ATE52636T1 - Verfahren zur herstellung integrierter schaltungen unter einbeziehung von schritten zum nachweis von getterstellen. - Google Patents

Verfahren zur herstellung integrierter schaltungen unter einbeziehung von schritten zum nachweis von getterstellen.

Info

Publication number
ATE52636T1
ATE52636T1 AT85307851T AT85307851T ATE52636T1 AT E52636 T1 ATE52636 T1 AT E52636T1 AT 85307851 T AT85307851 T AT 85307851T AT 85307851 T AT85307851 T AT 85307851T AT E52636 T1 ATE52636 T1 AT E52636T1
Authority
AT
Austria
Prior art keywords
fabrication
integrated circuits
processes
circuits including
detection steps
Prior art date
Application number
AT85307851T
Other languages
English (en)
Inventor
Michael Henry Nemiroff
Original Assignee
Unisys Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unisys Corp filed Critical Unisys Corp
Application granted granted Critical
Publication of ATE52636T1 publication Critical patent/ATE52636T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/20—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by using diffraction of the radiation by the materials, e.g. for investigating crystal structure; by using scattering of the radiation by the materials, e.g. for investigating non-crystalline materials; by using reflection of the radiation by the materials
    • G01N23/207—Diffractometry using detectors, e.g. using a probe in a central position and one or more displaceable detectors in circumferential positions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P36/00—Gettering within semiconductor bodies
    • H10P36/03—Gettering within semiconductor bodies within silicon bodies

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Physics & Mathematics (AREA)
  • Immunology (AREA)
  • General Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Bipolar Transistors (AREA)
  • Recrystallisation Techniques (AREA)
  • Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
AT85307851T 1984-11-05 1985-10-30 Verfahren zur herstellung integrierter schaltungen unter einbeziehung von schritten zum nachweis von getterstellen. ATE52636T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/668,512 US4575922A (en) 1984-11-05 1984-11-05 Method of fabricating integrated circuits incorporating steps to detect presence of gettering sites
EP85307851A EP0181737B1 (de) 1984-11-05 1985-10-30 Verfahren zur Herstellung integrierter Schaltungen unter Einbeziehung von Schritten zum Nachweis von Getterstellen

Publications (1)

Publication Number Publication Date
ATE52636T1 true ATE52636T1 (de) 1990-05-15

Family

ID=24682599

Family Applications (1)

Application Number Title Priority Date Filing Date
AT85307851T ATE52636T1 (de) 1984-11-05 1985-10-30 Verfahren zur herstellung integrierter schaltungen unter einbeziehung von schritten zum nachweis von getterstellen.

Country Status (5)

Country Link
US (1) US4575922A (de)
EP (1) EP0181737B1 (de)
JP (1) JPS61174728A (de)
AT (1) ATE52636T1 (de)
DE (1) DE3577622D1 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2597976B2 (ja) * 1985-03-27 1997-04-09 株式会社東芝 半導体装置及びその製造方法
US4777146A (en) * 1987-02-24 1988-10-11 American Telephone And Telegraph Company, At&T Bell Laboratories Fabrication process involving semi-insulating material
US4873555A (en) * 1987-06-08 1989-10-10 University Of Pittsburgh Of The Commonwealth System Of Higher Education Intraband quantum well photodetector and associated method
US5233191A (en) * 1990-04-02 1993-08-03 Hitachi, Ltd. Method and apparatus of inspecting foreign matters during mass production start-up and mass production line in semiconductor production process
US5463459A (en) 1991-04-02 1995-10-31 Hitachi, Ltd. Method and apparatus for analyzing the state of generation of foreign particles in semiconductor fabrication process
US5306345A (en) * 1992-08-25 1994-04-26 Particle Solutions Deposition chamber for deposition of particles on semiconductor wafers
CN1187604C (zh) 1999-03-16 2005-02-02 秦内蒂克有限公司 分析材料成份的方法和装置
US7079975B1 (en) * 2001-04-30 2006-07-18 Advanced Micro Devices, Inc. Scatterometry and acoustic based active control of thin film deposition process

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4021675A (en) * 1973-02-20 1977-05-03 Hughes Aircraft Company System for controlling ion implantation dosage in electronic materials
US4033787A (en) * 1975-10-06 1977-07-05 Honeywell Inc. Fabrication of semiconductor devices utilizing ion implantation
US3984680A (en) * 1975-10-14 1976-10-05 Massachusetts Institute Of Technology Soft X-ray mask alignment system
US4110625A (en) * 1976-12-20 1978-08-29 International Business Machines Corporation Method and apparatus for monitoring the dose of ion implanted into a target by counting emitted X-rays
US4332833A (en) * 1980-02-29 1982-06-01 Bell Telephone Laboratories, Incorporated Method for optical monitoring in materials fabrication
US4392893A (en) * 1980-11-17 1983-07-12 Texas Instruments Incorporated Method for controlling characteristics of a semiconductor integrated by circuit X-ray bombardment

Also Published As

Publication number Publication date
DE3577622D1 (de) 1990-06-13
US4575922A (en) 1986-03-18
EP0181737A3 (en) 1987-05-20
JPH0428140B2 (de) 1992-05-13
EP0181737A2 (de) 1986-05-21
JPS61174728A (ja) 1986-08-06
EP0181737B1 (de) 1990-05-09

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties