ATE528139T1 - VERFAHREN ZUR HERSTELLUNG EINES SUBSTRATS FÜR EINEN FLÜSSIGKEITSAUSSTOßKOPF - Google Patents

VERFAHREN ZUR HERSTELLUNG EINES SUBSTRATS FÜR EINEN FLÜSSIGKEITSAUSSTOßKOPF

Info

Publication number: ATE528139T1
Authority: AT; Austria
Prior art keywords: substrate; layer; silicon; silicon substrate; discharge head
Prior art date: 2009-02-26

Application number

AT10154893T

Other languages

English (en)

Inventor

Keiji Matsumoto

Shuji Koyama

Hiroyuki Abo

Keiji Watanabe

Original Assignee

Canon Kk

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2009-02-26

Filing date

2010-02-26

Publication date

2011-10-15

2010-02-26 Application filed by Canon Kk filed Critical Canon Kk

2011-10-15 Application granted granted Critical

2011-10-15 Publication of ATE528139T1 publication Critical patent/ATE528139T1/de

Links

239000000758 substrate Substances 0.000 title abstract 7
239000007788 liquid Substances 0.000 title abstract 3
238000004519 manufacturing process Methods 0.000 title abstract 2
XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 8
229910052710 silicon Inorganic materials 0.000 abstract 8
239000010703 silicon Substances 0.000 abstract 8
238000001039 wet etching Methods 0.000 abstract 1

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1629—Manufacturing processes etching wet etching
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1603—Production of bubble jet print heads of the front shooter type
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
- B41J2/1634—Manufacturing processes machining laser machining

Landscapes

Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Physics & Mathematics (AREA)
Optics & Photonics (AREA)
Particle Formation And Scattering Control In Inkjet Printers (AREA)

AT10154893T 2009-02-26 2010-02-26 VERFAHREN ZUR HERSTELLUNG EINES SUBSTRATS FÜR EINEN FLÜSSIGKEITSAUSSTOßKOPF ATE528139T1 (de)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2009044111		2009-02-26
JP2009285779		2009-12-16

Publications (1)

Publication Number	Publication Date
ATE528139T1 true ATE528139T1 (de)	2011-10-15

Family

ID=42236572

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
AT10154893T ATE528139T1 (de)	2009-02-26	2010-02-26	VERFAHREN ZUR HERSTELLUNG EINES SUBSTRATS FÜR EINEN FLÜSSIGKEITSAUSSTOßKOPF

Country Status (6)

Country	Link
US (1)	US8377828B2 (de)
EP (1)	EP2223807B1 (de)
JP (1)	JP5566130B2 (de)
CN (1)	CN101817257B (de)
AT (1)	ATE528139T1 (de)
RU (1)	RU2417152C1 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US7824560B2 (en) *	2006-03-07	2010-11-02	Canon Kabushiki Kaisha	Manufacturing method for ink jet recording head chip, and manufacturing method for ink jet recording head
CN102159395B (zh)	2008-08-19	2014-09-10	琳得科株式会社	成型制品、其制备方法、电子设备构件以及电子设备
JP5704610B2 (ja)	2009-05-22	2015-04-22	リンテック株式会社	成形体、その製造方法、電子デバイス用部材および電子デバイス
JP4659898B2 (ja)	2009-09-02	2011-03-30	キヤノン株式会社	液体吐出ヘッド用基板の製造方法
JP5697230B2 (ja)	2010-03-31	2015-04-08	リンテック株式会社	成形体、その製造方法、電子デバイス用部材及び電子デバイス
WO2011122497A1 (ja) *	2010-03-31	2011-10-06	リンテック株式会社	透明導電性フィルムおよびその製造方法並びに透明導電性フィルムを用いた電子デバイス
JP5750441B2 (ja) *	2010-08-20	2015-07-22	リンテック株式会社	成形体、その製造方法、電子デバイス用部材及び電子デバイス
US8435805B2 (en)	2010-09-06	2013-05-07	Canon Kabushiki Kaisha	Method of manufacturing a substrate for liquid ejection head
CN103154172B (zh) *	2010-09-07	2014-12-10	琳得科株式会社	粘着片以及电子设备
JP2013230589A (ja) *	2012-04-27	2013-11-14	Canon Inc	液体吐出ヘッドの製造方法
JP2013244654A (ja) *	2012-05-25	2013-12-09	Canon Inc	インクジェットヘッド基板の加工方法
JP6456158B2 (ja) *	2015-01-20	2019-01-23	キヤノン株式会社	記録素子基板、およびその製造方法
JP6504939B2 (ja) *	2015-06-26	2019-04-24	キヤノン株式会社	シリコン基板の加工方法及び液体吐出ヘッド用基板の製造方法
JP6873836B2 (ja) *	2017-06-19	2021-05-19	キヤノン株式会社	液体吐出ヘッドの製造方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP3143307B2 (ja) *	1993-02-03	2001-03-07	キヤノン株式会社	インクジェット記録ヘッドの製造方法
JPH06320730A (ja) *	1993-05-17	1994-11-22	Ricoh Co Ltd	サーマルインクジェットヘッド
RU2151066C1 (ru) *	1998-11-03	2000-06-20	Самсунг Электроникс Ко., Лтд.	Узел пластины сопла микроинжектора и способ его изготовления
US6720522B2 (en) *	2000-10-26	2004-04-13	Kabushiki Kaisha Toshiba	Apparatus and method for laser beam machining, and method for manufacturing semiconductor devices using laser beam machining
JP2002240293A (ja) *	2001-02-14	2002-08-28	Fuji Xerox Co Ltd	液滴噴射記録装置およびシリコン構造体の製造方法
JP4217434B2 (ja)	2002-07-04	2009-02-04	キヤノン株式会社	スルーホールの形成方法及びこれを用いたインクジェットヘッド
JP2004140196A (ja) *	2002-10-17	2004-05-13	Nec Electronics Corp	半導体装置の製造方法および基板洗浄装置
JP3998254B2 (ja) *	2003-02-07	2007-10-24	キヤノン株式会社	インクジェットヘッドの製造方法
CN100581824C (zh) *	2003-02-13	2010-01-20	佳能株式会社	喷墨记录喷头用基板的制造方法
JP3962713B2 (ja) *	2003-09-30	2007-08-22	キヤノン株式会社	アライメントマークの形成方法、およびデバイスが構成される基板
JP4522086B2 (ja) *	2003-12-15	2010-08-11	キヤノン株式会社	梁、梁の製造方法、梁を備えたインクジェット記録ヘッド、および該インクジェット記録ヘッドの製造方法
JP4480132B2 (ja) *	2004-02-18	2010-06-16	キヤノン株式会社	液体吐出用ヘッドの製造方法
JP2007137015A (ja) *	2005-11-22	2007-06-07	Seiko Epson Corp	液滴吐出ヘッド、液滴吐出装置、液滴吐出ヘッドの製造方法、及び液滴吐出装置の製造方法
US7824560B2 (en) *	2006-03-07	2010-11-02	Canon Kabushiki Kaisha	Manufacturing method for ink jet recording head chip, and manufacturing method for ink jet recording head
JP4854336B2 (ja) *	2006-03-07	2012-01-18	キヤノン株式会社	インクジェットヘッド用基板の製造方法
JP5028112B2 (ja) *	2006-03-07	2012-09-19	キヤノン株式会社	インクジェットヘッド用基板の製造方法およびインクジェットヘッド
JP4182360B2 (ja) *	2006-06-05	2008-11-19	セイコーエプソン株式会社	液体噴射ヘッド及び液体噴射装置

2010
- 2010-02-19 JP JP2010034693A patent/JP5566130B2/ja active Active
- 2010-02-22 US US12/709,544 patent/US8377828B2/en active Active
- 2010-02-25 CN CN2010101229999A patent/CN101817257B/zh active Active
- 2010-02-25 RU RU2010107094/12A patent/RU2417152C1/ru not_active IP Right Cessation
- 2010-02-26 EP EP10154893A patent/EP2223807B1/de active Active
- 2010-02-26 AT AT10154893T patent/ATE528139T1/de not_active IP Right Cessation

Also Published As

Publication number	Publication date
US20100216264A1 (en)	2010-08-26
JP5566130B2 (ja)	2014-08-06
US8377828B2 (en)	2013-02-19
CN101817257A (zh)	2010-09-01
RU2417152C1 (ru)	2011-04-27
CN101817257B (zh)	2013-07-10
EP2223807B1 (de)	2011-10-12
EP2223807A1 (de)	2010-09-01
JP2011143701A (ja)	2011-07-28

Legal Events

Date	Code	Title	Description
2012-04-15	RER	Ceased as to paragraph 5 lit. 3 law introducing patent treaties

Publication	Publication Date	Title
ATE528139T1 (de)	2011-10-15	VERFAHREN ZUR HERSTELLUNG EINES SUBSTRATS FÜR EINEN FLÜSSIGKEITSAUSSTOßKOPF
EP1884989A3 (de)	2008-07-23	Halbleiterbauelement und Herstellungsverfahren dafür
WO2010065252A3 (en)	2010-08-12	Methods of fabricating substrates
ATE555643T1 (de)	2012-05-15	Verfahren zur bildung eines strukturierten substrats
WO2009057764A1 (ja)	2009-05-07	エッチング方法およびそれを用いた光／電子デバイスの製造方法
WO2011056783A3 (en)	2011-07-28	Etching process for semiconductors
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MY147106A (en)	2012-10-31	Method for manufacturing epitaxial wafer
ATE484609T1 (de)	2010-10-15	Verfahren zur herstellung einer funktionsschicht
WO2006095566A8 (en)	2009-08-27	Nitride semiconductor light-emitting device and method for fabrication thereof
WO2009140094A3 (en)	2010-01-28	Method for critical dimension shrink using conformal pecvd films
SG178564A1 (en)	2012-04-27	Selective silicon etch process
GB201223188D0 (en)	2013-02-06	Etched silicon structures, method of forming etched silicon structures and uses thereof
WO2008045544A3 (en)	2008-07-03	Patterning methods
GB2420443B (en)	2009-09-16	Increasing die strength by etching during or after dicing
MY148726A (en)	2013-05-31	Method for etching single wafer
ATE521993T1 (de)	2011-09-15	Ätzen von substraten für lichtemittierende bauelemente
TW200733225A (en)	2007-09-01	Method for forming fine pattern of semiconductor device
JP2013028104A5 (de)	2014-09-11
ATE548761T1 (de)	2012-03-15	Verfahren zur selektiven dotierung von silizium
CN103723927A (zh)	2014-04-16	具波浪形表面的玻璃基板的制造方法
WO2010017934A3 (en)	2010-09-23	Method for transferring nanostructures into a substrate
WO2009072406A1 (ja)	2009-06-11	シリコンウェーハ洗浄方法およびその装置
WO2009072631A1 (ja)	2009-06-11	窒化物半導体素子の製造方法および窒化物半導体素子
TW200644099A (en)	2006-12-16	Method of segmenting a wafer