ATE526685T1 - Mehrschichtiges halbleitersubstrat und darauf gebildeter bildsensor zur verbesserten infrarotempfindlichkeit - Google Patents

Mehrschichtiges halbleitersubstrat und darauf gebildeter bildsensor zur verbesserten infrarotempfindlichkeit

Info

Publication number
ATE526685T1
ATE526685T1 AT05257881T AT05257881T ATE526685T1 AT E526685 T1 ATE526685 T1 AT E526685T1 AT 05257881 T AT05257881 T AT 05257881T AT 05257881 T AT05257881 T AT 05257881T AT E526685 T1 ATE526685 T1 AT E526685T1
Authority
AT
Austria
Prior art keywords
image sensor
semiconductor substrate
layer semiconductor
infrared sensitivity
improved infrared
Prior art date
Application number
AT05257881T
Other languages
English (en)
Inventor
Howard E Rhodes
Original Assignee
Omnivision Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omnivision Tech Inc filed Critical Omnivision Tech Inc
Application granted granted Critical
Publication of ATE526685T1 publication Critical patent/ATE526685T1/de

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00Constructional details of devices covered by this subclass
    • H10F77/10Semiconductor bodies
    • H10F77/12Active materials
    • H10F77/122Active materials comprising only Group IV materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F30/00Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors
    • H10F30/20Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors
    • H10F30/21Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation
    • H10F30/22Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes
    • H10F30/221Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes the potential barrier being a PN homojunction
    • H10F30/2218Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes the potential barrier being a PN homojunction the devices comprising active layers made of only Group IV-VI materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • H10F39/18Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • H10F39/184Infrared image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/803Pixels having integrated switching, control, storage or amplification elements
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/547Monocrystalline silicon PV cells

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Light Receiving Elements (AREA)
AT05257881T 2005-01-18 2005-12-20 Mehrschichtiges halbleitersubstrat und darauf gebildeter bildsensor zur verbesserten infrarotempfindlichkeit ATE526685T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/038,594 US20060157806A1 (en) 2005-01-18 2005-01-18 Multilayered semiconductor susbtrate and image sensor formed thereon for improved infrared response

Publications (1)

Publication Number Publication Date
ATE526685T1 true ATE526685T1 (de) 2011-10-15

Family

ID=36061375

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05257881T ATE526685T1 (de) 2005-01-18 2005-12-20 Mehrschichtiges halbleitersubstrat und darauf gebildeter bildsensor zur verbesserten infrarotempfindlichkeit

Country Status (5)

Country Link
US (1) US20060157806A1 (de)
EP (1) EP1681722B1 (de)
CN (1) CN1828917B (de)
AT (1) ATE526685T1 (de)
TW (1) TWI305414B (de)

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JP4984634B2 (ja) * 2005-07-21 2012-07-25 ソニー株式会社 物理情報取得方法および物理情報取得装置
US7943471B1 (en) * 2006-05-15 2011-05-17 Globalfoundries Inc. Diode with asymmetric silicon germanium anode
KR101513406B1 (ko) 2006-09-29 2015-04-17 유니버시티 오브 플로리다 리서치 파운데이션, 인크. 적외선 감지 및 표시를 위한 방법 및 장치
US7825465B2 (en) 2007-12-13 2010-11-02 Fairchild Semiconductor Corporation Structure and method for forming field effect transistor with low resistance channel region
CN101459184B (zh) * 2007-12-13 2011-03-23 中芯国际集成电路制造(上海)有限公司 在cmos上感测图像的系统和方法
CN100595934C (zh) * 2008-01-23 2010-03-24 厦门大学 基于虚衬底的硅锗异质结光晶体管
US10636929B2 (en) 2009-04-30 2020-04-28 Massachusetts Institute Of Technology Cross-talk suppression in Geiger-mode avalanche photodiodes
US20110169991A1 (en) * 2010-01-08 2011-07-14 Omnivision Technologies, Inc. Image sensor with epitaxially self-aligned photo sensors
AU2011258475A1 (en) 2010-05-24 2012-11-15 Nanoholdings, Llc Method and apparatus for providing a charge blocking layer on an infrared up-conversion device
CN103733355B (zh) 2011-06-30 2017-02-08 佛罗里达大学研究基金会有限公司 用于检测红外辐射的带有增益的方法和设备
JP2013157367A (ja) * 2012-01-27 2013-08-15 Sony Corp 撮像素子、製造装置および方法、並びに、撮像装置
JP2016513361A (ja) * 2013-01-25 2016-05-12 ユニバーシティー オブ フロリダ リサーチ ファウンデーション,インコーポレイテッドUniversity Of Florida Research Foundation,Inc. 溶液処理法による硫化鉛光検出器を用いた新規の赤外線画像センサー
CN104078472B (zh) * 2013-03-27 2017-02-01 中芯国际集成电路制造(上海)有限公司 Cmos图像传感器及其制造方法
US9153717B2 (en) 2013-08-09 2015-10-06 Taiwan Semiconductor Manufacturing Company, Ltd. Backside illuminated photo-sensitive device with gradated buffer layer
JP6302216B2 (ja) * 2013-11-08 2018-03-28 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
US9806122B2 (en) 2014-07-25 2017-10-31 Omnivision Technologies, Inc. Visible and infrared image sensor
US9748307B2 (en) 2014-11-13 2017-08-29 Artilux Inc. Light absorption apparatus
US9799689B2 (en) 2014-11-13 2017-10-24 Artilux Inc. Light absorption apparatus
JP2016126472A (ja) * 2014-12-26 2016-07-11 株式会社東芝 心拍数検出装置及びそれを用いた顔認識システム
CA2988784A1 (en) 2015-06-11 2017-03-09 University Of Florida Research Foundation, Incorporated Monodisperse, ir-absorbing nanoparticles and related methods and devices
US9859325B2 (en) * 2015-11-13 2018-01-02 Taiwan Semiconductor Manufacturing Co., Ltd. Complementary metal-oxide-semiconductor (CMOS) image sensor with silicon and silicon germanium
FR3111019B1 (fr) * 2020-05-26 2022-07-22 St Microelectronics Crolles 2 Sas Capteur optique intégré à photodiodes pincées
CN218896638U (zh) * 2020-05-26 2023-04-21 意法半导体(克洛尔2)公司 集成光学传感器、成像系统以及电子设备
US20220252725A1 (en) * 2021-02-05 2022-08-11 Artilux, Inc. Lidar Sensor with Dynamic Projection Patterns
CN117083724A (zh) * 2022-03-16 2023-11-17 株式会社光轮 光检测装置

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Also Published As

Publication number Publication date
CN1828917A (zh) 2006-09-06
CN1828917B (zh) 2012-11-21
US20060157806A1 (en) 2006-07-20
EP1681722A2 (de) 2006-07-19
EP1681722A3 (de) 2007-05-30
EP1681722B1 (de) 2011-09-28
TWI305414B (en) 2009-01-11
TW200627635A (en) 2006-08-01

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