ATE524956T1 - Verfahren zum verarbeiten eines dünnfilmsubstrats - Google Patents

Verfahren zum verarbeiten eines dünnfilmsubstrats

Info

Publication number
ATE524956T1
ATE524956T1 AT04728728T AT04728728T ATE524956T1 AT E524956 T1 ATE524956 T1 AT E524956T1 AT 04728728 T AT04728728 T AT 04728728T AT 04728728 T AT04728728 T AT 04728728T AT E524956 T1 ATE524956 T1 AT E524956T1
Authority
AT
Austria
Prior art keywords
thin film
vias
film substrate
order
allocated
Prior art date
Application number
AT04728728T
Other languages
English (en)
Inventor
Hans Goeran Evald Martin
Klas Anders Hjort
Mikael Peter Erik Lindberg
Original Assignee
Jondetech Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jondetech Ab filed Critical Jondetech Ab
Application granted granted Critical
Publication of ATE524956T1 publication Critical patent/ATE524956T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0041—Etching of the substrate by chemical or physical means by plasma etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K2211/00—Thermometers based on nanotechnology
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/092—Particle beam, e.g. using an electron beam or an ion beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Spectrometry And Color Measurement (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
AT04728728T 2003-04-29 2004-04-21 Verfahren zum verarbeiten eines dünnfilmsubstrats ATE524956T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE0301238A SE526006C2 (sv) 2003-04-29 2003-04-29 Behandlat tunnfilmssubstrat
PCT/SE2004/000606 WO2004098256A1 (en) 2003-04-29 2004-04-21 A method for processing a thin film substrate

Publications (1)

Publication Number Publication Date
ATE524956T1 true ATE524956T1 (de) 2011-09-15

Family

ID=20291147

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04728728T ATE524956T1 (de) 2003-04-29 2004-04-21 Verfahren zum verarbeiten eines dünnfilmsubstrats

Country Status (10)

Country Link
US (1) US7176578B2 (de)
EP (1) EP1621054B1 (de)
JP (1) JP4359657B2 (de)
KR (1) KR101055600B1 (de)
CN (1) CN100521876C (de)
AT (1) ATE524956T1 (de)
AU (1) AU2004234763B2 (de)
CA (1) CA2523971A1 (de)
SE (1) SE526006C2 (de)
WO (1) WO2004098256A1 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1832146A1 (de) * 2004-12-28 2007-09-12 Siemens Home and Office Communication Devices GmbH & Co. KG Halbzeug sowie trägerkomponente auf der basis dieses halbzeugs
JP4344954B2 (ja) 2006-10-03 2009-10-14 セイコーエプソン株式会社 素子基板の製造方法
WO2008063125A1 (en) * 2006-11-20 2008-05-29 Senseair Ab A process for treating a flexible thin film substrate, in the form of a dielectric plastic foil, and a thin film substrate thus formed
US20090162666A1 (en) * 2007-12-20 2009-06-25 Palo Alto Research Center Incorporated Curable flexible material
US20090223700A1 (en) * 2008-03-05 2009-09-10 Honeywell International Inc. Thin flexible circuits
US7884488B2 (en) * 2008-05-01 2011-02-08 Qimonda Ag Semiconductor component with improved contact pad and method for forming the same
US8026567B2 (en) * 2008-12-22 2011-09-27 Taiwan Semiconductor Manufactuirng Co., Ltd. Thermoelectric cooler for semiconductor devices with TSV
JP2011233714A (ja) * 2010-04-27 2011-11-17 Canon Inc 半導体素子
US20150035162A1 (en) * 2013-08-02 2015-02-05 Qualcomm Incorporated Inductive device that includes conductive via and metal layer
SE541450C2 (en) 2018-02-19 2019-10-08 Jondetech Sensors Ab Publ Overheating alarm device for cell phone charger or similar device
SE543173C2 (en) 2018-07-02 2020-10-20 Jondetech Sensors Ab Publ Adapter device with infrared sensor and heat protection switch
US20200361782A1 (en) * 2019-05-16 2020-11-19 Sciosense B.V. Photo-annealing in Metal Oxide Sensors
US11662109B2 (en) 2019-06-05 2023-05-30 Carrier Corporation Enclosure for gas detector
US20230099531A1 (en) * 2021-09-24 2023-03-30 Apple Inc. System and method for temperature sensing using thermopile integrated with flexible circuit
SE547640C2 (en) 2024-04-09 2025-11-04 Jondetech Sensors Ab Publ Nanowire based lead for thermopile

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5180440A (en) * 1988-11-23 1993-01-19 Pace Incorporated Printed circuit thermocouple arrangements for personnel training and equipment evaluation purposes
SE521415C2 (sv) * 1998-02-17 2003-10-28 Hans Goeran Evald Martin Metod för att framställa en gassensortillhörig detektor, samt en detektor framställd enligt metoden
CN1274953A (zh) * 2000-06-16 2000-11-29 中国科学院上海冶金研究所 一种新结构薄膜热电堆
JP2002353523A (ja) * 2001-03-22 2002-12-06 Ricoh Co Ltd 熱電変換材料、熱電変換素子およびその製造方法
JP3655242B2 (ja) * 2002-01-04 2005-06-02 株式会社東芝 半導体パッケージ及び半導体実装装置
US6891266B2 (en) * 2002-02-14 2005-05-10 Mia-Com RF transition for an area array package
TWI256719B (en) * 2002-03-06 2006-06-11 Via Tech Inc Semiconductor device package module and manufacturing method thereof

Also Published As

Publication number Publication date
EP1621054B1 (de) 2011-09-14
AU2004234763A1 (en) 2004-11-11
CA2523971A1 (en) 2004-11-11
JP2007529101A (ja) 2007-10-18
AU2004234763B2 (en) 2008-07-24
KR101055600B1 (ko) 2011-08-09
KR20060016761A (ko) 2006-02-22
SE526006C2 (sv) 2005-06-14
SE0301238L (sv) 2004-10-30
US7176578B2 (en) 2007-02-13
JP4359657B2 (ja) 2009-11-04
SE0301238D0 (sv) 2003-04-29
CN1781350A (zh) 2006-05-31
US20060071323A1 (en) 2006-04-06
EP1621054A1 (de) 2006-02-01
CN100521876C (zh) 2009-07-29
WO2004098256A1 (en) 2004-11-11

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties