エレクトロン株式会社 蓋体開閉装置
US20130333445A1 (en) * 2012-06-04 2013-12-19 Eif - Astute Analyzer for fluids containing an inflammable substance and corresponding method
EP2856144B1 (de) 2012-06-04 2020-01-08 Apix Analytics Vorrichtung zur flüssigkeitsanalyse mit einem brennbaren medium sowie entsprechendes verfahren
JP5993252B2 (ja) * 2012-09-06 2016-09-14 東京エレクトロン株式会社 蓋体開閉装置及びこれを用いた熱処理装置、並びに蓋体開閉方法
US9356822B2 (en) * 2012-10-30 2016-05-31 Kla-Tencor Corporation Automated interface apparatus and method for use in semiconductor wafer handling systems
KR101271181B1 (ko) * 2012-11-14 2013-06-04 주식회사 위드텍 운송 인클로저 오염도 측정장치 및 이를 이용한 오염도 측정방법
FR2999016A1 (fr) * 2012-11-30 2014-06-06 Adixen Vacuum Products Station et procede de mesure de la contamination en particules d'une enceinte de transport pour le convoyage et le stockage atmospherique de substrats semi-conducteurs
FR2999015B1 (fr) * 2012-11-30 2014-12-12 Adixen Vacuum Products Station et procede de mesure de la contamination en particules d'une enceinte de transport pour le convoyage et le stockage atmospherique de substrats semi-conducteurs
US9579697B2 (en) * 2012-12-06 2017-02-28 Taiwan Semiconductor Manufacturing Co., Ltd. System and method of cleaning FOUP
KR101507436B1 (ko) * 2014-05-14 2015-04-07 주식회사 위드텍 오염물질 모니터링 장치
FR3040528B1 (fr) * 2015-09-02 2017-09-15 Pfeiffer Vacuum Sas Procede et station de mesure de la contamination d'une boite de transport pour le convoyage et le stockage atmospherique de substrats
KR20180078419A (ko) 2016-12-29 2018-07-10 삼성전자주식회사 캐리어
KR101872761B1 (ko) * 2017-08-09 2018-06-29 주식회사 위드텍 운송 인클로저 내부 오염도 측정 장치 및 이를 이용한 오염도 측정 방법
DE102020203910B3 (de) * 2020-03-26 2021-06-17 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zum Detektieren einer Verunreinigung eines MEMS-Sensorelements
JP2020115591A (ja) * 2020-04-30 2020-07-30 Tdk株式会社 フープロードポート装置
KR102409487B1 (ko) * 2022-04-19 2022-06-15 주식회사 위드텍 반도체 웨이퍼 풉용 로드포트의 분석가스 공급을 위한 제어장치 및 그 제어방법
CN117129636B (zh) * 2023-10-23 2024-01-26 中用科技有限公司 一种面向半导体制造的气态分子污染物在线监测系统

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US5233191A (en) * 1990-04-02 1993-08-03 Hitachi, Ltd. Method and apparatus of inspecting foreign matters during mass production start-up and mass production line in semiconductor production process
US5468302A (en) * 1994-07-13 1995-11-21 Thietje; Jerry Semiconductor wafer cleaning system
US5846338A (en) * 1996-01-11 1998-12-08 Asyst Technologies, Inc. Method for dry cleaning clean room containers
US5879458A (en) * 1996-09-13 1999-03-09 Semifab Incorporated Molecular contamination control system
SG76561A1 (en) * 1997-09-22 2000-11-21 Tokyo Electron Ltd Processing apparatus and method
US6398032B2 (en) * 1998-05-05 2002-06-04 Asyst Technologies, Inc. SMIF pod including independently supported wafer cassette
JP3939101B2 (ja) * 2000-12-04 2007-07-04 株式会社荏原製作所 基板搬送方法および基板搬送容器
JP2002184828A (ja) * 2000-12-19 2002-06-28 Mitsubishi Electric Corp 半導体基板の金属不純物の分析方法
KR100396468B1 (ko) * 2001-05-17 2003-09-02 삼성전자주식회사 공기 샘플링 캐리어와 공기 분석장치 및 방법
DE10133520A1 (de) * 2001-07-10 2003-01-30 Siemens Ag System und Verfahren zur Messung von Eigenschaften der Umgebungsluft in einem Reinraum und Verfahren
US20040023419A1 (en) * 2001-09-24 2004-02-05 Extraction Systems, Inc System and method for monitoring contamination
JP2003142541A (ja) * 2001-10-31 2003-05-16 Shin Etsu Handotai Co Ltd パーティクルの分析方法
JP4221230B2 (ja) * 2003-02-25 2009-02-12 キヤノンアネルバ株式会社 金属イオン放出素子

Also Published As

Publication number Publication date
FR2883412B1 (fr) 2007-05-04
CN100543468C (zh) 2009-09-23
JP2006261675A (ja) 2006-09-28
KR101125913B1 (ko) 2012-03-21
FR2883412A1 (fr) 2006-09-22
KR20060101332A (ko) 2006-09-22
EP1703547A2 (de) 2006-09-20
US20060292037A1 (en) 2006-12-28
CN1834638A (zh) 2006-09-20
EP1703547A3 (de) 2008-08-20
EP1703547B8 (de) 2012-03-14
JP5068466B2 (ja) 2012-11-07
US7790479B2 (en) 2010-09-07
KR101125913B9 (ko) 2025-03-17
EP1703547B1 (de) 2011-09-14

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